JP3483376B2 - Substrate processing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [0001] TECHNICAL FIELD The present invention relates to a semiconductor wafer and a liquid
Substrate for crystal display, mask, substrate for optical disk
Substrates such as are subject to downflow airflow with controlled temperature and humidity.
For substrate processing equipment that processes with organic solvents under pressure
You. [0002] 2. Description of the Related Art Conventional substrate processing apparatuses of this type include:
For example, rotate the substrate and apply a thin film of resist solution on the substrate surface.
Can be mentioned spin coater for forming
You. [0003] As is well known, a spin coater is used to coat a substrate.
Spin chuck or spin chuck that holds in a horizontal position
A rotating mechanism that rotates the substrate around a vertical axis
Liquid supply machine that supplies a resist liquid, one of the agents
Structure, shatterproof cup placed around the spin chuck
And so on. And the substrate is spinch
Do not rotate around the vertical axis while holding the
The resist solution supplied to the substrate surface
It is applied in a thin film form on the substrate surface by a coating method. this
Sometimes, the splash prevention cup moves from the rotating substrate to the surroundings.
The scattering of the resist solution is prevented. [0004] In addition, temperature and humidity are applied to the spin coater.
A thermo-humidity control unit for adjustment is provided. This temperature and humidity control
In the unit, the temperature and humidity of the air are
Adjust the temperature and humidity suitable for
Above the filter for removing dust (particles)
Supplying. Then, the temperature and humidity passing through the filter are adjusted.
The regulated airflow is a spin that constitutes a spin coater.
Downflow including chuck and scattering prevention cup
Has been washed away. [0005] A part of the downflow regulating airflow is
From the opening provided at the top of the scattering prevention cup,
Temperature and humidity inside the shatterproof cup.
Make the atmosphere suitable for the resist coating process
A coating process is performed. In addition, in this scattering prevention cup
The entrapped air flow is prevented from scattering when applying the resist.
Including the resist solution (organic solvent) scattered in the stop cup
To force a dedicated exhaust source from below the shatterproof cup
Exhausting. [0006] The above-mentioned downflow regulating airflow is prevented from scattering.
It is also flushed outside the cup, around the shatterproof cup
So that the particles floating on the
I have. This is the loading / unloading of the substrate into / from the spin chuck.
The area around the shatterproof cup (outside the shatterproof cup)
So that when loading / unloading this substrate,
Particles floating around the anti-scattering cup
This is for preventing adhesion. In addition, this type of spin coater has recently been used.
Spin developer for development processing and base for baking processing
Plate heating processing section, substrate cooling processing section, and spin coating
, Spin developer, substrate heating unit, substrate cooling
A substrate transport robot that transports substrates between processing units, etc.
And photolithography for the substrate.
Various substrate processing before and after the exposure processing (register
(Strike coating, development, various baking processes, etc.)
Being sold as a substrate processing unit
coming. [0008] However, this is not the case.
In the case of the conventional example having such a configuration, the following problem occurs.
is there. The spin coater with the above configuration has been used for a long time
And a substrate processing unit provided below the spin coater.
Organic solvents in the knit are used for organic solvents (base, wiring, etc.)
Corrosion phenomenon had occurred. like this
After investigating the cause of the inconvenience,
The inventor presumed that the above-mentioned inconvenience occurred.
Was. That is, in a conventional spin coater,
Of the downflow flowing outside the shatterproof cup
Regulated airflow is intended to cause particles to flow down.
This regulated airflow was below the spin coater
Only inside the shatterproof cup.
It is not forcibly exhausting like the regulated airflow. one
The controlled airflow inside the shatterproof cup
Indicates the base during the resist coating process
How to control the rotation of the plate and the shape of the scattering prevention cup
Therefore, in the above forced exhaust, the organic solvent in the scattering prevention cup is
The agent atmosphere cannot be exhausted sufficiently, and the organic solvent atmosphere scatters
It is presumed that it flowed out of the prevention cup. One
Atmosphere of organic solvent flowing out of the splash prevention cup
Of the downflow that is flowing outside the shatterproof cup
It flows under the spin coater on the air-saving flow,
Power supply inside the substrate processing unit
It is assumed that the above-mentioned inconvenience has occurred by touching
did. [0010] The above disadvantages are further disadvantageous as follows.
It is feared that they will be invited. That is, the spin coat
The organic solvent atmosphere flowing under the coater
Parts and equipment in the processing unit located below
Flow is disturbed by the
Around the spin coater (substrate processing unit)
It is also conceivable that it leaks out. In such a case, spin
Workers around the coater (substrate processing unit)
Organic solvent will come into contact with
Is done. For the manufacturer, there may be adverse effects on the human body
It is hoped that the possibility of exclusion will be eliminated. In addition, the temperature provided on the spin coater is
The humidity control unit always measures the air temperature and humidity during substrate processing.
Must be adjusted separately and fed to a spin coater,
Another problem is that it leads to high running costs.
Was. Further, the downflow airflow is generated by a spin coater.
Parts and equipment in the processing unit located below
The flow is disturbed by the
In some cases, the particles may soar upward. Further, as in a substrate processing unit,
Various devices and substrate transport paths are adjacent to the coater.
If it is, the peripheral devices and substrate transport path, etc.
Down flow for the purpose of causing
The airflow of the
Since the airflow of the substrate is not exhausted below,
In the lower space of the knit, each substrate processing including spin coater
Turbulence in down flow in processing equipment and substrate transport path
Easy, spin coater and other equipment, substrate transfer path, etc.
The particles that have flowed down in the
It will also raise. The above disadvantages are limited to the spin coater.
And organic under controlled temperature and humidity downflow airflow
Other substrate processing equipment that processes substrates using solvents
It can happen as well. The present invention has been made in view of such circumstances.
And the corrosion of parts under the equipment and its adverse effect on the human body
To reduce noise and reduce running costs
And the turbulence of airflow between adjacent devices
The purpose of the present invention is to provide a substrate processing apparatus capable of eliminating
You. [0016] SUMMARY OF THE INVENTION The present invention provides such an eye.
In order to achieve the target, the following configuration is adopted. Sand
That is, the present inventionConsists of multiple processing units and substrate transport paths
Installed in one of the processing units
A plate processing apparatus, wherein the substrate processing apparatus includes:Temperature and humidity of air
An adjusting unit for adjusting the degree, and the air adjusted by the adjusting unit.
A regulated airflow supply means having a blower for sending out air is provided.
The regulated airflow sent from the regulated airflow supply means.
While flowing downflow from above the device, remove the organic solvent
Process substrate usingAndPeripheral cover around substrate processing equipment
And sealed and supplied from the regulated airflow supply means.
The adjusted airflow of the downflow is transferred to the lower part of the outer cover.
A collection port for collecting from the vicinity and the substrate processing equipment
The supplied downflow regulating airflow is circulated from the recovery port.
Collection and supply to an adjustment unit in the adjustment airflow supply means
Means and the regulated airflow recovered by the recovery means
Organic solvent removing means for removing an organic solvent, and the collecting means
Remove particles contained in the regulated airflow collected by
Particle removal means.Well, on the outer cover
Adjacent to other processing units and / or substrate transport paths
JuxtaposedThings. [0017] The operation of the present invention is as follows. Regulated airflow
In the feeding means, the temperature and humidity of the air are adjusted by
The blower sends out the blown air above the substrate processing apparatus. substrate
In the processing equipment, the regulated airflow is downflowed from above the equipment.
The substrate is treated with an organic solvent while flowing through the substrate. Base
The periphery of the plate processing equipment is covered with an
The controlled air flow of the down flow is
Collected from the collection port near the bottom of the cover and supplied with regulated airflow
The substrate processing apparatus is supplied to the adjusting unit in the means and passes through the adjusting unit.
It is circulated and used as a downflow airflow. Also,
The organic solvent contained in the collected regulated airflow is an organic solvent
Particles are removed by the removal means, particles are removed
Is contained in the air used for circulation.
Solvents and particles are not supplied until the next time
Removed. That is, the dow flowing in the substrate processing apparatus
The airflow of the underflow containing organic solvent is distributed below the equipment.
Collection without touching installed electrical parts and surrounding people
Of organic components, etc.
Adverse effects on the human body can be prevented. The temperature and humidity controlled airflow is circulated.
To adjust the temperature of the new air to the specified temperature and humidity.
The load on the adjustment unit can be reduced compared to
To reduce running costs and running costs
Contribute. The periphery of the substrate processing apparatus is provided on an outer peripheral cover.
Covered and sealed, regulated airflow is supplied from above the device,
Since it is collected from near the bottom, downflow in the equipment
Properly manage airflow without disrupting airflow,
Turbulence in the airflow is unlikely to occur. In addition, the substrate processing equipment
The periphery of the device is covered with an outer peripheral cover and hermetically sealed.
Since the regulated airflow has been collected, this device must be
The board transfer path is adjacent, and these other equipment and board transfer
Even if downflow airflow is flowing on the road,
Make sure that the downflow airflow in the
From other equipment and the downflow airflow of the substrate transfer path
Will be done. Therefore, other devices and substrate transport path
The flow of downflow inside the device is
The flow will not be disturbed.
The airflow of the flow is
Airflow is not disturbed. [0021] BRIEF DESCRIPTION OF THE DRAWINGS FIG.
An embodiment will be described. FIG. 1 shows a base according to one embodiment of the present invention.
It is a longitudinal section showing the schematic structure of a board processing device. The book
In the embodiment, a switch which is one of the substrate processing apparatuses according to the present invention will be described.
A pin coater is used as an example. In this embodiment, a spin coater (substrate processing equipment) is used.
A) SC and a temperature and humidity control unit TC attached to it.
I have. The spin coater SC holds the substrate W in a horizontal position.
And a spin chuck 1 for holding the rotating shaft 2
To rotate the spin chuck 1 around a vertical axis
The motor 3 is also provided. A resist coating is applied around the spin chuck 1.
When the resist solution is scattered from the substrate W to the periphery during the cloth processing,
A scattering prevention cup 4 is provided to prevent
Above the jack 1, the base held by the spin chuck 1
A liquid discharge nozzle 5 for discharging a resist liquid is provided on the surface of the plate W.
Have been killed. The liquid discharge nozzle 5 is connected via a liquid supply pipe 6 to the nozzle.
A distaste liquid is supplied. This liquid supply pipe
6 is swung around the swing fulcrum YJ in the figure and
The liquid discharge nozzle 5 is configured to be capable of descending.
(The position shown by the imaginary line in the figure) and the standby position (the solid line in the figure)
(Position shown in the figure)
It is configured to be able to position. The liquid discharge nozzle 5 is in the standby position
Is waiting in the standby cup 7 to prevent drying of the discharge port.
You. Waste liquid of organic solvent used to prevent this drying
Is collected in a waste liquid tank 9 via a waste liquid drain 8.
It has become. In the figure, the liquid discharge nozzle 5 and the liquid supply pipe
Although only one set of 6 is drawn, it is drawn in FIGS.
As described above, a plurality of sets of liquid discharge nozzles 5 and liquid supply pipes 6 are provided.
It is configured so that several types of resist solutions can be discharged onto the substrate W.
It may be. Although not shown, this type
In the spin coater SC, the edge portion of the substrate W is cleaned.
Edge rinse mechanism for cleaning the back surface of substrate W
Back rinsing mechanism is provided. Loading / unloading of substrate W into / from spin chuck 1
For carrying out, the scattering prevention cup 4 and the spin chuck 1
Can be moved up and down relatively (in the figure, with respect to the spin chuck 1)
So that the scattering prevention cup 4 is raised and lowered).
You. The lower part of the shatterproof cup 4 has a dedicated exhaust
Air source (exhaust utilities provided in advance in factories, etc.)
A) an exhaust duct 11 communicatively connected to 10;
12 (may be the waste liquid tank 9).
A waste liquid drain 13 is provided. And prevent scattering
Atmosphere in cup 4 (resist liquid which is one of organic solvents)
Is contained in an exhaust gas through an exhaust duct 11.
10 and forcibly exhausted during the resist coating process
The resist solution generated and collected in the scattering prevention cup 4
Cleaning solution (used for edge rinse and back rinse)
Which waste liquid is discharged to the waste tank 12 through the waste drain 13
Is to be collected. The above components are supported by a base plate 14.
I have. The base plate 14 is fixed to a fixed frame 15.
In addition, a large number of holes 16 are provided, which will be described later.
Downflow air flows from the space above the base 14 to the hole 16.
And flows into the space below the base plate 14.
ing. The spin coater SC having the above configuration is
An upper food cover 20 and side and lower
Processing chamber sealed with a cover 21 covering the periphery
Deployed in the SCR. Strictly speaking, a spin coater
-The processing chamber of SC points inside the shatterproof cup 4,
Then, it is more widely covered with the food cover 20 and the cover 21
The internal space is simply called the processing room SCR, and the original processing room is
It is called a processing chamber in the scattering prevention cup 4 as needed. The hood cover 20 has a temperature and humidity control unit T
The temperature and humidity controlled air flow sent from C
One end of the pipe 22 to be sent is connected for communication, and
In addition, particle removal
A filter 23 is also provided. And the temperature and humidity are adjusted
Pass through the particle removal filter 23
The regulated airflow from which the vehicle has been removed
Down flow from above spin coater SC
You. Note that the hood cover 20 and the cover 21 are used in the present invention.
Corresponding to the outer peripheral cover. On one side of the cover 21, a substrate is loaded / unloaded.
Entrance 24 is provided, and the entrance 24 is opened and closed.
A shutter 25 is also provided. Shutter 25
Are opened only when loading / unloading the substrate W, and other
It is closed during the resist coating process, etc.
Be careful not to break the airtightness inside the processing room SCR during cloth processing.
ing. The lower surface of the cover 21 is
Flow control port and suction port for collecting airflow
Fan 31 is provided. Recovery port 26 and temperature and humidity control unit
And is connected to the TC through a pipe 27, and
The regulated airflow of the downflow by the fan 31 is:
It is collected from the collection port 26, passes through the pipe 27, and removes the organic solvent.
Adjusting part 32 in temperature and humidity control unit TC passing through leaving part 28
It is supplied to. This pipe 27 and suction pipe
The fan 31 constitutes the recovery means of the present invention, and
The agent removing section 28 serves as an organic solvent removing means in the present invention.
Hit. In addition, the organic solvent removing section 28 is formed by ion exchange.
Organic solvent contained in the recovered gas stream using a chemisorption reaction
Can be composed of a chemisorption filter to remove
You. Also, the organic solvent is solidified on the ceramic filter.
Alternatively, a processing system that performs combustion removal may be used.
Further, both may be used in combination. In addition,
The solvent removal unit 28 is connected to the pipe 27 for maintenance.
It is attached detachably. The temperature and humidity control unit TC is a control unit according to the present invention.
It is equivalent to an air-saving air supply means.
An adjusting unit 32 for adjusting to a predetermined temperature and humidity,
The air whose temperature and humidity have been adjusted in the section 32 is
Blower for supplying to the food cover 20 via 22
It is provided with a blower fan 33 and the like. The control unit 32 includes a cooler and an electric
Heater composed of air heater, ultrasonic type or steam blower
It is equipped with a humidifier of the discharge type and the vaporization type. This adjustment
In section 32, first, air is cooled by a cooler for the purpose of dehumidification, etc.
To a predetermined temperature, and then heat the air with a heater to the desired temperature.
Adjust the heating to the end and finally humidify the air humidity to the desired humidity.
And sent to the pipe 22 by the blower fan 33.
Although not shown, downstream of the blower fan 33
Is provided with a temperature sensor and a humidity sensor.
Detects the temperature and humidity of the adjusted air,
Control the driving amount of the cooler, heater, humidifier, etc. according to
Like that. In the apparatus having the above configuration, the temperature and humidity control unit is
Particle removal filter 23
Temperature and humidity controlled air flow from which particles have been removed
Flows through the processing chamber SCR in a down flow, and the suction fan
Forcibly sucked and collected from the collection port 26 by 31,
The organic solvent is removed through the organic solvent removing section 28,
It is supplied to the adjustment unit 32 in the humidity control unit TC and is processed again.
It is circulated as it is supplied above the chamber SCR
You. The recovery port 26, the pipe 27, the organic solvent removing unit 2
8, included in the air that is reused through the control unit 32 and the pipe 22.
Particles are put into the processing room SCR again
Before being removed by the particle removal filter 23. Ma
In addition, one of the downflow regulating airflows in the processing chamber SCR.
The part is taken into the shatterproof cup 4 and
Temperature and humidity suitable for the resist coating process.
While maintaining the atmosphere, and through the exhaust duct 11
The exhaust gas is forcibly exhausted to the exhaust source 10 to control the downflow.
The flow also flows outside the anti-scattering cup 4 and
Particles around the stop cup 4 and the scattering prevention cup 4
An organic solvent, etc., which has flowed out from the inside, flows down
From 26, it is forcibly collected. When the substrate W is loaded, the scattering prevention cup 4
The shutter 25 is opened.
Of the substrate transfer robot (not shown) supporting the substrate W
The arm is inserted into the processing chamber SCR from the loading / unloading port 24,
With the substrate W positioned above the spin chuck 1,
Is lowered by a predetermined amount and the substrate W is placed on the spin chuck 1.
When the arm exits the processing chamber SCR, the
And the scattering prevention cup 4 rises.
And placed around the spin chuck 1.
Is The substrate W placed on the spin chuck 1
Is controlled by a suction mechanism (not shown) of the spin chuck 1.
Adsorbed and held. Also, in this board loading, loading and unloading
New particles flow into the processing chamber SCR from the mouth 24
Particles are processed along with the arm etc.
Even if they are brought into the processing room SCR,
Particles fall down due to airflow regulation
Is given. In the resist coating process, the liquid discharge nozzle 5 waits.
The spin chuck 1 is moved from the machine position to the liquid discharge position,
The substrate W is rotated around a vertical axis and rotated at a predetermined rotation speed.
Then, a resist liquid is applied to the surface of the substrate W from the liquid discharge nozzle 5.
Is discharged, and a resist solution is formed by a so-called spin coating method.
Is applied to the surface of the substrate W in the form of a thin film.
You. At this time, it scatters from the substrate W to the surroundings, and
The resist solution and the like collected in the pump 4
3 and is collected in the waste liquid tank 12 to form a mist.
Resist solution (organic solvent) that is floating
1 is forcibly exhausted to the exhaust source 10. Also, exhaust duct
Insufficient exhaust from 11 flows out of shatterproof cup 4
The mist atmosphere of the organic solvent that has come out of the scattering prevention cup 4
Along with the regulated downflow of air flowing to the
Recovered from. The unloading of the substrate W is substantially the reverse of the loading of the substrate W.
The procedure is as follows. As described above, the air flow containing the organic solvent is
Inside the processing chamber SCR such as -21 and the pipe 27
So that it does not leak to the outside, so the bottom cover
Parts and machines such as electric parts placed below and around 21
The material and the surrounding people do not touch the organic solvent,
Prevents corrosion of parts and adverse effects on humans caused by organic solvents
it can. The airflow whose temperature and humidity have been adjusted is circulated.
So that new air (outside air) is sequentially adjusted to the specified temperature and humidity.
Adjusting unit 3 in thermo-humidity adjusting unit TC as compared with the case of adjusting
2 can be reduced. The periphery of the spin coater SC is covered.
21 and sealed, and the regulated airflow
Since it is supplied from above and collected from below, the processing chamber S
The air flow of the down flow is not disturbed in the CR
Proper management can be performed, and turbulence in the air flow inside the processing room SCR
It becomes difficult to get up, the air current soars upward and flows down
Particles that have fallen around the anti-scattering cup 4
Inconvenience such as rising can be prevented. The position of the organic solvent removing section 28 is as follows.
It is not limited to the position shown in FIG.
Organic solvent can be removed before it is put in the SCR
The temperature and humidity control unit TC
Considering the adverse effect of the organic solvent on the control section 32 and the like,
It is preferably arranged before the node 32. Further, in the above-described embodiment, FIG.
As described above, the recovery unit 32 in the temperature and humidity control unit TC
Supply fresh air and supply outside air.
And adjust the temperature and humidity with the control unit 32
Replenish circulating air by mixing outside air
I have to. Even with this configuration, only the outside air
The temperature of the adjusting unit 32 is lower than that of adjusting the temperature and humidity to a predetermined value.
The load can be reduced. In the above embodiment, the spin chuck 1
The anti-scattering cup 4 is configured to move up and down
But fix the splash prevention cup 4 and spin against it
The chuck 1 may be configured to move up and down. Further, the recovery port 26 is provided on the lower surface of the cover 21.
The lower part of the cover 21 (for example, the base plate 14
(Below). Next, the apparatus of the embodiment having the above-described configuration was incorporated.
The schematic configuration of the substrate processing unit will be described with reference to FIGS.
Will be explained. FIG. 2 is a view showing an appearance of the substrate processing unit.
FIG. 3 is a perspective view of a substrate processing unit and an inner part.
Interface unit (IF unit) and exposure unit
FIG. 4 is a cross-sectional plan view showing a schematic configuration of (partially omitted).
FIG. 4 is a schematic vertical sectional view of the substrate processing unit as viewed from the dexer side.
You. The substrate processing unit 40 is configured to
And before and after the exposure process in the photolithography process
Various types of substrate processing (resist coating and development, various bake processing
Etc.) and a spin coater with the above configuration
SC (One is installed in the figure, but multiple
And spin developer SD for development processing
(In the figure, two units are installed, but one or three or more units are installed.
May be placed), a heat treatment unit 50 for baking,
Substrate transport robot 60, substrate W for main unit 40
Indexer 70 for loading / unloading
It is configured as a unit. It should be noted that in FIG.
The frame 15 is a device in which the substrate processing unit 40 is fixed.
Become a frame. [0048] The spin developer SD
Of the developer 81, the developer supply mechanism 82, the developer, etc.
It is provided with a scattering prevention cup 83 for preventing scattering.
ing. The heat treatment section 50 heats the substrate W to a predetermined temperature.
Substrate with a hot plate (not shown)
The substrate heated in the heat treatment section 51 or the substrate heating section 51
Cool play for cooling W to a predetermined temperature near normal temperature
A plurality of substrate cooling processing units 52 provided with
In addition to being stacked in the Z-axis direction in the figure,
They are arranged side by side. Each of these substrate heat treatment units 5
1. Loading / unloading the substrate W into / from the substrate cooling processing unit 52
Loading / unloading ports 51a and 52a are provided. The substrate transfer robot 60 is provided at the outer peripheral end of the substrate W.
An arm 61 is provided for mounting and supporting the edge. This arm
61 is configured to be able to move back and forth in one horizontal axis direction.
Can rotate around vertical axis, can move up and down in Z axis direction, X
It is configured to be movable in the axial direction (along the substrate transport path 62).
Have been. Then, the above operations are combined to heat the substrate.
Processing unit 51, substrate cooling processing unit 52, spin coater S
C, transfer of substrate W to spin developer SD, etc.
Perform The indexer 70 is a photolithography process.
Pre-process equipment that performs the pre-process substrate processing, photolithography
With the next process equipment that performs the substrate processing of the next process of the lithography process
Carrier for storing and transporting a plurality of substrates W between them
C, a carrier mounting table 71 for mounting C,
The carrier C placed on the placement table 71 and the substrate transport
Substrate for transferring substrate W to and from bot 60
A loading / unloading robot 72 is provided. In addition, pre-process equipment
Of the carrier C between the carrier and the carrier placing table 71
And the carrier mounting table 71 and the next process device
The carrier C is transported during the
Carried by a transfer device (Auto Guided Vehicle: AGV)
Be done. The substrate processing unit 40 of this type has
Processing of the substrate transport path 62 and the spin developer SD.
The room SD, the substrate transfer path 73 of the substrate loading / unloading robot 72,
Downflow particles flowing downflow airflow
It is configured to flow down. However, substrate transfer
Of road 62, 73 and processing room SD of spin developer SD
Airflow management is to supply downflow airflow from above
However, no forced exhaust was performed from below. The substrate processing unit 40 includes an IF unit.
An exposure unit 100 is attached via a unit 90.
You. The exposing unit 100
It is also necessary to perform the exposure process in the photolithography process.
So, an exposure machine such as a reduction projection exposure machine (stepper),
Alignment for aligning the substrate W during exposure with an exposure machine
And the transfer of the substrate W within the exposure unit 100.
A board transfer robot (not shown)
It is configured as a unit. The IF unit 90 is connected to the substrate processing apparatus 40.
To transfer the substrate W to and from the exposure unit 100
Unit, a substrate transfer robot in the substrate processing apparatus 40
The substrate W before exposure received from the
Handover to the substrate transfer robot within 0 or exposure unit
Exposed substrate received from the substrate transfer robot in 100
The plate W is pulled to the substrate transfer robot 60 in the substrate processing apparatus 40.
Equipped with a board transfer robot (not shown)
You. The substrate processing unit 40 having such a configuration
In addition, a spin coater SC as shown in FIG.
By incorporating, as shown in FIG.
Electrical components of the substrate processing unit 40 disposed below C
Parts and equipment 41 used in the spin coater SC
Corrosion by an organic solvent can be prevented. In addition, other components adjacent to the spin coater SC
Equipment (spin developer SD, etc.)
Bot 60, substrate transfer path 6 of substrate transfer robot 72
2,73 downflow airflow and spin coater SC
Of the down flow in the processing chamber SCR
It will be cut off by 1 or the like. Therefore, as shown in FIG.
As shown in FIG. 4, another apparatus or a substrate transport path (the substrate transport robot in FIG. 4) is used.
Down flow of the substrate transfer path 62 of FIG.
Flow in the processing chamber SCR of the spin coater SC
Downflow airflow will not be disturbed,
Of the down flow in the processing room SCR of the spin coater SC
The airflow disturbs the downflow airflow of other equipment or the substrate transport path.
It will not be. Therefore, other devices, substrate transport paths, etc.
Processing room of spin coater SC under the influence of airflow from
Particles flowing down in the SCR flutter upward
The substrate processing unit 40 is completely
Airflow management as a body can be performed more appropriately. In the above embodiment, the photolithography is used.
Although the explanation has been made by taking an example of an apparatus for performing a substrate process in a heating process,
Even for equipment that performs substrate processing in other processes, temperature and humidity
Using organic solvent under regulated downflow airflow
The present invention is similarly applied to a substrate processing apparatus
Can be. The temperature and humidity of the semiconductor wafer are adjusted.
Substrate using organic solvent under simulated downflow airflow
Glass substrates for liquid crystal displays,
Temperature and humidity control for masks, optical disc substrates, etc.
Substrate using organic solvent under simulated downflow airflow
The present invention can be similarly applied to an apparatus for processing
You. [0060] As is apparent from the above description, the present invention
According to the above, the downflow gas flowing into the substrate processing apparatus
The current is supplied to the electric
Since it is collected without touching parts etc. and surrounding people,
Corrosion of electrical parts by organic solvents and adverse effects on surrounding human bodies
The effect can be prevented. The airflow whose temperature and humidity have been adjusted is circulated.
To adjust the temperature of the new air to the specified temperature and humidity.
The load on the adjustment unit can be reduced compared to
This can reduce the cost of the system. Further, an outer peripheral cover is provided around the substrate processing apparatus.
It is covered and sealed, and the regulated airflow is supplied from above the device.
Is collected from the lower part, so that
Airflow management without disturbing the airflow
The turbulence of the air flow in the device is less likely to occur,
There's nothing to make the tickle soar. The times
Organic solvents and particles contained in the collected airflow circulate
Used and removed before being fed back into the equipment.
Therefore, the airflow containing organic solvents and particles
There is no supply from above the device. An outer peripheral cover is provided around the substrate processing apparatus.
It is covered and sealed, and the regulated airflow inside the
Therefore, other devices and substrate transport paths are adjacent to this device.
Downflow in these other devices and the substrate transport path.
Even if the flow is flowing, the down
Flow airflow and other equipment or substrate transport adjacent to this equipment
Road flow will be cut off from the
Main equipment by the downflow airflow of the
The airflow of the downflow inside the storage will not be disturbed,
Conversely, the downflow airflow in this device is
It does not disturb the downflow airflow of the transport path. Subordinate
The airflow that has flowed down due to turbulence
It will not be lost.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a longitudinal sectional view showing a schematic configuration of a substrate processing apparatus according to one embodiment of the present invention. FIG. 2 is a partially omitted perspective view showing an appearance of a substrate processing unit. FIG. 3 is a plan sectional view showing a schematic configuration of a substrate processing unit, an interface unit (IF unit), and an exposure unit (partially omitted). FIG. 4 is a schematic vertical sectional view of the substrate processing unit as viewed from the indexer side. [Description of Signs] 20 hood cover 21 covers 22 and 27 pipe 23 particle removal filter (particle removal means) 26 recovery port 28 organic solvent removal section (organic solvent removal means) 31 suction fan 32 adjustment Unit 33: blower fan (blower unit) W: substrate SC: spin coater (substrate processing device) TC: temperature and humidity control unit (adjusted air flow supply means)

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification code FI B08B 3/08 H01L 21/02 D G03F 7/16 502 B01D 53/34 117A H01L 21/02 H01L 21/30 564C 21/027 ( 56) References JP-A-5-48330 (JP, U) JP-A-61-91746 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) F24F ^7/ 04-7/06

Claims (1)

(57) [Claims] [Claim 1] It comprises a plurality of processing units and a substrate transport path.
Installed in one of the processing units
The substrate processing apparatus , wherein the substrate processing apparatus is provided with a regulated airflow supply unit including an adjusting unit for adjusting the temperature and humidity of air, and a blowing unit for sending out the air adjusted by the adjusting unit. The substrate is treated with an organic solvent while flowing the regulated airflow sent from the airflow supply means in a downflow manner from above the apparatus, and the periphery of the substrate processing apparatus is covered with an outer peripheral cover to be sealed, and A recovery port for recovering the downflow regulating airflow supplied from the means from near a lower portion of the outer peripheral cover; and a downflow regulating airflow supplied to the substrate processing apparatus, recovering the downflow regulating airflow from the recovery port. A recovery unit that supplies the control unit in the supply unit, an organic solvent removal unit that removes an organic solvent contained in the regulated airflow recovered by the recovery unit, and an adjustment that is recovered by the recovery unit E Bei and particle removal means for removing particles contained in the airflow, and adjacent to the outer periphery cover, another one of the processing units and / or
A substrate processing apparatus, wherein a substrate transfer path is arranged in parallel .