JP4150245B2 - 発光素子収納用パッケージおよび発光装置 - Google Patents

発光素子収納用パッケージおよび発光装置 Download PDF

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Publication number
JP4150245B2
JP4150245B2 JP2002344731A JP2002344731A JP4150245B2 JP 4150245 B2 JP4150245 B2 JP 4150245B2 JP 2002344731 A JP2002344731 A JP 2002344731A JP 2002344731 A JP2002344731 A JP 2002344731A JP 4150245 B2 JP4150245 B2 JP 4150245B2
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JP
Japan
Prior art keywords
light emitting
emitting element
recess
light
concave portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2002344731A
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English (en)
Japanese (ja)
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JP2004179438A (ja
JP2004179438A5 (enrdf_load_stackoverflow
Inventor
義紀 前川
執蔵 中島
孝雄 厚地
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP2002344731A priority Critical patent/JP4150245B2/ja
Publication of JP2004179438A publication Critical patent/JP2004179438A/ja
Publication of JP2004179438A5 publication Critical patent/JP2004179438A5/ja
Application granted granted Critical
Publication of JP4150245B2 publication Critical patent/JP4150245B2/ja
Anticipated expiration legal-status Critical
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
JP2002344731A 2002-11-27 2002-11-27 発光素子収納用パッケージおよび発光装置 Expired - Fee Related JP4150245B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002344731A JP4150245B2 (ja) 2002-11-27 2002-11-27 発光素子収納用パッケージおよび発光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002344731A JP4150245B2 (ja) 2002-11-27 2002-11-27 発光素子収納用パッケージおよび発光装置

Publications (3)

Publication Number Publication Date
JP2004179438A JP2004179438A (ja) 2004-06-24
JP2004179438A5 JP2004179438A5 (enrdf_load_stackoverflow) 2005-10-20
JP4150245B2 true JP4150245B2 (ja) 2008-09-17

Family

ID=32706089

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002344731A Expired - Fee Related JP4150245B2 (ja) 2002-11-27 2002-11-27 発光素子収納用パッケージおよび発光装置

Country Status (1)

Country Link
JP (1) JP4150245B2 (enrdf_load_stackoverflow)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006066409A (ja) * 2004-07-28 2006-03-09 Kyocera Corp 発光素子用配線基板および発光装置ならびに発光素子用配線基板の製造方法
JP4501109B2 (ja) * 2004-06-25 2010-07-14 日亜化学工業株式会社 発光装置
JP4574248B2 (ja) * 2004-06-28 2010-11-04 京セラ株式会社 発光装置およびそれを用いた照明装置
DE102004045950A1 (de) * 2004-09-22 2006-03-30 Osram Opto Semiconductors Gmbh Gehäuse für ein optoelektronisches Bauelement, optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements
JP2007142290A (ja) * 2005-11-21 2007-06-07 Sharp Corp 発光装置
KR101318972B1 (ko) 2007-03-30 2013-10-17 서울반도체 주식회사 발광 다이오드 패키지 및 그 제조 방법
JP5383346B2 (ja) * 2009-06-25 2014-01-08 京セラ株式会社 発光素子搭載用パッケージおよび発光装置
JP2011054736A (ja) * 2009-09-01 2011-03-17 Sharp Corp 発光装置、平面光源および液晶表示装置
KR101055081B1 (ko) * 2010-01-15 2011-08-08 엘지이노텍 주식회사 발광 소자, 발광 소자 제조방법 및 백라이트 유닛
KR101298406B1 (ko) 2010-05-17 2013-08-20 엘지이노텍 주식회사 발광소자
JP2015216153A (ja) * 2014-05-08 2015-12-03 日亜化学工業株式会社 発光装置
JP6294419B2 (ja) * 2016-09-01 2018-03-14 日機装株式会社 光半導体装置および光半導体装置の製造方法

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Publication number Publication date
JP2004179438A (ja) 2004-06-24

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