CN1153855C - 用于调节电解液中的金属离子浓度的方法与装置 - Google Patents

用于调节电解液中的金属离子浓度的方法与装置 Download PDF

Info

Publication number
CN1153855C
CN1153855C CNB988082497A CN98808249A CN1153855C CN 1153855 C CN1153855 C CN 1153855C CN B988082497 A CNB988082497 A CN B988082497A CN 98808249 A CN98808249 A CN 98808249A CN 1153855 C CN1153855 C CN 1153855C
Authority
CN
China
Prior art keywords
assisted electrolysis
electrolysis pond
electrolytic solution
anode
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB988082497A
Other languages
English (en)
Chinese (zh)
Other versions
CN1267342A (zh
Inventor
��-��ˡ��Ჩ��
延斯－埃里克·盖斯勒
-�˵¡�Τϣ�ض�
拉尔夫－彼德·韦希特尔
洛伦茨·科普
�¡�ë�׶�
曼弗雷德·毛雷尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Atotech Deutschland GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland GmbH and Co KG filed Critical Atotech Deutschland GmbH and Co KG
Publication of CN1267342A publication Critical patent/CN1267342A/zh
Application granted granted Critical
Publication of CN1153855C publication Critical patent/CN1153855C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
CNB988082497A 1997-08-21 1998-08-19 用于调节电解液中的金属离子浓度的方法与装置 Expired - Lifetime CN1153855C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19736350A DE19736350C1 (de) 1997-08-21 1997-08-21 Verfahren zur Konzentrationsregulierung von Stoffen in Elektrolyten und Vorrichtung zur Durchführung des Verfahrens
DE19736350.4 1997-08-21

Publications (2)

Publication Number Publication Date
CN1267342A CN1267342A (zh) 2000-09-20
CN1153855C true CN1153855C (zh) 2004-06-16

Family

ID=7839696

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB988082497A Expired - Lifetime CN1153855C (zh) 1997-08-21 1998-08-19 用于调节电解液中的金属离子浓度的方法与装置

Country Status (12)

Country Link
US (1) US6350362B1 (de)
EP (1) EP1015667B1 (de)
JP (1) JP4154121B2 (de)
KR (1) KR100558129B1 (de)
CN (1) CN1153855C (de)
AT (1) ATE214745T1 (de)
CA (1) CA2301299A1 (de)
DE (2) DE19736350C1 (de)
ES (1) ES2172926T3 (de)
HK (1) HK1028427A1 (de)
TW (1) TW512188B (de)
WO (1) WO1999010564A2 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10013339C1 (de) * 2000-03-17 2001-06-13 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum Regulieren der Konzentration von Metallionen in einer Elektrolytflüssigkeit sowie Anwendung des Verfahrens und Verwendung der Vorrichtung
JP3860111B2 (ja) * 2002-12-19 2006-12-20 大日本スクリーン製造株式会社 メッキ装置およびメッキ方法
DE10314279A1 (de) * 2003-03-29 2004-10-14 Daimlerchrysler Ag Verfahren und Vorrichtung zum Steuern mindestens einer Betriebsgröße eines elektrolytischen Bades
US7837841B2 (en) * 2007-03-15 2010-11-23 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatuses for electrochemical deposition, conductive layer, and fabrication methods thereof
JP4957906B2 (ja) * 2007-07-27 2012-06-20 上村工業株式会社 連続電気銅めっき方法
JP5110269B2 (ja) * 2007-08-09 2012-12-26 上村工業株式会社 電気銅めっき方法
DE102009060676B4 (de) * 2009-12-28 2015-07-23 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum nasschemischen Behandeln von Behandlungsgut
DE102017216710A1 (de) * 2017-09-21 2019-03-21 Siemens Aktiengesellschaft Elektrolyseuranordnung
CN114277392B (zh) * 2021-12-23 2023-10-24 四川大学华西医院 一种具有离子陷阱的电解装置、电解方法和电镀方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE215589C (de)
DD215589B5 (de) * 1983-05-11 1994-06-01 Heinz Dr Rer Nat Liebscher Verfahren zur elektrolytischen Metallabscheidung bei erzwungener Konvektion
DE4344387C2 (de) * 1993-12-24 1996-09-05 Atotech Deutschland Gmbh Verfahren zur elektrolytischen Abscheidung von Kupfer und Anordnung zur Durchführung des Verfahrens
DE19545231A1 (de) * 1995-11-21 1997-05-22 Atotech Deutschland Gmbh Verfahren zur elektrolytischen Abscheidung von Metallschichten

Also Published As

Publication number Publication date
KR20010023153A (ko) 2001-03-26
CN1267342A (zh) 2000-09-20
ES2172926T3 (es) 2002-10-01
TW512188B (en) 2002-12-01
WO1999010564A2 (de) 1999-03-04
DE59803457D1 (de) 2002-04-25
HK1028427A1 (en) 2001-02-16
EP1015667B1 (de) 2002-03-20
EP1015667A2 (de) 2000-07-05
US6350362B1 (en) 2002-02-26
CA2301299A1 (en) 1999-03-04
JP4154121B2 (ja) 2008-09-24
DE19736350C1 (de) 1999-08-05
WO1999010564A3 (de) 1999-08-05
KR100558129B1 (ko) 2006-03-10
ATE214745T1 (de) 2002-04-15
JP2001514330A (ja) 2001-09-11

Similar Documents

Publication Publication Date Title
CN101768742B (zh) 一种再生酸性蚀刻液和回收铜的方法及其专用装置
KR100740817B1 (ko) 전해질 내의 금속 이온 농도의 조절 방법 및 장치, 및그의 용도
CN1153855C (zh) 用于调节电解液中的金属离子浓度的方法与装置
US4906340A (en) Process for electroplating metals
CN100413999C (zh) 再生用于蚀刻或酸蚀铜或铜合金的含铁蚀刻溶液的方法和进行所述方法的装置
CN109666952B (zh) 一种电沉积生产金属银的方法
USRE34191E (en) Process for electroplating metals
US5372683A (en) Method and apparatus for the electrolytic extraction of metals from a solution containing metal ions
JPH09509222A (ja) プロセス有機物で電解液から金属を電解的に析出する方法
US7658833B2 (en) Method for copper electrowinning in hydrochloric solution
JP2004059948A (ja) 金属溶解液からの金属回収方法およびその装置
CN103422150A (zh) 用于电镀的重金属离子浓度调节槽及电镀装置
JP2005270779A (ja) 重金属の分離方法および分離装置
JP3316606B2 (ja) 錫めっき装置および錫めっき方法
JPH0820899A (ja) 錫めっき装置および錫めっき方法
CN115976578A (zh) 一种湿法回收金属的阴膜填充床电极反应器及其回收方法
KR100297955B1 (ko) 폐산염화제이구리부식제를재생시키는장치및방법
CN1174251A (zh) 分离式二次元电镀法
CN202705553U (zh) 一种重金属离子浓度调节槽
Yopps Electrolytic Refining of Copper by the Series System
Hine et al. Electrorefining and Electrodeposition of Metals
Chmielewski et al. THE STUDY OF METAL ELECTROLYSIS WITH FLUIDIZED BED OFINERTBEADS
JP2005219001A (ja) 電解法によるシアン化合物除去方法とその装置
CN103422148A (zh) 一种重金属离子浓度调节槽

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20040616