JP6634231B2 - 支持チャック及び基板処理装置 - Google Patents
支持チャック及び基板処理装置 Download PDFInfo
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- JP6634231B2 JP6634231B2 JP2015134981A JP2015134981A JP6634231B2 JP 6634231 B2 JP6634231 B2 JP 6634231B2 JP 2015134981 A JP2015134981 A JP 2015134981A JP 2015134981 A JP2015134981 A JP 2015134981A JP 6634231 B2 JP6634231 B2 JP 6634231B2
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- support
- attached
- substrate
- elastic member
- elastic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1306—Details
- G02F1/1309—Repairing; Testing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
- H01L21/67309—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by the substrate support
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
- G02F2201/54—Arrangements for reducing warping-twist
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Electroluminescent Light Sources (AREA)
Description
200:上部支持台
500:リフト部材
600:支持チャック
610a:上部部分空間
610b:下部部分空間
620:胴体
630:伸縮部材
650:粘着部材
660:シャワーヘッド
Claims (14)
- 基板を支持する支持チャックであって、
内部空間を有する胴体と、
前記内部空間を前記胴体の厚手方向に画成し、画成された部分空間に注入されるガスにより前記胴体の厚手方向に可動となるように前記胴体内に取り付けられる伸縮部材と、
前記胴体の一方の面を前記胴体の厚手方向に貫通して前記伸縮部材に取り付けられる複数の可動部材と、
前記胴体の外側を向く前記可動部材の端部に取り付けられる粘着部材と、
前記部分空間のうちの少なくとも一つに前記胴体の厚手方向にガスを注入して、前記伸縮部材に均一な力が加えられるように前記胴体内に取り付けられるシャワーヘッドと、
を備え、
前記伸縮部材により、前記各可動部材が互いに同じ高さを維持しながら前記胴体の厚手方向に移動する支持チャック。 - 前記部分空間のうちの少なくとも一つに取り付けられ、一方の端部が前記伸縮部材に連結される緩衝部材を備える請求項1に記載の支持チャック。
- 前記胴体の一方の面には貫通口及び真空孔が配設され、
前記粘着部材は前記貫通口内に位置する請求項1に記載の支持チャック。 - 前記胴体の外側に露出する前記粘着部材の粘着面は、前記部分空間に選択的に注入されるガスにより前記貫通口内に位置するか、又は前記胴体の一方の面と並ぶように位置する請求項3に記載の支持チャック。
- 前記粘着部材及び前記可動部材の前記端部のうちの少なくとも一方と前記貫通口との間を封止するように前記貫通口に取り付けられる封止部材を備える請求項3に記載の支持チャック。
- 前記伸縮部材は、
前記内部空間を画成するように前記胴体内に取り付けられる弾性膜と、
前記弾性膜の変形により前記胴体の厚手方向に可動となるように前記弾性膜の少なくとも一方の面に取り付けられる補強板と、
を備える請求項1に記載の支持チャック。 - 前記緩衝部材は、
前記伸縮部材を向く方向に前記胴体内に取り付けられるガイド部材と、
前記ガイド部材の外側に設けられ、一方の端部が前記伸縮部材に連結され、他方の端部が前記胴体に連結される弾性部材と、
を備える請求項2に記載の支持チャック。 - 基板処理空間を有するチャンバと、
前記チャンバ内に配置される上部支持台と、
前記上部支持台と向かい合うように配置される下部支持台と、
前記上部支持台及び前記下部支持台のうちの少なくとも一方の支持台に取り付けられ、内部に互いに画成される部分空間を有する支持チャックと、
を備え、
前記支持チャックは、
内部空間を有する胴体と、
前記内部空間を前記胴体の厚手方向に画成し、画成された部分空間に注入されるガスにより前記胴体の厚手方向に可動となるように前記胴体内に取り付けられる伸縮部材と、
前記伸縮部材に取り付けられ、少なくとも一方の端部が前記胴体の外面に嵌入する複数の可動部材と、
前記各可動部材の端部に取り付けられ、前記部分空間に選択的に注入されるガスにより前記支持チャックの外側又は内側の方向に可動となる粘着部材と、
前記部分空間のうちの少なくとも一つに前記胴体の厚手方向にガスを注入して、前記伸縮部材に均一な力が加えられるように前記胴体内に取り付けられるシャワーヘッドと、
を備え、
前記伸縮部材により、前記各可動部材が互いに同じ高さを維持しながら前記胴体の厚手方向に移動する基板処理装置。 - 前記支持チャックは複数配設され、前記上部支持台の下面及び前記下部支持台の上面のうちの少なくとも一方に形成される複数の領域別にそれぞれ取り付けられる請求項8に記載の基板処理装置。
- 前記支持チャックは、前記伸縮部材を向く方向に前記胴体内に取り付けられて前記伸縮部材を接触支持する緩衝部材と、前記部分空間にそれぞれガスを注入する配管と、を備える請求項8に記載の基板処理装置。
- 前記胴体の一方の面には貫通口及び真空孔が配設され、
前記粘着部材は、前記貫通口を介して可動となるように前記胴体の外側を向く前記可動部材の端部に取着される請求項8に記載の基板処理装置。 - 前記伸縮部材は、前記内部空間を前記胴体の厚手方向に画成するように前記胴体内に取り付けられる弾性膜と、前記弾性膜の少なくとも一方の面に取り付けられる補強板と、を備える請求項8に記載の基板処理装置。
- 前記緩衝部材は、前記部分空間のうちの少なくとも一つに前記伸縮部材を向く方向に取り付けられ、前記伸縮部材を向く一方の端部が前記伸縮部材から離れるガイド部材と、前記ガイド部材の外側に設けられ、一方の端部が前記胴体に連結支持され、他方の端部が前記伸縮部材に連結支持される弾性部材と、を備える請求項10に記載の基板処理装置。
- 前記貫通口と前記粘着部材の外周面との間を封止するように前記貫通口の一方の端部には封止部材が取り付けられる請求項11に記載の基板処理装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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KR10-2014-0084578 | 2014-07-07 | ||
KR1020140084578A KR101838681B1 (ko) | 2014-07-07 | 2014-07-07 | 지지척 및 기판 처리 장치 |
Publications (2)
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JP2016018996A JP2016018996A (ja) | 2016-02-01 |
JP6634231B2 true JP6634231B2 (ja) | 2020-01-22 |
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JP2015134981A Expired - Fee Related JP6634231B2 (ja) | 2014-07-07 | 2015-07-06 | 支持チャック及び基板処理装置 |
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JP (1) | JP6634231B2 (ja) |
KR (1) | KR101838681B1 (ja) |
CN (1) | CN105244306A (ja) |
TW (1) | TWI662651B (ja) |
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KR102336572B1 (ko) * | 2015-01-23 | 2021-12-08 | 삼성디스플레이 주식회사 | 기판 탈착 장치 및 이를 이용한 표시장치의 제조 방법 |
KR102674847B1 (ko) * | 2016-12-08 | 2024-06-12 | 엘지디스플레이 주식회사 | 기판 처리 장치 및 방법 및 그를 이용한 표시 장치 제조 방법 |
KR101884853B1 (ko) * | 2016-12-30 | 2018-08-02 | 세메스 주식회사 | 기판 지지 유닛 및 이를 포함하는 기판 처리 장치 |
KR102211815B1 (ko) | 2018-04-09 | 2021-02-04 | 정회욱 | 실내 벽체에 대한 마감부재 시공방법 및 이에 적용되는 실내 벽체 마감시스템 |
JP7163944B2 (ja) * | 2020-09-15 | 2022-11-01 | 日新イオン機器株式会社 | 基板保持装置およびイオン注入装置 |
CN118471860A (zh) * | 2024-06-10 | 2024-08-09 | 山东汉芯科技有限公司 | 一种芯片键合装置 |
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US6080050A (en) * | 1997-12-31 | 2000-06-27 | Applied Materials, Inc. | Carrier head including a flexible membrane and a compliant backing member for a chemical mechanical polishing apparatus |
JP3917651B2 (ja) * | 2004-10-28 | 2007-05-23 | 信越エンジニアリング株式会社 | 粘着チャック装置 |
JP4379435B2 (ja) * | 2006-05-17 | 2009-12-09 | 株式会社日立プラントテクノロジー | 基板組立装置とそれを用いた基板組立方法 |
JP4125776B1 (ja) * | 2007-01-31 | 2008-07-30 | 信越エンジニアリング株式会社 | 粘着チャック装置 |
US20090056866A1 (en) * | 2007-09-03 | 2009-03-05 | Jae Seok Hwang | Substrate bonding apparatus and method |
KR100850238B1 (ko) * | 2007-09-03 | 2008-08-04 | 주식회사 에이디피엔지니어링 | 기판척 및 이를 가진 기판합착장치 |
KR100894739B1 (ko) * | 2007-11-02 | 2009-04-24 | 주식회사 에이디피엔지니어링 | 기판합착장치 |
US8245751B2 (en) * | 2007-11-07 | 2012-08-21 | Advanced Display Process Engineering Co., Ltd. | Substrate bonding apparatus |
KR101340614B1 (ko) | 2011-12-30 | 2013-12-11 | 엘아이지에이디피 주식회사 | 기판합착장치 |
JP2013187393A (ja) * | 2012-03-08 | 2013-09-19 | Tokyo Electron Ltd | 貼り合わせ装置及び貼り合わせ方法 |
JP5395313B1 (ja) * | 2012-12-25 | 2014-01-22 | 信越エンジニアリング株式会社 | アクチュエータ及び粘着チャック装置 |
JP5642239B2 (ja) * | 2013-08-30 | 2014-12-17 | 株式会社日立製作所 | 液晶基板貼合システム |
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2014
- 2014-07-07 KR KR1020140084578A patent/KR101838681B1/ko active IP Right Grant
-
2015
- 2015-07-06 JP JP2015134981A patent/JP6634231B2/ja not_active Expired - Fee Related
- 2015-07-07 CN CN201510395072.5A patent/CN105244306A/zh active Pending
- 2015-07-07 TW TW104121974A patent/TWI662651B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
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TW201603182A (zh) | 2016-01-16 |
TWI662651B (zh) | 2019-06-11 |
JP2016018996A (ja) | 2016-02-01 |
CN105244306A (zh) | 2016-01-13 |
KR101838681B1 (ko) | 2018-03-14 |
KR20160005538A (ko) | 2016-01-15 |
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