JP4149891B2 - コンデンサとコンデンサ内蔵回路基板、ならびにそれらの製造方法 - Google Patents

コンデンサとコンデンサ内蔵回路基板、ならびにそれらの製造方法 Download PDF

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Publication number
JP4149891B2
JP4149891B2 JP2003350842A JP2003350842A JP4149891B2 JP 4149891 B2 JP4149891 B2 JP 4149891B2 JP 2003350842 A JP2003350842 A JP 2003350842A JP 2003350842 A JP2003350842 A JP 2003350842A JP 4149891 B2 JP4149891 B2 JP 4149891B2
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JP
Japan
Prior art keywords
electrolytic capacitor
conductive
capacitor
metal body
valve metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003350842A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004221534A (ja
JP2004221534A5 (enExample
Inventor
浩一 平野
雅憲 吉田
浩之 半田
嘉久 山下
誠一 中谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2003350842A priority Critical patent/JP4149891B2/ja
Publication of JP2004221534A publication Critical patent/JP2004221534A/ja
Publication of JP2004221534A5 publication Critical patent/JP2004221534A5/ja
Application granted granted Critical
Publication of JP4149891B2 publication Critical patent/JP4149891B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/008—Terminals
    • H01G9/012—Terminals specially adapted for solid capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4679—Aligning added circuit layers or via connections relative to previous circuit layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2003350842A 2002-12-27 2003-10-09 コンデンサとコンデンサ内蔵回路基板、ならびにそれらの製造方法 Expired - Fee Related JP4149891B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003350842A JP4149891B2 (ja) 2002-12-27 2003-10-09 コンデンサとコンデンサ内蔵回路基板、ならびにそれらの製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002379231 2002-12-27
JP2003350842A JP4149891B2 (ja) 2002-12-27 2003-10-09 コンデンサとコンデンサ内蔵回路基板、ならびにそれらの製造方法

Publications (3)

Publication Number Publication Date
JP2004221534A JP2004221534A (ja) 2004-08-05
JP2004221534A5 JP2004221534A5 (enExample) 2006-07-06
JP4149891B2 true JP4149891B2 (ja) 2008-09-17

Family

ID=32911234

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003350842A Expired - Fee Related JP4149891B2 (ja) 2002-12-27 2003-10-09 コンデンサとコンデンサ内蔵回路基板、ならびにそれらの製造方法

Country Status (1)

Country Link
JP (1) JP4149891B2 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4599997B2 (ja) * 2004-11-08 2010-12-15 凸版印刷株式会社 固体電解コンデンサを内蔵した配線基板の製造方法
JP4736451B2 (ja) * 2005-02-03 2011-07-27 パナソニック株式会社 多層配線基板とその製造方法、および多層配線基板を用いた半導体パッケージと電子機器
KR101127380B1 (ko) * 2005-05-18 2012-03-29 사가 산요 고교 가부시키가이샤 적층형 고체 전해 컨덴서 및 그 제조 방법
JP4839824B2 (ja) * 2005-12-21 2011-12-21 パナソニック株式会社 コンデンサ内蔵基板およびその製造方法
JP2007201065A (ja) * 2006-01-25 2007-08-09 Hitachi Aic Inc コンデンサ内蔵基板
JP5003226B2 (ja) * 2007-03-20 2012-08-15 日本電気株式会社 電解コンデンサシート及び配線基板、並びに、それらの製造方法
JP4812118B2 (ja) 2007-03-23 2011-11-09 Ｎｅｃトーキン株式会社 固体電解コンデンサ及びその製造方法
JP5211777B2 (ja) * 2008-03-17 2013-06-12 富士通株式会社 電解キャパシタ及びその製造方法並びに配線基板
JP6988919B2 (ja) 2017-12-27 2022-01-05 株式会社村田製作所 半導体複合装置およびそれに用いられるパッケージ基板
CN114868216B (zh) * 2019-12-25 2025-02-25 松下知识产权经营株式会社 电容器元件及电解电容器、以及它们的制造方法
JP7697852B2 (ja) * 2021-09-16 2025-06-24 パナソニックホールディングス株式会社 固体電解コンデンサ

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