JP2021504920A - 発光素子及び照明装置のための支持体 - Google Patents
発光素子及び照明装置のための支持体 Download PDFInfo
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- JP2021504920A JP2021504920A JP2020529623A JP2020529623A JP2021504920A JP 2021504920 A JP2021504920 A JP 2021504920A JP 2020529623 A JP2020529623 A JP 2020529623A JP 2020529623 A JP2020529623 A JP 2020529623A JP 2021504920 A JP2021504920 A JP 2021504920A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/19—Attachment of light sources or lamp holders
- F21S41/192—Details of lamp holders, terminals or connectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
- F21S41/141—Light emitting diodes [LED]
- F21S41/151—Light emitting diodes [LED] arranged in one or more lines
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
- F21S45/40—Cooling of lighting devices
- F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/119—Details of rigid insulating substrates therefor, e.g. three-dimensional details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
- F21Y2107/40—Light sources with three-dimensionally disposed light-generating elements on the sides of polyhedrons, e.g. cubes or pyramids
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
Abstract
Description
Claims (18)
- 発光素子のための支持体であって:
少なくとも1つの取り付け面を有する取り付け部であって、前記少なくとも1つの取り付け面は、配置方向を有し、前記配置方向に沿って配置される少なくとも1つの発光素子を収容するために構成される、取り付け部と;
前記取り付け部に隣接して配置される本体部と;
前記本体部から前記少なくとも1つの取り付け面への電気的接続を提供するための導体と;
を備え、
前記少なくとも1つの取り付け面は、前記配置方向に沿って少なくとも3つの交互接触部を備え、各交互接触部は、導体に対応し、接触部のペアは、それぞれの絶縁部によって分離され、
前記本体部は、前記少なくとも1つの取り付け面から側方に突出し、
前記取り付け部は、導体と絶縁層の層状構造を有し、前記絶縁層は、それぞれの絶縁部を形成し、
前記導体と絶縁層の層状構造は、前記本体部の長さが前記配置方向と実質的に平行に延びるよう傾斜部を備える、
支持体。 - 前記本体部は、少なくとも部分的に、前記取り付け部からの距離が長くなるにつれて大きくなる断面積を有する断面、特に少なくとも部分的に三角形断面を有し、前記取り付け部は、前記三角形断面のエッジに配置されている、
請求項1に記載の支持体。 - 前記三角形断面は、0°〜90°、特に30°〜45°の開口角を有する、
請求項2に記載の支持体。 - 前記導体は、金属シート材料、特に銅ベースのシート材料を含む、
請求項1乃至3のいずれかに記載の支持体。 - 前記金属シート材料は、主面及び側面を含み、前記接触部の各々は、少なくとも部分的に、金属シート材料の側面によってそれぞれ形成される、
請求項4に記載の支持体。 - 前記取り付け部内における、前記導体、特に金属シート材料と絶縁層との層状構造の延長方向は、前記少なくとも1つの取り付け面の前記配置方向に対して実質的に垂直又は実質的に平行に延びる、
請求項1乃至5のいずれかに記載の支持体。 - 前記取り付け部は、互いに隣接して配置される少なくとも2つの取り付け面を備え、かつ/又は
少なくとも2つの取り付け面が、互いに角度をもって又は互いに実質的に平行に配置される、
請求項1乃至6のいずれかに記載の支持体。 - 前記取り付け部は、3つの取り付け面を備え、前記3つの取り付け面のうちの1つは、他の2つの取り付け面の間に配置され、特に、45°〜135°、特に45°〜75°の囲み角度で又は他の2つの取り付け面に対して実質的に垂直に配置される、
請求項7に記載の支持体。 - 前記少なくとも1つの取り付け面は、前記配置方向に沿って配置される複数の発光素子を収容するために構成される、
請求項1乃至8のいずれかに記載の支持体。 - 照明装置であって:
請求項1乃至9のいずれかに記載の支持体と;
前記少なくとも1つの取り付け面の前記配置方向に沿って取り付けられた少なくとも1つの発光素子と;
を備え、前記少なくとも1つの発光素子は、少なくとも2つの接触部に電気的に接触している、
照明装置。 - 電源に接続するためのソケットを更に備え、前記ソケットは前記本体部に接続される、
請求項10に記載の照明装置。 - 照明装置、特に請求項10又は11に記載の照明装置を製造する方法であって:
請求項1乃至9のいずれか1項に記載の支持体を提供するステップと;
前記少なくとも1つの取り付け面の前記配置方向に沿って少なくとも1つの発光素子を取り付けるステップと;
を含み、前記少なくとも1つの発光素子を、接触部に電気的に接触させる、
方法。 - 前記支持体を提供するステップは、金属シートの積層と、前記金属シートの間に絶縁層を配置することを含む、
請求項12に記載の方法。 - 前記金属シートは、傾斜部を形成するように、特に実質的に垂直な角度で屈曲される、
請求項13に記載の方法。 - 前記支持体を提供するステップは、特に金属シートの積層後に、材料除去を含む、
請求項12乃至14のいずれかに記載の方法。 - 前記少なくとも1つの発光素子を取り付けるステップは、
前記少なくとも1つの発光素子を支持層上に着脱可能に固定するステップと、
前記少なくとも1つの発光素子に接触材料を塗布するステップと、
前記支持層上に固定された前記少なくとも1つの発光素子を、前記少なくとも1つの取り付け面に適用するステップであって、前記接触材料は、前記少なくとも1つの発光素子を前記接触部に接続する、ステップと、
を含む、請求項12乃至15のいずれかに記載の方法。 - 前記支持層上に固定された少なくとも1つの発光素子を、前記少なくとも1つの取り付け面に適用することは、前記少なくとも1つの取り付け面の形状に一致するように前記支持層を屈曲させることを含み、
前記支持層は、特に材料の減少又は穿孔のような材料の弱化の、少なくとも1つの所定の屈曲線を有する、
請求項16に記載の方法。 - 前記支持層上に固定された少なくとも1つの発光素子を、前記少なくとも1つの取り付け面に適用することは、前記支持層の切断を含む、
請求項16又は17に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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EP18193218 | 2018-09-07 | ||
EP18193218.7 | 2018-09-07 | ||
PCT/EP2019/072250 WO2020048766A1 (en) | 2018-09-07 | 2019-08-20 | Support for light-emitting elements and lighting device |
Publications (2)
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JP2021504920A true JP2021504920A (ja) | 2021-02-15 |
JP6880328B2 JP6880328B2 (ja) | 2021-06-02 |
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JP2020529623A Active JP6880328B2 (ja) | 2018-09-07 | 2019-08-20 | 発光素子及び照明装置のための支持体 |
Country Status (6)
Country | Link |
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US (1) | US11266017B2 (ja) |
EP (1) | EP3669118B1 (ja) |
JP (1) | JP6880328B2 (ja) |
KR (1) | KR102204216B1 (ja) |
CN (1) | CN111226072B (ja) |
WO (1) | WO2020048766A1 (ja) |
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KR20220032083A (ko) | 2019-07-08 | 2022-03-15 | 루미리즈 홀딩 비.브이. | 발광 엘리먼트들을 위한 지지체 및 라이팅 디바이스 |
EP3819533A1 (en) * | 2019-11-06 | 2021-05-12 | Lumileds Holding B.V. | Carrier for lighting modules and lighting device |
WO2021225804A1 (en) * | 2020-05-07 | 2021-11-11 | Lumileds Llc | Lighting device comprising support structure with improved thermal and optical properties |
EP3907428B1 (en) | 2020-05-07 | 2023-09-27 | Lumileds LLC | Retrofit lighting device with improved thermal properties |
EP3945240A1 (en) * | 2020-07-28 | 2022-02-02 | Lumileds LLC | Lighting device for being mounted to an optical element |
EP4295077A1 (en) | 2021-02-16 | 2023-12-27 | Lumileds LLC | Lighting device, method of manufacturing a lighting device and automotive headlamp |
EP4295405A1 (en) * | 2021-02-16 | 2023-12-27 | Lumileds LLC | Method for manufacturing light emitting elements, light emitting element, lighting device and automotive headlamp |
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2019
- 2019-08-20 EP EP19753401.9A patent/EP3669118B1/en active Active
- 2019-08-20 KR KR1020207010167A patent/KR102204216B1/ko active IP Right Grant
- 2019-08-20 WO PCT/EP2019/072250 patent/WO2020048766A1/en unknown
- 2019-08-20 JP JP2020529623A patent/JP6880328B2/ja active Active
- 2019-08-20 CN CN201980005213.4A patent/CN111226072B/zh active Active
- 2019-09-06 US US16/563,516 patent/US11266017B2/en active Active
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JP2013521613A (ja) * | 2010-03-03 | 2013-06-10 | クリー インコーポレイテッド | Ledベースのペデスタル型の照明構造 |
JP2013069837A (ja) * | 2011-09-22 | 2013-04-18 | Citizen Electronics Co Ltd | 発光モジュール |
JP2013093130A (ja) * | 2011-10-24 | 2013-05-16 | Citizen Electronics Co Ltd | Ledランプ |
JP2013098060A (ja) * | 2011-11-02 | 2013-05-20 | Citizen Electronics Co Ltd | Ledランプ |
JP2014120388A (ja) * | 2012-12-18 | 2014-06-30 | Life Elex Inc | 車両用照明装置の光源ユニット |
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KR20200041388A (ko) | 2020-04-21 |
CN111226072B (zh) | 2021-07-13 |
KR102204216B1 (ko) | 2021-01-20 |
US20200084889A1 (en) | 2020-03-12 |
CN111226072A (zh) | 2020-06-02 |
EP3669118B1 (en) | 2021-02-24 |
WO2020048766A1 (en) | 2020-03-12 |
US11266017B2 (en) | 2022-03-01 |
EP3669118A1 (en) | 2020-06-24 |
JP6880328B2 (ja) | 2021-06-02 |
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