JP4118742B2 - 発光ダイオードランプおよび発光ダイオード表示装置 - Google Patents

発光ダイオードランプおよび発光ダイオード表示装置 Download PDF

Info

Publication number
JP4118742B2
JP4118742B2 JP2003137618A JP2003137618A JP4118742B2 JP 4118742 B2 JP4118742 B2 JP 4118742B2 JP 2003137618 A JP2003137618 A JP 2003137618A JP 2003137618 A JP2003137618 A JP 2003137618A JP 4118742 B2 JP4118742 B2 JP 4118742B2
Authority
JP
Japan
Prior art keywords
emitting diode
light
light emitting
curved surface
diode chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003137618A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004104077A5 (enExample
JP2004104077A (ja
Inventor
恵二 高杉
正明 加藤
雅俊 尾本
正高 宮田
征弘 瀬古
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP2003137618A priority Critical patent/JP4118742B2/ja
Priority to US10/621,265 priority patent/US20040037076A1/en
Publication of JP2004104077A publication Critical patent/JP2004104077A/ja
Priority to US11/246,236 priority patent/US7473014B2/en
Publication of JP2004104077A5 publication Critical patent/JP2004104077A5/ja
Application granted granted Critical
Publication of JP4118742B2 publication Critical patent/JP4118742B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

Landscapes

  • Led Device Packages (AREA)
  • Traffic Control Systems (AREA)
JP2003137618A 2002-07-17 2003-05-15 発光ダイオードランプおよび発光ダイオード表示装置 Expired - Fee Related JP4118742B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2003137618A JP4118742B2 (ja) 2002-07-17 2003-05-15 発光ダイオードランプおよび発光ダイオード表示装置
US10/621,265 US20040037076A1 (en) 2002-07-17 2003-07-17 Light emitting diode lamp and light emitting diode display unit
US11/246,236 US7473014B2 (en) 2002-07-17 2005-10-11 Light emitting diode lamp and light emitting diode display unit

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002208352 2002-07-17
JP2003137618A JP4118742B2 (ja) 2002-07-17 2003-05-15 発光ダイオードランプおよび発光ダイオード表示装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2007298225A Division JP4777967B2 (ja) 2002-07-17 2007-11-16 発光ダイオードランプおよび発光ダイオード表示装置

Publications (3)

Publication Number Publication Date
JP2004104077A JP2004104077A (ja) 2004-04-02
JP2004104077A5 JP2004104077A5 (enExample) 2007-09-27
JP4118742B2 true JP4118742B2 (ja) 2008-07-16

Family

ID=31890505

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003137618A Expired - Fee Related JP4118742B2 (ja) 2002-07-17 2003-05-15 発光ダイオードランプおよび発光ダイオード表示装置

Country Status (2)

Country Link
US (2) US20040037076A1 (enExample)
JP (1) JP4118742B2 (enExample)

Families Citing this family (91)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100601708B1 (ko) * 2004-11-17 2006-07-18 삼성전자주식회사 반사형 콜리메이터를 구비한 조명장치 및 이를 채용한화상투사장치
JP4587794B2 (ja) * 2004-12-01 2010-11-24 小糸工業株式会社 情報表示装置
JP2006186158A (ja) 2004-12-28 2006-07-13 Sharp Corp 発光ダイオードランプおよび発光ダイオード表示装置
KR100576881B1 (ko) * 2005-01-03 2006-05-10 삼성전기주식회사 반도체 레이저 다이오드장치 및 그 제조방법
US7821023B2 (en) 2005-01-10 2010-10-26 Cree, Inc. Solid state lighting component
US9793247B2 (en) 2005-01-10 2017-10-17 Cree, Inc. Solid state lighting component
US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
WO2006111805A1 (en) * 2005-04-16 2006-10-26 Acol Technologies Sa Optical light source having displaced axes
KR20080030038A (ko) * 2005-06-23 2008-04-03 코닌클리즈케 필립스 일렉트로닉스 엔.브이. 발광 장치 및 그 설계 방법
JP2007003975A (ja) * 2005-06-27 2007-01-11 Toray Ind Inc 光反射板用ポリプロピレンフィルム
JP4506646B2 (ja) * 2005-11-09 2010-07-21 パナソニック電工株式会社 照明器具
US8434912B2 (en) * 2006-02-27 2013-05-07 Illumination Management Solutions, Inc. LED device for wide beam generation
JP2009528556A (ja) 2006-02-27 2009-08-06 イルミネーション マネジメント ソリューションズ インコーポレイテッド 幅広ビーム生成のための改良ｌｅｄデバイス
US7675145B2 (en) 2006-03-28 2010-03-09 Cree Hong Kong Limited Apparatus, system and method for use in mounting electronic elements
US9335006B2 (en) 2006-04-18 2016-05-10 Cree, Inc. Saturated yellow phosphor converted LED and blue converted red LED
US8748915B2 (en) * 2006-04-24 2014-06-10 Cree Hong Kong Limited Emitter package with angled or vertical LED
US11210971B2 (en) * 2009-07-06 2021-12-28 Cree Huizhou Solid State Lighting Company Limited Light emitting diode display with tilted peak emission pattern
US7829899B2 (en) * 2006-05-03 2010-11-09 Cree, Inc. Multi-element LED lamp package
US7369329B2 (en) * 2006-05-04 2008-05-06 Philips Lumileds Lighting Company, Llc Producing distinguishable light in the presence of ambient light
US7661840B1 (en) 2006-06-21 2010-02-16 Ilight Technologies, Inc. Lighting device with illuminated front panel
US8735920B2 (en) * 2006-07-31 2014-05-27 Cree, Inc. Light emitting diode package with optical element
DE102006035635A1 (de) * 2006-07-31 2008-02-07 Osram Opto Semiconductors Gmbh Beleuchtungsanordnung
US7859002B2 (en) 2006-08-09 2010-12-28 Panasonic Corporation Light-emitting device
US10295147B2 (en) 2006-11-09 2019-05-21 Cree, Inc. LED array and method for fabricating same
TWI305567B (en) * 2006-11-17 2009-01-21 Ind Tech Res Inst Environment-adjustable lighting device
DE102007001706A1 (de) * 2007-01-11 2008-07-17 Osram Opto Semiconductors Gmbh Gehäuse für optoelektronisches Bauelement und Anordnung eines optoelektronischen Bauelementes in einem Gehäuse
US7686478B1 (en) 2007-01-12 2010-03-30 Ilight Technologies, Inc. Bulb for light-emitting diode with color-converting insert
US8109656B1 (en) 2007-01-12 2012-02-07 Ilight Technologies, Inc. Bulb for light-emitting diode with modified inner cavity
US9711703B2 (en) * 2007-02-12 2017-07-18 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
US7618163B2 (en) * 2007-04-02 2009-11-17 Ruud Lighting, Inc. Light-directing LED apparatus
ATE483939T1 (de) * 2007-04-05 2010-10-15 Koninkl Philips Electronics Nv Lichtstrahlenformer
WO2008144672A1 (en) 2007-05-21 2008-11-27 Illumination Management Solutions, Inc. An improved led device for wide beam generation and method of making the same
US7663315B1 (en) 2007-07-24 2010-02-16 Ilight Technologies, Inc. Spherical bulb for light-emitting diode with spherical inner cavity
CN101388161A (zh) * 2007-09-14 2009-03-18 科锐香港有限公司 Led表面安装装置和并入有此装置的led显示器
US9666762B2 (en) * 2007-10-31 2017-05-30 Cree, Inc. Multi-chip light emitter packages and related methods
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
US8866169B2 (en) * 2007-10-31 2014-10-21 Cree, Inc. LED package with increased feature sizes
JP4277926B1 (ja) * 2007-11-27 2009-06-10 トヨタ自動車株式会社 炭化珪素単結晶の成長法
DE102007060206A1 (de) * 2007-12-14 2009-06-18 Osram Opto Semiconductors Gmbh Anordnung mit mindestens einem optoelektronischen Halbleiterbauelement
TWI336386B (en) * 2008-03-07 2011-01-21 Ind Tech Res Inst Illumination device
US8388193B2 (en) * 2008-05-23 2013-03-05 Ruud Lighting, Inc. Lens with TIR for off-axial light distribution
US8348475B2 (en) 2008-05-23 2013-01-08 Ruud Lighting, Inc. Lens with controlled backlight management
US9423096B2 (en) 2008-05-23 2016-08-23 Cree, Inc. LED lighting apparatus
US7766509B1 (en) 2008-06-13 2010-08-03 Lumec Inc. Orientable lens for an LED fixture
US8002435B2 (en) * 2008-06-13 2011-08-23 Philips Electronics Ltd Philips Electronique Ltee Orientable lens for an LED fixture
US7841750B2 (en) 2008-08-01 2010-11-30 Ruud Lighting, Inc. Light-directing lensing member with improved angled light distribution
EP2326870B1 (en) * 2008-08-14 2017-01-25 Cooper Technologies Company Led devices for offset wide beam generation
TWM364824U (en) * 2008-09-19 2009-09-11 Genius Electronic Optical Co Ltd Optical lens body of bilateral asymmetry polarization illumination
US9425172B2 (en) 2008-10-24 2016-08-23 Cree, Inc. Light emitter array
US8791471B2 (en) * 2008-11-07 2014-07-29 Cree Hong Kong Limited Multi-chip light emitting diode modules
WO2010065663A2 (en) 2008-12-03 2010-06-10 Illumination Management Solutions, Inc. An led replacement lamp and a method of replacing preexisting luminaires with led lighting assemblies
JP4919235B2 (ja) * 2008-12-25 2012-04-18 島根電工株式会社 発光ダイオードおよび発光ダイオード光源
US20110037083A1 (en) * 2009-01-14 2011-02-17 Alex Chi Keung Chan Led package with contrasting face
US8368112B2 (en) 2009-01-14 2013-02-05 Cree Huizhou Opto Limited Aligned multiple emitter package
US8246212B2 (en) * 2009-01-30 2012-08-21 Koninklijke Philips Electronics N.V. LED optical assembly
US8293548B2 (en) * 2009-03-04 2012-10-23 Unilumin Group Co., Ltd. LED light module for street lamp and method of manufacturing same
US9035328B2 (en) * 2011-02-04 2015-05-19 Cree, Inc. Light-emitting diode component
US9255686B2 (en) 2009-05-29 2016-02-09 Cree, Inc. Multi-lens LED-array optic system
EP2486605B1 (en) 2009-10-08 2017-09-13 Philips Lighting Holding B.V. Lens for asymetrical light beam generation.
WO2011066421A2 (en) 2009-11-25 2011-06-03 Cooper Technologies Company Systems, methods, and devices for sealing led light sources in a light module
US8545046B2 (en) * 2009-11-30 2013-10-01 James K. Ng Multi-color indicator lighting
JP5119420B2 (ja) * 2010-03-10 2013-01-16 株式会社大都技研 遊技台
US8388198B2 (en) 2010-09-01 2013-03-05 Illumination Management Solutions, Inc. Device and apparatus for efficient collection and re-direction of emitted radiation
JP5772833B2 (ja) * 2010-12-28 2015-09-02 日亜化学工業株式会社 発光装置及びその製造方法
US9786811B2 (en) * 2011-02-04 2017-10-10 Cree, Inc. Tilted emission LED array
US9140430B2 (en) 2011-02-28 2015-09-22 Cooper Technologies Company Method and system for managing light from a light emitting diode
WO2012118828A2 (en) 2011-02-28 2012-09-07 Cooper Technologies Company Method and system for managing light from a light emitting diode
CN102818139B (zh) * 2011-06-10 2015-11-25 弘凯光电股份有限公司 发光二极管模块及其设置方法
US10842016B2 (en) 2011-07-06 2020-11-17 Cree, Inc. Compact optically efficient solid state light source with integrated thermal management
US10408429B2 (en) 2012-02-29 2019-09-10 Ideal Industries Lighting Llc Lens for preferential-side distribution
US9541258B2 (en) 2012-02-29 2017-01-10 Cree, Inc. Lens for wide lateral-angle distribution
US9541257B2 (en) 2012-02-29 2017-01-10 Cree, Inc. Lens for primarily-elongate light distribution
JP6208739B2 (ja) * 2012-03-30 2017-10-04 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． 伸張リードフレームアーキテクチャ用の予め回転されたオーバーモールド双方向性拡散レンズ
USD697664S1 (en) 2012-05-07 2014-01-14 Cree, Inc. LED lens
CN102891236B (zh) * 2012-09-13 2015-12-16 惠州雷曼光电科技有限公司 Led及其封装方法
US9080739B1 (en) 2012-09-14 2015-07-14 Cooper Technologies Company System for producing a slender illumination pattern from a light emitting diode
US9200765B1 (en) 2012-11-20 2015-12-01 Cooper Technologies Company Method and system for redirecting light emitted from a light emitting diode
US20140159084A1 (en) * 2012-12-12 2014-06-12 Cree, Inc. Led dome with improved color spatial uniformity
USD718490S1 (en) 2013-03-15 2014-11-25 Cree, Inc. LED lens
US9099575B2 (en) 2013-07-16 2015-08-04 Cree, Inc. Solid state lighting devices and fabrication methods including deposited light-affecting elements
US9523479B2 (en) 2014-01-03 2016-12-20 Cree, Inc. LED lens
US9601670B2 (en) 2014-07-11 2017-03-21 Cree, Inc. Method to form primary optic with variable shapes and/or geometries without a substrate
US9410674B2 (en) 2014-08-18 2016-08-09 Cree, Inc. LED lens
US10622522B2 (en) 2014-09-05 2020-04-14 Theodore Lowes LED packages with chips having insulated surfaces
CN105179976A (zh) * 2015-10-12 2015-12-23 辽宁汇明科技有限公司 一种小功率led灯珠
US10468566B2 (en) 2017-04-10 2019-11-05 Ideal Industries Lighting Llc Hybrid lens for controlled light distribution
CN108550685A (zh) * 2018-03-19 2018-09-18 山东省科学院海洋仪器仪表研究所 一种叶绿素荧光激发专用led
US10838492B1 (en) 2019-09-20 2020-11-17 Nvidia Corp. Gaze tracking system for use in head mounted displays
US11506888B2 (en) 2019-09-20 2022-11-22 Nvidia Corp. Driver gaze tracking system for use in vehicles
JP7513900B2 (ja) * 2021-02-17 2024-07-10 日亜化学工業株式会社 発光装置及び光源装置
CN116632145A (zh) * 2023-06-29 2023-08-22 惠州市弘正光电有限公司 Led光源、led光源制备工艺及显示屏制备工艺

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3609475A (en) * 1970-05-04 1971-09-28 Hewlett Packard Co Light-emitting diode package with dual-colored plastic encapsulation
JPS6070783A (ja) * 1983-09-27 1985-04-22 Sharp Corp 発光ダイオ−ド表示装置
JPH0736450B2 (ja) * 1985-09-05 1995-04-19 株式会社コパル Ｌｅｄ光源
US4774434A (en) * 1986-08-13 1988-09-27 Innovative Products, Inc. Lighted display including led's mounted on a flexible circuit board
US5013144A (en) * 1988-10-15 1991-05-07 Hewlett-Packard Company Light source having a multiply conic lens
KR950003955B1 (ko) * 1990-09-07 1995-04-21 가부시키가이샤도시바 Led램프
JPH05121785A (ja) * 1991-10-28 1993-05-18 Sharp Corp 発光素子
DE4242842C2 (de) * 1992-02-14 1999-11-04 Sharp Kk Lichtemittierendes Bauelement zur Oberflächenmontage und Verfahren zu dessen Herstellung
JPH05275752A (ja) * 1992-03-26 1993-10-22 Rohm Co Ltd 発光ダイオード
JPH06177424A (ja) 1992-12-03 1994-06-24 Rohm Co Ltd 発光ダイオードランプおよび集合型発光ダイオード表示装置
JPH07131074A (ja) * 1993-10-29 1995-05-19 Victor Co Of Japan Ltd 発光装置
JPH08162673A (ja) * 1994-11-30 1996-06-21 Rohm Co Ltd 発光ダイオードランプ
JP2956594B2 (ja) 1996-07-03 1999-10-04 日亜化学工業株式会社 発光ダイオード及びそれを用いた表示装置
TW383508B (en) * 1996-07-29 2000-03-01 Nichia Kagaku Kogyo Kk Light emitting device and display
JP3378465B2 (ja) * 1997-05-16 2003-02-17 株式会社東芝 発光装置
JP2980121B2 (ja) 1997-09-22 1999-11-22 日亜化学工業株式会社 信号用発光ダイオード及びそれを用いた信号機
US5924788A (en) * 1997-09-23 1999-07-20 Teledyne Lighting And Display Products Illuminating lens designed by extrinsic differential geometry

Also Published As

Publication number Publication date
US20040037076A1 (en) 2004-02-26
US20060039143A1 (en) 2006-02-23
JP2004104077A (ja) 2004-04-02
US7473014B2 (en) 2009-01-06

Similar Documents

Publication Publication Date Title
JP4118742B2 (ja) 発光ダイオードランプおよび発光ダイオード表示装置
US7566911B2 (en) Light-emitting diode lamp and light-emitting diode display device
US7098485B2 (en) Optical semiconductor unit
US4698730A (en) Light-emitting diode
US7034343B1 (en) Dipolar side-emitting LED lens and LED module incorporating the same
US9862301B2 (en) Vehicular rear panel
JP5383101B2 (ja) 面状光源装置および表示装置
US10754191B2 (en) Display light source module having encapsulated LEDs and reflective recess with reflective patterns
KR20060049072A (ko) 발광 다이오드 램프
CN207338367U (zh) 发光二极管和发光模块
CN102782400A (zh) 用于机动车辆的光学系统
EP3982039B1 (en) Lighting device
US20200233141A1 (en) Light source module and display device
JP5197543B2 (ja) 路面用発光ブロック
JP4777967B2 (ja) 発光ダイオードランプおよび発光ダイオード表示装置
CN216749897U (zh) 光学感测模块
CN100414729C (zh) 发光二极管
CN102052636A (zh) Led车灯封装结构及其封装罩体
CN213178201U (zh) 一种具有安装准直结构的背光透镜
CN221150058U (zh) 一种防侧面漏光led封装结构
JPH0962206A (ja) Ｌｅｄ表示装置
JP3527178B2 (ja) 信号灯器用ｌｅｄユニット
CN214956941U (zh) 一种发光模组结构
CN216389419U (zh) 可调发光面的发光二极管
CN222085809U (zh) 像素化光学模组和车灯

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20050810

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070810

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20070810

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20070912

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20070918

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20071116

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20080115

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080314

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20080415

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20080423

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110502

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110502

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120502

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120502

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130502

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140502

Year of fee payment: 6

LAPS Cancellation because of no payment of annual fees