JP4140748B2 - Application processing equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention applies a coating solution such as a resist film on the surface of a substrate such as a glass substrate of a liquid crystal display (LCD). Cloth Coating equipment In place Related.
[0002]
[Prior art]
In the manufacture of a liquid crystal display (LCD), a photoresist liquid is applied to a rectangular LCD substrate made of glass to form a resist film, the resist film is exposed corresponding to a circuit pattern, and this is developed. A circuit pattern is formed by a so-called photolithography technique. Conventionally, a resist coating and developing processing system including a plurality of processing units for performing such a series of steps has been used.
[0003]
In such a resist coating and developing processing system, in the step of applying a resist solution, a rectangular LCD substrate (hereinafter referred to as a substrate) is subjected to a hydrophobizing process (HMDS process) in an adhesion processing unit in order to improve the fixability of the resist. And after being cooled by the cooling unit, it is carried into the resist coating unit.
[0004]
In the resist coating processing unit, while the substrate is rotated while being held on the spin chuck, the resist solution is supplied to the surface of the substrate from the nozzle provided above, and the resist solution is diffused by the centrifugal force generated by the rotation of the substrate. As a result, a resist film is formed on the entire surface of the substrate.
[0005]
The substrate on which the resist solution is applied is removed from excess resist at the peripheral edge by an end surface processing unit (edge remover), then loaded into a heating processing unit, pre-baked, cooled by a cooling unit, and exposed to an exposure apparatus. Then, a predetermined pattern is exposed, and then developed and post-baked to form a predetermined resist pattern.
[0006]
In the resist coating unit, with the substrate placed on the spin chuck, the resist solution is discharged from the resist discharge nozzle to the center of the substrate without rotating the substrate and the spin chuck. Next, a rotating cup that surrounds the spin chuck from below is covered with a lid and an outer lid is attached to enclose the substrate in the rotating cup and the lid. Then, the substrate is rotated together with the rotating cup, and the resist solution is diffused from the center of the substrate toward the periphery by the rotational force and centrifugal force of the substrate to form a resist film on the substrate, and the thickness of the resist film To arrange.
[0007]
As a result, the air around the substrate is confined in the rotating cup and the lid, and an air flow that adversely affects the processing is prevented around the substrate, the resist film is made uniform in thickness, and extraneous to the rotating substrate by centrifugal force. An attempt is made to prevent the resist solution from splashing outside from the rotating cup.
[0008]
In addition, to control the film thickness around the substrate, external air is introduced into the cup under the lid, and a rectifying plate for adjusting the airflow outside the substrate is screwed to the center hole of the lid. The air that has flowed in flows outward along the upper surface of the current plate, and flows out of the rotating cup through an outflow hole formed in the outer peripheral portion of the bottom of the rotating cup.
[0009]
[Problems to be solved by the invention]
By the way, an outer cup is fixedly provided outside the rotating cup, and an outer lid is mounted on the outer cup at the time of processing. Conventionally, the airflow between the outer cup and the rotating cup is not considered, and there is a possibility that turbulent flow may occur between the fixed outer cup and the rotating rotating cup. It is difficult to perform smoothly. Therefore, there is a possibility that a desired airflow is not formed in the rotating cup due to the airflow between the outer cup and the rotating cup, or that the mist discharged from the rotating cup is scattered.
[0010]
On the other hand, there are two lids, a lid attached to the rotating cup and an outer lid attached to the outer cup, one being attached to the rotating cup and the other being attached to the stationary outer cup. Therefore, the mounting mechanism has to be complicated.
[0011]
The present invention has been made in view of such circumstances, and provides a coating processing apparatus capable of forming a desired airflow between a rotating processing container and an outer container fixedly provided on the outer side thereof. The purpose is to do. In addition, a coating processing apparatus provided with a mechanism that can easily attach and detach a lid attached to a rotating processing container and a lid attached to an outer container fixedly provided outside the lid. Place The purpose is to provide.
[0012]
[Means for Solving the Problems]
According to a first aspect of the present invention, there is provided a coating processing apparatus for applying a coating liquid on a surface of a substrate, and having an opening at an upper portion. , Having a hole in the outer peripheral side portion of the bottom, A processing container that accommodates the substrate; a coating liquid discharge nozzle that discharges the coating liquid onto the substrate in the processing container; a rotating means that rotates the processing container and the substrate; and a first opening that substantially closes the opening of the processing container. A first lid, an outer container fixedly provided on the outside of the processing container and having an opening at an upper portion thereof, and a second lid that substantially closes the opening of the outer container; An outermost layer container provided outside the outer container; And the second lid is provided with an air inlet so that the airflow between the processing container and the outer container can be controlled. A hole communicating with the outermost layer container is provided in an outer upper portion of the outer container, and a part of the air introduced from the air introduction port is exhausted to the outermost layer container through the hole, and the rest is discharged. Configured to be guided below the outer container. A coating treatment apparatus is provided.
[0013]
Since the air introduction port is provided so that the airflow between the processing container and the outer container can be controlled in this way, the airflow between them adversely affects the airflow in the processing container, or from the processing container. It is possible to prevent the discharged mist from scattering.
[0014]
According to a second aspect of the present invention, there is provided a coating processing apparatus for applying a coating liquid on a surface of a substrate, and having an opening at an upper portion. , Having a hole in the outer peripheral side portion of the bottom, A processing container that accommodates the substrate; a coating liquid discharge nozzle that discharges the coating liquid onto the substrate in the processing container; a rotating means that rotates the processing container and the substrate; and a first opening that substantially closes the opening of the processing container. 1 lid, an outer container fixedly provided on the outside of the processing container and having an opening at the top thereof, a second lid for substantially closing the opening of the outer container, An outermost layer container provided outside the outer container; An air flow forming means for forming an air flow from the upper side to the lower side of the outer peripheral side of the substrate in the processing container; , And the second lid is provided with an air inlet so that the air flow formed by the air flow forming means can be controlled. A hole communicating with the outermost layer container is provided in an outer upper portion of the outer container, and a part of the air introduced from the air introduction port is exhausted to the outermost layer container through the hole, and the rest is discharged. Configured to be guided below the outer container. A coating treatment apparatus is provided.
[0015]
As described above, the air flow forming means for forming the air flow from the upper side to the lower side on the outer peripheral side of the substrate is provided in the processing container, and the second lid body is configured to control the air flow formed by the air flow forming means. Since the air inlet is provided, a desired airflow can be reliably formed on the outer portion of the substrate in the processing container, and mist scattering from the processing container can also be prevented.
[0016]
According to a third aspect of the present invention In the coating treatment apparatus according to the first aspect or the second aspect, An attachment / detachment mechanism capable of attaching and detaching the first lid and the second lid collectively. And more The attachment / detachment mechanism includes: a coupling member provided on the second lid; a locking member provided on the first lid for locking the coupling member of the second lid; Elevating means for elevating and lowering the second lid, and when the second lid is raised by the elevating means, the first coupling member is engaged with the engagement member. When the first and second lids are mounted, these lids and the second lid are combined, and are lifted simultaneously by the lifting means to remove these lids. A coating processing apparatus is provided, wherein the first lid body and the second lid body are mounted while being lowered collectively and in a state where the coupling member and the locking member are separated from each other. The
[0017]
When the second lid is raised as described above, the first lid and the second lid are coupled in a state where the coupling member is latched to the latching member, and these are simultaneously The lids are lifted to remove them, and the first lid body and the second lid body are lowered all together at the time of attachment, and the first member is separated from the coupling member and the locking member. Since these two lids can be lifted and lowered together, and can be brought into and out of contact with each other as the second lid and the second lid are mounted, the lids can be lifted and lowered with a simple structure. It can be attached and detached efficiently and easily. Moreover, since they are separated when they are mounted, it is possible to easily rotate only the processing container.
[0020]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below in detail with reference to the accompanying drawings.
First, an overall configuration of a resist coating / developing system for an LCD substrate on which a resist coating unit according to an embodiment of the present invention is mounted will be described. FIG. 1 is a plan view showing the resist coating / developing system.
[0021]
This coating / development processing system includes a cassette station 1 on which a cassette C that accommodates a plurality of substrates G is placed, and a processing including a plurality of processing units for performing a series of processes including resist coating and development on the substrates G. And an interface unit 3 for transferring the substrate G between the exposure unit (not shown), and the cassette station 1 and the interface unit 3 are disposed at both ends of the processing unit 2, respectively. Yes.
[0022]
The cassette station 1 includes a transport mechanism 10 for transporting the LCD substrate between the cassette C and the processing unit 2. Then, the cassette C is loaded and unloaded at the cassette station 1. Further, the transport mechanism 10 includes a transport arm 11 that can move on a transport path 10 a provided along the cassette arrangement direction, and the transport arm 11 can transport the substrate G between the cassette C and the processing unit 2. Done.
[0023]
The processing section 2 is divided into a front stage section 2a, a middle stage section 2b, and a rear stage section 2c. Each of the processing sections 2 has transport paths 12, 13, and 14 at the center, and each processing unit is disposed on both sides of these transport paths. Yes. And between these, the relay parts 15 and 16 are provided.
[0024]
The front section 2a includes a main transport device 17 that can move along the transport path 12, and two cleaning units (SCRs) 21a and 21b are arranged on one side of the transport path 12, and the transport path 12, the processing block 25 in which the ultraviolet irradiation unit (UV) and the cooling unit (COL) are stacked in two stages, the processing block 26 in which the heating processing unit (HP) is stacked in two stages, and the cooling unit. A processing block 27 in which (COL) is stacked in two stages is arranged.
[0025]
The middle stage 2 b includes a main transfer device 18 that can move along the transfer path 13. On one side of the transfer path 13, a resist coating processing unit (CT) 22 and a resist on the peripheral edge of the substrate G are provided. The peripheral resist removing unit (ER) 23 for removing the substrate is integrally provided, and on the other side of the conveyance path 13, the processing block 28 in which the heating processing units (HP) are stacked in two stages, the heating processing unit A processing block 29 in which (HP) and a cooling processing unit (COL) are vertically stacked and a processing block 30 in which an adhesion processing unit (AD) and a cooling unit (COL) are vertically stacked are arranged. .
[0026]
Further, the rear stage portion 2 c includes a main transport device 19 that can move along the transport path 14, and three development processing units (DEV) 24 a, 24 b, and 24 c are disposed on one side of the transport path 14. On the other side of the conveyance path 14, a heat treatment unit (HP) is stacked in two stages, and a heat treatment unit (HP) and a cooling processing unit (COL) are stacked vertically. Processing blocks 32 and 33 are arranged.
[0027]
In the processing unit 2, only a spinner system unit such as the cleaning processing unit 21a, the resist processing unit 22, and the development processing unit 24a is disposed on one side of the conveyance path, and the heating processing unit is disposed on the other side. Only a thermal processing unit such as a cooling processing unit is arranged.
[0028]
Further, a chemical liquid supply unit 34 is disposed at a portion of the relay portions 15 and 16 on the spinner system unit arrangement side, and a space 35 for performing maintenance of the main transfer device is further provided.
[0029]
The main transfer devices 17, 18, and 19 each include a two-direction X-axis drive mechanism, a Y-axis drive mechanism, and a vertical Z-axis drive mechanism in a horizontal plane, and further rotate around the Z-axis. A drive mechanism is provided, and arms 17a, 18a, 19a for supporting the substrate G are provided.
[0030]
The main transfer device 17 transfers the substrate G to and from the arm 11 of the transfer mechanism 10, loads / unloads the substrate G to / from each processing unit of the front stage 2 a, and further transfers the substrate to / from the relay unit 15. It has a function to deliver G. The main transfer device 18 transfers the substrate G to and from the relay unit 15, and loads and unloads the substrate G to / from each processing unit of the middle stage 2 b, and further transfers the substrate G to and from the relay unit 16. It has a function to perform. Further, the main transfer device 19 transfers the substrate G to and from the relay unit 16, loads and unloads the substrate G to / from each processing unit of the rear-stage unit 2 c, and transfers the substrate G to and from the interface unit 3. It has a function to perform. The relay parts 15 and 16 also function as cooling plates.
[0031]
The interface unit 3 includes an extension 36 that temporarily holds a substrate when the substrate is transferred to and from the processing unit 2, two buffer stages 37 that are provided on both sides of the substrate and that are provided with buffer cassettes, and these And a transfer mechanism 38 that carries in and out the substrate G between the exposure apparatus (not shown). The transport mechanism 38 includes a transport arm 39 that can move on a transport path 38 a provided along the arrangement direction of the extension 36 and the buffer stage 37. The transport arm 39 allows the substrate G to be transferred between the processing unit 2 and the exposure apparatus. Is carried out.
[0032]
By consolidating and integrating the processing units in this way, it is possible to save space and improve processing efficiency.
[0033]
In the resist coating / development processing system configured as described above, the substrate G in the cassette C is transported to the processing unit 2, and the processing unit 2 firstly includes an ultraviolet irradiation unit (UV) of the processing block 25 of the preceding stage 2 a. ) Is subjected to surface modification / cleaning processing and cooled by a cooling processing unit (COL), and then scrubber cleaning is performed by cleaning units (SCR) 21a and 21b. After being heated and dried by HP), it is cooled by one of the cooling units (COL) in the processing block 27.
[0034]
Thereafter, the substrate G is transported to the middle stage 2b and subjected to a hydrophobic treatment (HMDS process) in the upper adhesion processing unit (AD) of the processing block 30 in order to improve the fixing property of the resist, and the lower cooling processing unit ( After cooling by COL), a resist is applied by a resist coating unit (CT) 22, and excess resist on the periphery of the substrate G is removed by a peripheral resist removal unit (ER) 23. Thereafter, the substrate G is pre-baked by one of the heat processing units (HP) in the middle stage 2b and cooled by the lower cooling unit (COL) of the processing block 29 or 30.
[0035]
Thereafter, the substrate G is transported from the relay section 16 to the exposure apparatus via the interface section 3 by the main transport apparatus 19, where a predetermined pattern is exposed. And the board | substrate G is again carried in via the interface part 3, and after performing a post-exposure baking process in the heat processing unit (HP) of the process blocks 31, 32, and 33 of the back | latter stage part 2c as needed, Development processing is performed in one of the development processing units (DEV) 24a, 24b, and 24c, and a predetermined circuit pattern is formed. The developed substrate G is subjected to a post-baking process in any one of the heat treatment units (HP) in the rear stage 2c, and is then cooled in any cooling unit (COL). 18 and 17 and the transport mechanism 10 are accommodated in a predetermined cassette on the cassette station 1.
[0036]
Next, a resist coating unit (CT) 22 according to an embodiment of the present invention will be described. FIG. 2 is a cross-sectional view schematically showing the resist coating unit according to the embodiment of the present invention, and shows a state where a lid is attached.
[0037]
As shown in FIG. 2, the resist coating unit (CT) 22 is rotatably provided with a spin chuck 40 that sucks and holds the substrate G with its surface horizontal. The spin chuck 40 is rotated by a drive motor 41 which is a substrate rotating means, whereby the substrate G on the spin chuck 40 is also rotated. A rotary cup 43 as a processing container having a bottomed cylindrical shape is rotatably provided so as to surround the spin chuck 40 and the substrate G on the spin chuck 40 from below. The rotating cup 43 is rotated together with the rotation of the substrate G by the rotation of the spin chuck 40 by the cup rotating mechanism 42.
[0038]
A hollow ring-shaped outer cup (outer container) 44 that covers the outer peripheral side and the lower side of the rotating cup 43 is disposed on the outer peripheral side of the rotating cup 43, and a drain cup (outermost layer container) 45 is further disposed on the outer side. Has been. The drain cup 45 can discharge the drain from a drain discharge hole 45a provided at the bottom by guiding the resist solution scattered when the resist is applied downward. The gas is exhausted from the exhaust hole 45b by an exhaust means (not shown) provided outside the drain cup 45. A hole 44a is provided on the outer upper part of the outer cup 44, and a part of the air supplied to the outer cup 44 is guided to the drain cup 45 through the hole 44a, and the remaining part is guided downward. ing. The drain cup 45 is configured to be movable up and down.
[0039]
A lid (first lid) 46 is detachably provided in the upper opening of the rotating cup 43. The lid 46 is configured to rotate together with the rotating cup 43 when the rotating cup 43 is rotated together with the substrate G. A support member 48 is attached to the upper center of the lid 46, and a hole 48 a is provided in the center of the support member 48. Further, a rectifying plate 49 as an airflow forming means is screwed to the lower side of the lid 46. The rectifying plate 49 is provided at a minute distance from the lid 46, and the air introduced into the rotating cup 43 from the hole 48 a is guided to the outer portion of the rotating cup 43, and from the upper side to the lower side on the outer peripheral side of the substrate G. It has the function of forming an airflow toward it. A plurality of air outlet holes 50 are provided on the outer peripheral side portion of the bottom of the rotating cup 43.
[0040]
An outer lid (second lid) 47 is detachably provided in the upper opening of the outer cup 44. The outer lid 47 is formed with a hole 51 that functions as an air introduction hole while the support member 48 is inserted through the center of the outer lid 47.
[0041]
The lid body 46 and the outer lid 47 are attached and detached together by an attaching / detaching mechanism 60. The attachment / detachment mechanism 60 includes a flange-shaped locking member 62 attached to the support member 48, an annular coupling member 66 attached to the upper side of the outer lid 47, and a lifting / lowering provided on the upper surface of the outer lid 47. The arm 68 and an elevating mechanism 69 made up of, for example, a cylinder mechanism that elevates and lowers the outer lid 47 by guiding the elevating arm 68 by a guide member (not shown) to elevate and lower it. A ring-shaped member 63 formed with a plurality of recesses 64 is provided on the lower surface of the locking member 62, while a plurality of protrusions 67 are provided on the upper surface of the coupling member 66 at positions corresponding to the recesses 64. When the outer lid 47 is raised by the elevating mechanism 69, the locking member 62 locks the coupling member 66 in a state where the projection 67 is fitted and aligned with the recess 64, and the lid body 46 and the lid body 47 are combined, and the lid body 46 can be raised together with the outer lid 47. As shown in the drawing, when the lid body 46 and the outer lid 47 are mounted, the locking member 62 and the coupling member 66 are separated from each other.
[0042]
A support column 70 is erected on the outer side of the outer cup 44, and an arm 71 having a nozzle 72 for supplying a resist solution or a solvent to the substrate G extends from the support column 70. The nozzle 72 has a resist solution discharge nozzle 73 for discharging a resist solution as a coating solution and a solvent discharge nozzle 74 for discharging a solvent such as thinner, and constitutes a multi-system nozzle unit. is doing.
[0043]
Further, the arm 71 is configured to be rotatable and movable up and down by a mechanism (not shown) in the support column 70, and when discharging a resist solution or a solvent, as shown in FIG. 3 described later, a resist solution discharge nozzle 73. The solvent discharge nozzle 74 is positioned above the center of the substrate G, and after discharging the resist solution or the like, as shown in FIG.
[0044]
Next, the processing operation in the resist coating unit (CT) 22 configured as described above will be described with reference to FIG.
[0045]
First, as shown in FIG. 3, the outer lid 47 is raised by the attaching / detaching mechanism 60, the protrusion 67 is fitted into the recess 64 and aligned, and the coupling member 66 is locked to the locking member 62. The lid 46 and the outer lid 47 are coupled (ST1). In this state, the outer lid 47 and the lid body 46 are raised together and removed from the rotating cup 43 and the outer cup 44 (ST2). Next, the substrate G is transported onto the spin chuck 40 by a transport arm (not shown) and held on the spin chuck 40 (ST3). Then, the arm 71 is rotated so that the nozzle 72 is positioned above the center of the substrate G as shown in FIG. 3, and a solvent such as thinner is discharged from the solvent discharge nozzle 74 onto the substrate G (ST4). At this time, the drain cup 45 is raised. This prevents solvent such as thinner from scattering. Next, the resist solution is discharged from the resist solution discharge nozzle 73 onto the substrate G, and the substrate G is rotated at a rotational speed of, for example, about 1500 rpm to diffuse the resist solution by centrifugal force, thereby forming a resist film on the substrate G ( ST5). The resist solution application at this time can also be performed while rotating the substrate G. At that time, the resist liquid is prevented from being scattered as the drain cup 45 is raised. When supplying the resist solution without rotating the substrate G, it is preferable to return the drain cup 45 to the original position after the supply of the solvent is completed.
[0046]
Thereafter, the lid body 46 and the outer lid 47 are lowered by the attaching / detaching mechanism 60, and the lid body 46 and the outer lid 47 are respectively attached to the upper openings of the rotating cup 43 and the outer cup 44, as shown in FIG. The upper opening is substantially closed (ST6). In this case, the lid body 46 and the outer lid 47 are first lowered in a coupled state, and after the lid body 46 is first attached, the outer lid 47 is further lowered to separate the coupling member 66 and the locking member 62. In this state, the outer lid 47 is attached. Thereafter, the substrate G and the rotating cup 43 are rotated at a predetermined rotational speed, for example, 1340 rpm, with the lid body 46 and the outer lid 47 being mounted, and the film thickness of the resist film is adjusted (ST7).
[0047]
When the resist film thickness is adjusted, the rotating cup 43 is substantially closed by the lid 46, so that the air around the substrate G is confined in the rotating cup 43 and the lid 46, and the processing around the substrate G is adversely affected. The airflow exerted can be prevented and the film thickness of the resist film can be made uniform. Further, it is possible to prevent excess resist solution from being scattered from the rotating substrate 43 to the outside by the centrifugal force from the rotating substrate G.
[0048]
Further, since the airflow lid 46 is provided with the rectifying plate 49 as the airflow forming means, the air introduced into the rotary cup 43 from the hole 48 a of the support member 48 is caused to flow outward along the rectifying plate 49. The outflow hole 50 formed in the outer peripheral portion of the bottom of the rotating cup 43 flows out of the rotating cup, and an air flow is positively formed in the vicinity of the end of the substrate G where the film thickness is likely to be disturbed to dry the portion. The uniformity of the resist film thickness can be kept high by controlling the resist film thickness of the substrate G on the periphery of the substrate.
[0049]
By the way, the rotating cup 43 that rotates together with the substrate G is provided with an outer cup 44 that does not rotate for protection or the like. However, when the outer cup 44 covers the entire rotating cup 43, the rotating cup 43 is fixedly provided. Further, turbulent flow may occur between the outer cup 44 and the rotating rotating cup 43, and it is difficult to exhaust the rotating cup 43 smoothly. Therefore, a desired airflow may not be formed in the rotating cup 43 due to the airflow between the outer cup 44 and the rotating cup 43, or mist discharged from the rotating cup 43 may be scattered.
[0050]
On the other hand, in the present embodiment, the lid body 47 that closes the outer cup 44 is formed with a hole 51 that functions as an air introduction hole. By introducing air from the hole 51, the outer cup 44 is formed. And the airflow between the rotary cup 43 and the rotating cup 43 can be controlled.
[0051]
That is, when the hole 51 is formed, the air introduced from the hole 51 flows toward the outside of the outer cup 44 by the operation of an exhaust means (not shown), a part is exhausted through the hole 44a, and the remaining part is downward. Led to. Therefore, an air flow that promotes a preferable flow in the vicinity of the end portion of the substrate G in the rotating cup 43 is formed in the outer cup 44, and a desired air flow is generated in the outer portion of the substrate G in the rotating cup 43. Can be reliably formed. In addition, the presence of the hole 51 in the outer lid 47 forms an air flow path from the center to the outside and further downward in the outer cup 44, and rectifies as a whole, so that the mist discharged from the rotating cup 43 Scattering can also be prevented.
[0052]
After the film thickness adjustment is thus completed, the rotation of the substrate G and the rotating cup 43 is stopped (ST8). Then, the outer lid 47 is raised, and the projection 67 of the coupling member 66 is fitted into the recess 64 formed in the ring-shaped member 63 of the locking member 62 attached to the lid body 46 to perform alignment. The locking member 62 locks the coupling member 66 to couple the lid body 46 and the lid body 47 (ST9), and the lid body 46 is lifted together with the outer lid 47 by the elevating mechanism 69. 43 and the outer cup are removed (ST10). Finally, the substrate G is taken out from the rotating cup 43 (ST11).
[0053]
As described above, when the outer lid 47 is raised, the attaching / detaching mechanism 60 is attached to the lid body 46 with the coupling member 66 attached to the outer lid 47 in a state where the protrusion 67 is fitted in the recess 64. The lid body 46 and the outer lid 47 are simultaneously lifted and removed by being latched by the latching member 62. On the other hand, when mounting, the lid body 46 and the outer lid 47 are collectively lowered. First, after the lid body 46 is mounted, the outer lid 47 is further lowered and the outer lid 47 is mounted in a state where the coupling member 66 and the locking member 62 are separated from each other. Thus, since these two lids can be lifted and lowered together and can be contacted and separated, these lids can be lifted and lowered with a simple structure and can be efficiently and easily attached and detached. . Moreover, since they are separated when they are mounted, it is possible to easily rotate only the rotating cup 43.
[0054]
Next, another embodiment will be described. FIG. 5 is a cross-sectional view showing a resist coating unit according to another embodiment. In this embodiment, an air inflow hole 80 is provided in the outer peripheral portion of the lid 46 instead of the rectifying plate 49 of the previous embodiment. Since other configurations are the same as those in FIG. 2, the same components as those in FIG. By providing the air inflow hole 80 in this manner, air flows from the outside through the air inflow hole 80, and an air flow is formed so that the air flows out from the outflow hole 50 of the rotary cup 43. The As a result, as in the above-described embodiment, an airflow flowing from the upper side to the lower side can be formed around the edge of the substrate G, and the airflow is positively formed in the vicinity of the edge of the substrate G where the film thickness tends to be disturbed. The uniformity of the resist film thickness can be maintained high by controlling the dry state of the substrate and controlling the resist film thickness of the substrate G on the periphery of the substrate.
[0055]
Also in the present embodiment, a hole 51 that functions as an air introduction hole is formed in the lid body 47 that closes the outer cup 44 as in the previous embodiment. It becomes possible to control the airflow between the cup 44 and the rotating cup 43, whereby a desired airflow can be reliably formed on the outer portion of the substrate G in the rotating cup 43, and from the rotating cup 43. It is also possible to prevent the mist discharged from being scattered.
[0056]
Next, another example of the attachment / detachment mechanism will be described with reference to FIG. In this example, the attachment / detachment mechanism 60 ′ has an annular shape attached via a locking member 91 having a flange shape attached to the support member 48 and a plurality of lifting arms 92 extending vertically above the outer lid 47. The connecting member 93 is formed, and an elevating mechanism 94 composed of, for example, a cylinder mechanism that elevates and lowers the connecting member 93 together with the outer lid 47 via the elevating arm 92. A plurality of recesses 95 are formed on the lower surface of the locking member 91, while a plurality of protrusions 96 are provided on the upper surface of the coupling member 93 at positions corresponding to the recesses 95. When the outer lid 47 is raised, the locking member 91 locks the coupling member 93 in a state where the projection 96 is fitted in the recess 95, and the lid body 46 can be raised together with the outer lid 47. Yes. Even with such a structure, the lid 46 and the outer lid 47 can be attached and detached in the same manner as in the above embodiment.
[0057]
In addition, this invention is not limited to the said embodiment, A various deformation | transformation is possible. For example, although the hole 51 is formed in the central portion as the air introduction hole of the outer lid 47, the present invention is not limited to this, and the hole 51 may be formed in the outer portion of the outer lid 47 as shown in FIG. As shown in FIG. 8, holes 51 may be formed at a plurality of positions in the radial direction of the outer lid 47. In short, the hole 51 may be formed at an appropriate position of the lid 47 so that a desired airflow is formed. Moreover, although the said embodiment demonstrated the case where this invention was applied to the resist application | coating / development processing system, it is not restricted to this. Furthermore, although the case where a resist solution is applied has been described, other application solutions can be applied as long as a coating film is formed by spin coating. Furthermore, in the above-described embodiment, the case where an LCD substrate is used as the substrate to be processed has been described.
[0058]
【The invention's effect】
As described above, according to the present invention, since the air introduction port is provided so as to control the airflow between the processing container and the outer container, the airflow in the processing container is caused by the airflow between them. It is possible to prevent the mist discharged from the processing container from being scattered.
[0059]
In addition, airflow forming means for forming an airflow directed from the upper side to the lower side of the outer peripheral side of the substrate is provided in the processing container, and the second lid body has air so that the airflow formed by the airflow forming means can be controlled. Since the introduction port is provided, a desired airflow can be reliably formed on the outer portion of the substrate in the processing container, and mist can be prevented from scattering from the processing container.
[0060]
Further, when the second lid is raised, the first lid and the second lid are coupled with the coupling member being latched by the latching member, and these are simultaneously raised by the lifting means. Then, these lids are removed, and the first lid and the second lid are lowered together at the time of mounting, and the first member is separated from the coupling member and the locking member. Since the lid body and the second lid body are mounted, these two lid bodies can be lifted and lowered together and can be brought into and out of contact with each other, so that these lid bodies can be lifted and lowered with a simple structure. At the same time, it can be attached and detached efficiently and easily. Moreover, since they are separated when they are mounted, it is possible to easily rotate only the processing container.
[0061]
Furthermore, after supplying and applying the coating liquid to the substrate, the first and second lids are mounted so as to substantially close the openings of the processing container and the outer container, respectively, and the first lid and the second lid are mounted. After separating the lid and rotating the processing container together with the substrate to adjust the film thickness of the coating film, the first lid and the second lid are opened together, so that the rotating processing container The first and second lids can be easily attached to and detached from the outer container that does not rotate.
[Brief description of the drawings]
FIG. 1 is a plan view showing a resist coating / developing system for an LCD substrate on which a resist coating processing unit according to an embodiment of the present invention is mounted.
FIG. 2 is a cross-sectional view showing a state in which a lid and an outer lid of a resist coating unit according to an embodiment of the present invention are mounted.
FIG. 3 is a cross-sectional view showing a state where a lid and an outer lid of a resist coating unit according to an embodiment of the present invention are removed.
FIG. 4 is a flowchart for explaining a processing operation of a resist coating unit according to an embodiment of the present invention.
FIG. 5 is a cross-sectional view showing a resist coating unit according to another embodiment of the present invention.
FIG. 6 is a cross-sectional view illustrating another example of an attachment / detachment mechanism.
FIG. 7 is a sectional view partially showing a resist coating unit according to still another embodiment of the present invention.
FIG. 8 is a sectional view partially showing a resist coating unit according to still another embodiment of the present invention.
[Explanation of symbols]
22... Resist coating processing unit (coating processing apparatus)
40 ... Spin chuck (rotating means)
43 ... Rotating cup (processing container)
44 ... Outer cup (outer container)
45 ... Drain cup (outermost layer container)
46: Lid (first lid)
47. Outer lid (second lid)
49 ... Rectifying plate (airflow forming means)
50 ... Outflow hole
51 ... hole (air inlet)
60, 60 '... Detachable mechanism
62, 91 ... locking member
64, 95 ... recess
66, 93 ... coupling member
67, 96 ... projection
69, 94 ... Elevating mechanism
73. Resist liquid discharge nozzle
74 ... Solvent discharge nozzle
80 ... Air inflow hole (air flow forming means)
G ... Board

Claims (8)

A coating processing apparatus for applying a coating liquid on the surface of a substrate,
A processing container containing a substrate, having an opening at the top and a hole at the outer peripheral side portion of the bottom;
A coating liquid discharge nozzle for discharging a coating liquid onto a substrate in the processing container;
Rotating means for rotating the processing container and the substrate;
A first lid for substantially closing the opening of the processing container;
An outer container fixedly provided on the outside of the processing container and having an opening in the upper part;
A second lid for substantially closing the opening of the outer container;
An outermost layer container provided outside the outer container,
The second lid is provided with an air inlet so that the airflow between the processing container and the outer container can be controlled,
A hole communicating with the outermost layer container is provided in an outer upper portion of the outer container, and a part of the air introduced from the air introduction port is exhausted to the outermost layer container through the hole, and the rest is A coating treatment apparatus configured to be guided below an outer container. A coating processing apparatus for applying a coating liquid on the surface of a substrate,
A processing container containing a substrate, having an opening at the top and a hole at the outer peripheral side portion of the bottom;
A coating liquid discharge nozzle for discharging a coating liquid onto a substrate in the processing container;
Rotating means for rotating the processing container and the substrate;
A first lid for substantially closing the opening of the processing container;
An outer container fixedly provided on the outside of the processing container and having an opening in the upper part;
A second lid for substantially closing the opening of the outer container;
An outermost layer container provided outside the outer container;
An airflow forming means for forming an airflow directed from the upper side to the lower side on the outer peripheral side of the substrate in the processing container,
The second lid is provided with an air inlet so that the airflow formed by the airflow forming means can be controlled,
A hole communicating with the outermost layer container is provided in an outer upper portion of the outer container, and a part of the air introduced from the air introduction port is exhausted to the outermost layer container through the hole, and the rest is A coating treatment apparatus configured to be guided below an outer container.   The coating apparatus according to claim 2, wherein the airflow forming unit includes a rectifying plate that is provided under the first lid and guides the air that has flowed in to the outside.   The said airflow formation means has an air inflow hole provided in the outer peripheral part of the said 1st cover body, The coating processing apparatus of Claim 2 characterized by the above-mentioned. An attachment / detachment mechanism capable of attaching and detaching the first lid and the second lid in a lump;
The attachment / detachment mechanism is
A coupling member provided on the second lid;
A locking member provided on the first lid for locking the coupling member of the second lid;
Elevating means for elevating and lowering the second lid,
When the second lid is raised by the elevating means, the first lid and the second lid are coupled in a state where the coupling member is locked to the locking member, These are lifted simultaneously by the lifting means to remove these lids,
When mounting the first and second lids, they are lowered all at once, and the first lid and the second are in a state where the coupling member and the locking member are separated from each other. The lid | cover body is mounted | worn, The coating processing apparatus of any one of Claims 1-4 characterized by the above-mentioned.   A projection is formed on the coupling portion, a recess is formed on the locking member, and the projection is inserted into the recess when the second lid body is raised. The coating treatment apparatus according to claim 5.   The coating processing apparatus according to claim 1, further comprising a solvent discharge nozzle that discharges the solvent onto the substrate, wherein the solvent is discharged onto the substrate prior to the supply of the coating liquid. . In the center of the first lid, further comprising a support member provided with a hole in the center,
The second lid is inserted through the support member at the center of the second lid,
The coating processing apparatus according to claim 3 , wherein the air is introduced into the processing container through a hole of the support member.

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