JP4143623B2 - テープ貼付装置 - Google Patents

テープ貼付装置 Download PDF

Info

Publication number
JP4143623B2
JP4143623B2 JP2005127355A JP2005127355A JP4143623B2 JP 4143623 B2 JP4143623 B2 JP 4143623B2 JP 2005127355 A JP2005127355 A JP 2005127355A JP 2005127355 A JP2005127355 A JP 2005127355A JP 4143623 B2 JP4143623 B2 JP 4143623B2
Authority
JP
Japan
Prior art keywords
tape
elastic sheet
wafer
vacuum
rubber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2005127355A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006310338A (ja
JP2006310338A5 (enExample
Inventor
洋一郎 多賀
智美 堀川
秀美 菅野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Engineering Ltd
Original Assignee
NEC Engineering Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Engineering Ltd filed Critical NEC Engineering Ltd
Priority to JP2005127355A priority Critical patent/JP4143623B2/ja
Publication of JP2006310338A publication Critical patent/JP2006310338A/ja
Publication of JP2006310338A5 publication Critical patent/JP2006310338A5/ja
Application granted granted Critical
Publication of JP4143623B2 publication Critical patent/JP4143623B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Landscapes

  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2005127355A 2005-04-26 2005-04-26 テープ貼付装置 Expired - Lifetime JP4143623B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005127355A JP4143623B2 (ja) 2005-04-26 2005-04-26 テープ貼付装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005127355A JP4143623B2 (ja) 2005-04-26 2005-04-26 テープ貼付装置

Publications (3)

Publication Number Publication Date
JP2006310338A JP2006310338A (ja) 2006-11-09
JP2006310338A5 JP2006310338A5 (enExample) 2008-04-10
JP4143623B2 true JP4143623B2 (ja) 2008-09-03

Family

ID=37476928

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005127355A Expired - Lifetime JP4143623B2 (ja) 2005-04-26 2005-04-26 テープ貼付装置

Country Status (1)

Country Link
JP (1) JP4143623B2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4812131B2 (ja) * 2008-04-18 2011-11-09 Ｎｅｃエンジニアリング株式会社 基板貼り合わせ装置
JP4723614B2 (ja) * 2008-06-06 2011-07-13 リンテック株式会社 シート貼付装置及び貼付方法
WO2010077597A2 (en) 2008-12-08 2010-07-08 Fujifilm Dimatix, Inc. Wafer taping
JP5649125B2 (ja) * 2011-07-01 2015-01-07 Ｎｅｃエンジニアリング株式会社 テープ貼付装置
JP5792590B2 (ja) * 2011-10-31 2015-10-14 リンテック株式会社 シート貼付装置
JP6388331B2 (ja) * 2014-07-14 2018-09-12 Ｎｅｃプラットフォームズ株式会社 テープ貼付装置及びテープ貼付治具
KR102221703B1 (ko) * 2019-04-19 2021-03-02 세메스 주식회사 다이 이젝터 및 이를 포함하는 다이 픽업 장치
WO2020235102A1 (ja) * 2019-05-23 2020-11-26 三菱電機株式会社 ダイシングテープの貼付方法

Also Published As

Publication number Publication date
JP2006310338A (ja) 2006-11-09

Similar Documents

Publication Publication Date Title
KR101744371B1 (ko) 시트 부착 장치 및 부착 방법
KR101747485B1 (ko) 시트 부착 장치 및 부착 방법
KR101832016B1 (ko) 시트 부착 장치 및 부착 방법
JP2004153159A (ja) 半導体ウェハの保護部材貼着方法及びその装置
US20150279716A1 (en) Apparatus and method for detaching chip
CN110802509B (zh) 保护部件形成装置
CN101802999A (zh) 固定夹具以及工件的处理方法
KR100217889B1 (ko) 반도체 웨이퍼를 테이프로 보호하면서 다이싱하는 공정을 포함하는 반도체 장치의 제조방법
JP4814284B2 (ja) テープ貼付装置
JP4143623B2 (ja) テープ貼付装置
JP5337620B2 (ja) ワーク粘着保持装置及び真空貼り合わせ機
JP4221271B2 (ja) テープ貼付装置
US20130264836A1 (en) Semiconductor Die Collet and Method
JP4143488B2 (ja) テープ貼付装置
JP2008066684A (ja) ダイシングフレームへの基板のマウント装置
JP4152295B2 (ja) テープ貼付装置
JP6634231B2 (ja) 支持チャック及び基板処理装置
JP4812131B2 (ja) 基板貼り合わせ装置
JP4797027B2 (ja) 基板体の貼着装置及び基板体の取り扱い方法
JP2012038880A (ja) シート貼付装置及び貼付方法
JP5551418B2 (ja) シート貼付装置およびシート貼付方法
JP5530203B2 (ja) シート貼付装置およびシート貼付方法
JP5329916B2 (ja) 半導体ウエハの支持具
JP2009060039A (ja) 半導体ウエハ等の板状部材の保護シート剥離用接着テープの取り付け方法及び保護シート剥離方法
JP2003124153A (ja) ダイサーシート貼り付け方法

Legal Events

Date Code Title Description
RD01 Notification of change of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7421

Effective date: 20070129

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20070515

RD01 Notification of change of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7421

Effective date: 20080125

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080226

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20080226

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20080314

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20080318

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080516

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20080609

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20080616

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110620

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 4143623

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120620

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120620

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130620

Year of fee payment: 5

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313111

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

EXPY Cancellation because of completion of term