JP4128319B2 - マルチチップボンディング方法及び装置 - Google Patents

マルチチップボンディング方法及び装置 Download PDF

Info

Publication number
JP4128319B2
JP4128319B2 JP36616399A JP36616399A JP4128319B2 JP 4128319 B2 JP4128319 B2 JP 4128319B2 JP 36616399 A JP36616399 A JP 36616399A JP 36616399 A JP36616399 A JP 36616399A JP 4128319 B2 JP4128319 B2 JP 4128319B2
Authority
JP
Japan
Prior art keywords
substrate
bonding
wafer ring
supply
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP36616399A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001185565A5 (https=
JP2001185565A (ja
Inventor
力 巳亦
修 角谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP36616399A priority Critical patent/JP4128319B2/ja
Priority to TW089124040A priority patent/TW533520B/zh
Priority to KR10-2000-0076964A priority patent/KR100400106B1/ko
Priority to US09/748,812 priority patent/US6383844B2/en
Publication of JP2001185565A publication Critical patent/JP2001185565A/ja
Publication of JP2001185565A5 publication Critical patent/JP2001185565A5/ja
Application granted granted Critical
Publication of JP4128319B2 publication Critical patent/JP4128319B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/907—Continuous processing

Landscapes

  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP36616399A 1999-12-24 1999-12-24 マルチチップボンディング方法及び装置 Expired - Fee Related JP4128319B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP36616399A JP4128319B2 (ja) 1999-12-24 1999-12-24 マルチチップボンディング方法及び装置
TW089124040A TW533520B (en) 1999-12-24 2000-11-14 Multi-chip bonding method and apparatus
KR10-2000-0076964A KR100400106B1 (ko) 1999-12-24 2000-12-15 멀티칩 본딩 방법 및 장치
US09/748,812 US6383844B2 (en) 1999-12-24 2000-12-26 Multi-chip bonding method and apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP36616399A JP4128319B2 (ja) 1999-12-24 1999-12-24 マルチチップボンディング方法及び装置

Publications (3)

Publication Number Publication Date
JP2001185565A JP2001185565A (ja) 2001-07-06
JP2001185565A5 JP2001185565A5 (https=) 2006-04-27
JP4128319B2 true JP4128319B2 (ja) 2008-07-30

Family

ID=18486081

Family Applications (1)

Application Number Title Priority Date Filing Date
JP36616399A Expired - Fee Related JP4128319B2 (ja) 1999-12-24 1999-12-24 マルチチップボンディング方法及び装置

Country Status (4)

Country Link
US (1) US6383844B2 (https=)
JP (1) JP4128319B2 (https=)
KR (1) KR100400106B1 (https=)
TW (1) TW533520B (https=)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3667241B2 (ja) * 2001-03-09 2005-07-06 松下電器産業株式会社 ボンディング方法および装置
JP4800524B2 (ja) * 2001-09-10 2011-10-26 ルネサスエレクトロニクス株式会社 半導体装置の製造方法、及び、製造装置
JP4390503B2 (ja) * 2003-08-27 2009-12-24 パナソニック株式会社 部品実装装置及び部品実装方法
US7244636B2 (en) * 2005-10-19 2007-07-17 Texas Instruments Incorporated Semiconductor assembly for improved device warpage and solder ball coplanarity
EP1941536B8 (de) * 2005-10-26 2019-06-19 Kulicke and Soffa (Switzerland) Management GmbH Verfahren und vorrichtung zum ablegen von elektronischen bauteilen, insbesondere halbleiterchips, auf einem substrat
JP4714026B2 (ja) * 2006-01-10 2011-06-29 株式会社東芝 電子部品実装装置、電子部品実装方法及び電子部品装置
US7677431B2 (en) * 2006-10-19 2010-03-16 Asm Technology Singapore Pte Ltd. Electronic device handler for a bonding apparatus
KR100787968B1 (ko) 2007-02-13 2007-12-24 세광테크 주식회사 칩공급부가 구비된 ｃｏｇ 장치
EP2299486B1 (de) * 2009-09-18 2015-02-18 EV Group E. Thallner GmbH Verfahren zum Bonden von Chips auf Wafer
US8546802B2 (en) * 2011-11-07 2013-10-01 Taiwan Semiconductor Manufacturing Company, Ltd. Pick-and-place tool for packaging process
US9105760B2 (en) 2011-11-07 2015-08-11 Taiwan Semiconductor Manufacturing Company, Ltd. Pick-and-place tool for packaging process
JP5959948B2 (ja) * 2012-06-13 2016-08-02 キヤノンマシナリー株式会社 ウエハリング交換装置およびチップ実装装置
JP5959949B2 (ja) * 2012-06-13 2016-08-02 キヤノンマシナリー株式会社 チップ実装装置
KR101422401B1 (ko) * 2013-04-03 2014-07-22 세메스 주식회사 발광 소자 칩 본딩 장치
TWI607587B (zh) * 2016-09-13 2017-12-01 台灣琭旦股份有限公司 固晶穩固製程
EP4681866A3 (en) * 2017-04-04 2026-04-29 Kulicke and Soffa Industries, Inc. Ultrasonic welding system and method of operating an ultrasonic welding system
CN109638142A (zh) * 2019-01-22 2019-04-16 先进光电器材（深圳）有限公司 晶环装置
CN118318289A (zh) * 2021-11-30 2024-07-09 邦德科技股份有限公司 晶片周部剥离装置、晶片供应装置、晶片供应系统、晶片接合系统、捡拾装置、晶片周部剥离方法、晶片供应方法、晶片接合方法及捡拾方法
CN115714101B (zh) * 2022-11-09 2023-11-14 长园半导体设备(珠海)有限公司 上料装置及切换方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5528397A (en) * 1991-12-03 1996-06-18 Kopin Corporation Single crystal silicon transistors for display panels
US5273622A (en) * 1991-01-28 1993-12-28 Sarcos Group System for continuous fabrication of micro-structures and thin film semiconductor devices on elongate substrates
JP2666788B2 (ja) * 1995-10-19 1997-10-22 日本電気株式会社 チップサイズ半導体装置の製造方法
JP3504543B2 (ja) * 1999-03-03 2004-03-08 株式会社日立製作所 半導体素子の分離方法およびその装置並びに半導体素子の搭載方法
US6312974B1 (en) * 2000-10-26 2001-11-06 Industrial Technology Research Institute Simultaneous bumping/bonding process utilizing edge-type conductive pads and device fabricated

Also Published As

Publication number Publication date
KR100400106B1 (ko) 2003-09-29
KR20010062479A (ko) 2001-07-07
US20010005602A1 (en) 2001-06-28
TW533520B (en) 2003-05-21
US6383844B2 (en) 2002-05-07
JP2001185565A (ja) 2001-07-06

Similar Documents

Publication Publication Date Title
JP4128319B2 (ja) マルチチップボンディング方法及び装置
KR100564825B1 (ko) 피가공물의 분할시스템 및 펠릿의 이체장치
KR20080035500A (ko) 본딩 장치용 전자 디바이스 핸들러
CN108346585B (zh) 半导体制造装置及半导体器件的制造方法
KR20170042955A (ko) 다이 본딩 장치
JP7039675B2 (ja) 半導体製造装置および半導体装置の製造方法
JP5964548B2 (ja) ウエーハ加工装置
JP3304295B2 (ja) ダイボンダ
KR20170042957A (ko) 반도체 다이들을 이송하기 위한 다이 셔틀 및 이를 포함하는 다이 본딩 장치
JP2001176892A (ja) ダイボンディング方法及びその装置
CN112772014B (zh) 零件安装装置
JP2000208445A (ja) 被加工物の分割加工方法
JP4530504B2 (ja) 整列部品の取扱装置
US4878610A (en) Die bonding apparatus
JP2001320195A (ja) 複合実装機
JP2019530248A (ja) ユニバーサルチップバッチボンディング装置及び方法
CN100373574C (zh) 晶粒拾取分类装置
JP6093125B2 (ja) ウェハカート及び電子部品装着装置
CN112366176A (zh) 晶粒拾取装置及方法
JP2010245479A (ja) 半導体チップ搭載装置
JP3898401B2 (ja) 部品供給装置
TW202322227A (zh) 晶粒接合裝置以及晶粒接合方法
JP4245792B2 (ja) 部品反転装置及び方法
JP6549310B2 (ja) 基板供給ユニット及びボンディング装置
JP3462944B2 (ja) バンプボンダーおよびバンプボンダー用チップ搬送方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060313

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20060313

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20080418

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20080507

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20080514

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110523

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees