JP4125644B2 - 多層回路基板の形成方法および多層回路基板 - Google Patents

多層回路基板の形成方法および多層回路基板 Download PDF

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Publication number
JP4125644B2
JP4125644B2 JP2003188290A JP2003188290A JP4125644B2 JP 4125644 B2 JP4125644 B2 JP 4125644B2 JP 2003188290 A JP2003188290 A JP 2003188290A JP 2003188290 A JP2003188290 A JP 2003188290A JP 4125644 B2 JP4125644 B2 JP 4125644B2
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JP
Japan
Prior art keywords
circuit board
forming
conductor
mask
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003188290A
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English (en)
Japanese (ja)
Other versions
JP2004088093A (ja
JP2004088093A5 (enExample
Inventor
和宏 西川
法人 塚原
博之 大谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2003188290A priority Critical patent/JP4125644B2/ja
Priority to US10/611,868 priority patent/US6971167B2/en
Priority to KR1020030045204A priority patent/KR20040004173A/ko
Priority to CNB031458092A priority patent/CN100466885C/zh
Publication of JP2004088093A publication Critical patent/JP2004088093A/ja
Publication of JP2004088093A5 publication Critical patent/JP2004088093A5/ja
Application granted granted Critical
Publication of JP4125644B2 publication Critical patent/JP4125644B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0179—Thin film deposited insulating layer, e.g. inorganic layer for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0582—Coating by resist, i.e. resist used as mask for application of insulating coating or of second resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0041—Etching of the substrate by chemical or physical means by plasma etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2003188290A 2002-07-05 2003-06-30 多層回路基板の形成方法および多層回路基板 Expired - Fee Related JP4125644B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2003188290A JP4125644B2 (ja) 2002-07-05 2003-06-30 多層回路基板の形成方法および多層回路基板
US10/611,868 US6971167B2 (en) 2002-07-05 2003-07-03 Multilayered circuit board forming method and multilayered circuit board
KR1020030045204A KR20040004173A (ko) 2002-07-05 2003-07-04 다층 회로기판 형성방법 및 다층 회로기판
CNB031458092A CN100466885C (zh) 2002-07-05 2003-07-07 多层电路板的形成方法及多层电路板

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002197033 2002-07-05
JP2003188290A JP4125644B2 (ja) 2002-07-05 2003-06-30 多層回路基板の形成方法および多層回路基板

Publications (3)

Publication Number Publication Date
JP2004088093A JP2004088093A (ja) 2004-03-18
JP2004088093A5 JP2004088093A5 (enExample) 2006-05-11
JP4125644B2 true JP4125644B2 (ja) 2008-07-30

Family

ID=31190281

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003188290A Expired - Fee Related JP4125644B2 (ja) 2002-07-05 2003-06-30 多層回路基板の形成方法および多層回路基板

Country Status (4)

Country Link
US (1) US6971167B2 (enExample)
JP (1) JP4125644B2 (enExample)
KR (1) KR20040004173A (enExample)
CN (1) CN100466885C (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6989327B2 (en) * 2004-01-31 2006-01-24 Hewlett-Packard Development Company, L.P. Forming a contact in a thin-film device
KR100817639B1 (ko) 2004-03-19 2008-03-27 에스에무케이 가부시키가이샤 스크린 프린팅 금속 마스크 판 및 진동부를 수지-밀봉하는방법
JP4345598B2 (ja) * 2004-07-15 2009-10-14 パナソニック株式会社 回路基板の接続構造体とその製造方法
JP2006128520A (ja) * 2004-10-29 2006-05-18 Tdk Corp 多層基板の製造方法
TWI363585B (en) * 2008-04-02 2012-05-01 Advanced Semiconductor Eng Method for manufacturing a substrate having embedded component therein
JP5903793B2 (ja) 2011-08-03 2016-04-13 日本電産株式会社 スピンドルモータの製造方法、スピンドルモータ、およびディスク駆動装置
JP6927665B2 (ja) * 2015-12-25 2021-09-01 日東電工株式会社 配線回路基板
US11089675B2 (en) * 2018-10-22 2021-08-10 Te Connectivity Corporation Tamper sensor
KR102112327B1 (ko) * 2018-12-04 2020-05-18 주식회사 엠디엠 입체 구조물의 표면에 회로 패턴을 형성하는 방법
CN112165767B (zh) * 2020-10-27 2021-12-07 惠州市特创电子科技股份有限公司 多层线路板以及移动通讯装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3324014A (en) * 1962-12-03 1967-06-06 United Carr Inc Method for making flush metallic patterns
US4221047A (en) * 1979-03-23 1980-09-09 International Business Machines Corporation Multilayered glass-ceramic substrate for mounting of semiconductor device
US4354895A (en) * 1981-11-27 1982-10-19 International Business Machines Corporation Method for making laminated multilayer circuit boards
US4789423A (en) * 1982-03-04 1988-12-06 E. I. Du Pont De Nemours And Company Method for manufacturing multi-layer printed circuit boards
US4606787A (en) * 1982-03-04 1986-08-19 Etd Technology, Inc. Method and apparatus for manufacturing multi layer printed circuit boards
US4915983A (en) * 1985-06-10 1990-04-10 The Foxboro Company Multilayer circuit board fabrication process
US4927477A (en) * 1985-08-26 1990-05-22 International Business Machines Corporation Method for making a flush surface laminate for a multilayer circuit board
JPH0716094B2 (ja) * 1986-03-31 1995-02-22 日立化成工業株式会社 配線板の製造法
US5114518A (en) * 1986-10-23 1992-05-19 International Business Machines Corporation Method of making multilayer circuit boards having conformal Insulating layers
TW210422B (enExample) * 1991-06-04 1993-08-01 Akzo Nv
US5199163A (en) * 1992-06-01 1993-04-06 International Business Machines Corporation Metal transfer layers for parallel processing
JP3758811B2 (ja) 1997-05-30 2006-03-22 京セラ株式会社 転写シート及びそれを用いた配線基板の製造方法

Also Published As

Publication number Publication date
CN1496216A (zh) 2004-05-12
CN100466885C (zh) 2009-03-04
JP2004088093A (ja) 2004-03-18
US20040020047A1 (en) 2004-02-05
US6971167B2 (en) 2005-12-06
KR20040004173A (ko) 2004-01-13

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