JP6208739B2 - 伸張リードフレームアーキテクチャ用の予め回転されたオーバーモールド双方向性拡散レンズ - Google Patents
伸張リードフレームアーキテクチャ用の予め回転されたオーバーモールド双方向性拡散レンズ Download PDFInfo
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- 238000009792 diffusion process Methods 0.000 claims description 40
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/69—Details of refractors forming part of the light source
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/27—Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/04—Refractors for light sources of lens shape
- F21V5/045—Refractors for light sources of lens shape the lens having discontinuous faces, e.g. Fresnel lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/13—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L33/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/005—Reflectors for light sources with an elongated shape to cooperate with linear light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
- F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Description
Claims (20)
- 固体発光デバイス(LED)照明装置を製造する方法であって、
リードフレームアセンブリを形成するステップであって、
リードフレーム基板上に、第1のピッチで離間され、それぞれ1つ以上のパッドを含むリードフレームのグループを形成することと、
前記リードフレーム基板上に、初期の折り畳まれた状態にあり、それぞれ2つの隣接するリードフレームを結び付ける相互接続子を形成することと
を含む、ステップと、
前記固体発光デバイスを前記リードフレーム上に取り付けるステップと、
前記固体発光デバイスの周囲に非対称拡散レンズを配置するステップと、
前記固体発光デバイスが前記第1のピッチよりも大きい第2のピッチで離間するように、前記相互接続子が展開するように前記リードフレームアセンブリを伸張するステップと、
を含む、方法。 - 前記非対称拡散レンズを配置するステップは、前記リードフレームアセンブリが伸張された後に、前記非対称拡散レンズが所定の光パターンを提供するように、前記非対称拡散レンズを方向付けることを含む、請求項1に記載の方法。
- 前記非対称拡散レンズは、双方向性拡散レンズを含み、各双方向性拡散レンズは、拡散軸と、前記拡散軸に垂直であるヌル軸とを有し、各双方向性拡散レンズは、前記ヌル軸よりも前記拡散軸に沿う両方向により多くの光を向け、前記非対称拡散レンズを配置するステップは、前記拡散軸が伸張軸と整列するように、各双方向性拡散レンズを方向付けるステップを含み、前記伸張軸は、前記リードフレームアセンブリの伸張後に、前記伸張されたリードフレームアセンブリの長さに沿って整列される、請求項1に記載の方法。
- 前記拡散軸は、前記リードフレームアセンブリが伸張される前は、前記伸張軸に対し角度が付けられ、前記方法は更に、前記リードフレームアセンブリの幾何学形状及び前記伸張されたリードフレームアセンブリの最終長さに基づいて、前記拡散軸と前記伸張軸との間の角度を決定するステップを含む、請求項3に記載の方法。
- 前記拡散軸は、前記リードフレームアセンブリが伸張される前の前記リードフレーム上の前記固体発光デバイスを通過する列軸に対し角度が付けられ、前記方法は更に、前記リードフレームアセンブリの幾何学形状及び前記伸張されたリードフレームアセンブリの最終長さに基づいて、前記拡散軸と前記列軸との間の角度を決定するステップを含む、請求項3に記載の方法。
- 前記非対称拡散レンズを配置するステップは、前記固体発光デバイスの周囲に反射器カップを配置することと、前記反射器カップを封入剤で充たすこととを含む、請求項1に記載の方法。
- 前記非対称拡散レンズを配置するステップは、前記固体発光デバイス上に前記非対称拡散レンズを取り付けること、又は、前記固体発光デバイス上に前記非対称拡散レンズを直接的に成形することを含む、請求項1に記載の方法。
- 前記リードフレームアセンブリを形成するステップは更に、前記相互接続子の一部と前記リードフレームとを接続する犠牲タイを形成することを含み、前記方法は更に、前記固体発光デバイスを取付け、前記非対称拡散レンズを配置した後に、前記犠牲タイをトリミングするステップを含む、請求項1に記載の方法。
- 前記伸張されたリードフレームアセンブリを、反射器に対して固定するステップを更に含む、請求項1に記載の方法。
- 隣接する反射器間の間隙に亘って絶縁ストリップを固定するステップを更に含む、請求項9に記載の方法。
- 前記伸張されたリードフレームアセンブリ及び前記反射器を、透明管内に挿入するステップと、
前記透明管の端に2ピンコネクタを取り付けるステップと、
を更に含む、請求項9に記載の方法。 - 前記固体発光デバイスは、プリパッケージされた発光ダイオード又は裸の発光ダイオードダイである、請求項1に記載の方法。
- 固体発光デバイス(LED)照明装置であって、
伸張されたリードフレームアセンブリを含み、
前記伸張されたリードフレームアセンブリは、
それぞれ1つ以上のパッドを含むリードフレームのグループと、
それぞれ隣接するリードフレームを結び付ける相互接続子と、
前記リードフレーム上に取付けられる固体発光デバイスと、
前記固体発光デバイスの周囲に配置される非対称拡散レンズと、
を含む、装置。 - 前記非対称拡散レンズは、双方向性拡散レンズを含み、各双方向性拡散レンズは、拡散軸と、前記拡散軸に垂直であるヌル軸とを有し、各双方向性拡散レンズは、前記ヌル軸よりも前記拡散軸に沿う両方向により多くの光を向け、前記拡散軸は、前記伸張されたリードフレームアセンブリの長さに沿って整列されている、請求項13に記載の装置。
- 前記非対称拡散レンズは、前記固体発光デバイスの周囲の反射器カップと、前記反射器カップ内の封入剤とを含む、請求項13に記載の装置。
- 各相互接続子は、隣接するリードフレームを、機械的及び電気的に直列に接続する、請求項13に記載の装置。
- 1つ以上の反射器を更に含み、前記伸張されたリードフレームアセンブリは、前記1つ以上の反射器に対して固定される、請求項13に記載の装置。
- 隣接する反射器間の間隙に亘る絶縁ストリップを更に含む、請求項17に記載の装置。
- 前記伸張されたリードフレームアセンブリ及び前記反射器を受容する透明管と、
前記透明管の端に取付けられた2ピンコネクタと、
を更に含む、請求項17に記載の装置。 - 前記固体発光デバイスは、プリパッケージされた発光ダイオード又は裸の発光ダイオードダイである、請求項13に記載の装置。
Applications Claiming Priority (3)
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US201261617689P | 2012-03-30 | 2012-03-30 | |
US61/617,689 | 2012-03-30 | ||
PCT/IB2013/052429 WO2013144858A1 (en) | 2012-03-30 | 2013-03-27 | Pre-rotated overmolded bidirectional spreading lens for stretched leadframe architecture |
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JP2017171795A Division JP6515271B2 (ja) | 2012-03-30 | 2017-09-07 | 伸張リードフレームアーキテクチャ用の予め回転されたオーバーモールド双方向性拡散レンズ |
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JP2015511774A JP2015511774A (ja) | 2015-04-20 |
JP6208739B2 true JP6208739B2 (ja) | 2017-10-04 |
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JP2017171795A Active JP6515271B2 (ja) | 2012-03-30 | 2017-09-07 | 伸張リードフレームアーキテクチャ用の予め回転されたオーバーモールド双方向性拡散レンズ |
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US (2) | US9997684B2 (ja) |
EP (1) | EP2831493B1 (ja) |
JP (2) | JP6208739B2 (ja) |
KR (1) | KR101990339B1 (ja) |
CN (1) | CN104204652B (ja) |
ES (1) | ES2590857T3 (ja) |
WO (1) | WO2013144858A1 (ja) |
Cited By (1)
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JP2017224856A (ja) * | 2012-03-30 | 2017-12-21 | コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. | 伸張リードフレームアーキテクチャ用の予め回転されたオーバーモールド双方向性拡散レンズ |
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DE102014110068A1 (de) * | 2014-07-17 | 2016-01-21 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen eines optoelektronischen Bauelements und optoelektronisches Bauelement |
US9601673B2 (en) * | 2014-11-21 | 2017-03-21 | Cree, Inc. | Light emitting diode (LED) components including LED dies that are directly attached to lead frames |
US9958115B2 (en) * | 2015-07-22 | 2018-05-01 | Qin Kong | LED tube grow light |
JP7100658B2 (ja) * | 2016-12-13 | 2022-07-13 | ルミレッズ ホールディング ベーフェー | リードフレーム上のledの配置 |
EP3373709A1 (de) | 2017-03-07 | 2018-09-12 | Heraeus Deutschland GmbH & Co. KG | Traegersubstrat fuer eine lichtanwendung und verfahren zur herstellung eines traegersubstrats |
DE102017131063A1 (de) | 2017-12-22 | 2019-06-27 | Ledvance Gmbh | LED-Modul mit einem stabilisierten Leadframe |
US11444227B2 (en) * | 2019-10-01 | 2022-09-13 | Dominant Opto Technologies Sdn Bhd | Light emitting diode package with substrate configuration having enhanced structural integrity |
WO2023030938A1 (en) * | 2021-08-30 | 2023-03-09 | Signify Holding B.V. | A lighting device |
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US5174649B1 (en) | 1991-07-17 | 1998-04-14 | Precision Solar Controls Inc | Led lamp including refractive lens element |
GB2337591B (en) * | 1998-05-20 | 2000-07-12 | Geco As | Adaptive seismic noise and interference attenuation method |
KR100537897B1 (ko) | 2001-04-26 | 2005-12-20 | 모리야마 산교 가부시키가이샤 | 광원연결체, 발광체장치, 패턴화도체 및 광원연결체의 제조방법 |
US7380961B2 (en) | 2002-04-24 | 2008-06-03 | Moriyama Sangyo Kabushiki Kaisha | Light source coupler, illuminant device, patterned conductor, and method for manufacturing light source coupler |
JP4118742B2 (ja) * | 2002-07-17 | 2008-07-16 | シャープ株式会社 | 発光ダイオードランプおよび発光ダイオード表示装置 |
US20040037080A1 (en) | 2002-08-26 | 2004-02-26 | Luk John F. | Flexible led lighting strip |
DE10261183B3 (de) * | 2002-12-20 | 2004-06-03 | Daimlerchrysler Ag | Fahrzeugscheinwerfer mit mehreren zu einem Array zusammengefassten LEDs. |
JP2005063995A (ja) * | 2003-08-08 | 2005-03-10 | John Popovich | 発光ダイオードストリップランプ |
JP4556166B2 (ja) * | 2004-07-29 | 2010-10-06 | ライツ・アドバンスト・テクノロジー株式会社 | 光源装置 |
JP2007112299A (ja) * | 2005-10-20 | 2007-05-10 | Fujikura Ltd | 照明装置用フレキシブル配線基板 |
DE102006033894B4 (de) | 2005-12-16 | 2019-05-09 | Osram Gmbh | Beleuchtungseinrichtung und Anzeigegerät mit einer Beleuchtungseinrichtung |
JP4300223B2 (ja) * | 2006-06-30 | 2009-07-22 | 株式会社 日立ディスプレイズ | 照明装置および照明装置を用いた表示装置 |
US8210723B2 (en) | 2007-06-29 | 2012-07-03 | Dialight Corporation | LED lens array optic with a highly uniform illumination pattern |
CN101364585B (zh) * | 2008-09-25 | 2010-10-13 | 旭丽电子(广州)有限公司 | 一种芯片封装结构及其制造方法 |
DE102008063369B4 (de) | 2008-12-30 | 2016-12-15 | Erco Gmbh | Leuchte und Modulsystem für Leuchten |
JP4621779B2 (ja) | 2009-02-17 | 2011-01-26 | シャープ株式会社 | 照明デバイスおよび該照明デバイスを使用した照明装置 |
WO2010094141A1 (en) | 2009-02-20 | 2010-08-26 | Phoster Industries | Glare reduction in led lighting systems |
EP2413392A4 (en) * | 2009-03-24 | 2013-12-18 | Kang Kim | LIGHT EMITTING DIODE HOUSING |
US9035328B2 (en) * | 2011-02-04 | 2015-05-19 | Cree, Inc. | Light-emitting diode component |
JP2012049367A (ja) * | 2010-08-27 | 2012-03-08 | Kyocera Elco Corp | 半導体発光素子取付用モジュール、半導体発光素子モジュール、半導体発光素子照明器具、及び、半導体発光素子取付用モジュールの製造方法 |
US9786811B2 (en) * | 2011-02-04 | 2017-10-10 | Cree, Inc. | Tilted emission LED array |
US20120300456A1 (en) * | 2011-05-26 | 2012-11-29 | Phillips Iii William E | Reflectors optimized for led lighting fixture |
US9495018B2 (en) * | 2011-11-01 | 2016-11-15 | Qualcomm Incorporated | System and method for improving orientation data |
KR101990339B1 (ko) | 2012-03-30 | 2019-10-01 | 루미리즈 홀딩 비.브이. | 스트레칭된 리드프레임 아키텍처를 위한 사전 회전되는 오버몰딩된 양방향 확산 렌즈 |
US9395074B2 (en) * | 2012-04-13 | 2016-07-19 | Cree, Inc. | LED lamp with LED assembly on a heat sink tower |
-
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---|---|---|---|---|
JP2017224856A (ja) * | 2012-03-30 | 2017-12-21 | コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. | 伸張リードフレームアーキテクチャ用の予め回転されたオーバーモールド双方向性拡散レンズ |
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US20180358525A1 (en) | 2018-12-13 |
CN104204652A (zh) | 2014-12-10 |
WO2013144858A1 (en) | 2013-10-03 |
US9997684B2 (en) | 2018-06-12 |
CN104204652B (zh) | 2018-12-14 |
EP2831493A1 (en) | 2015-02-04 |
ES2590857T3 (es) | 2016-11-23 |
US10249807B2 (en) | 2019-04-02 |
KR101990339B1 (ko) | 2019-10-01 |
JP2015511774A (ja) | 2015-04-20 |
EP2831493B1 (en) | 2016-07-27 |
JP6515271B2 (ja) | 2019-05-22 |
US20150084070A1 (en) | 2015-03-26 |
JP2017224856A (ja) | 2017-12-21 |
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