JP4113099B2 - 半導体基板の表面に金属層を堆積する方法 - Google Patents
半導体基板の表面に金属層を堆積する方法 Download PDFInfo
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- JP4113099B2 JP4113099B2 JP2003375645A JP2003375645A JP4113099B2 JP 4113099 B2 JP4113099 B2 JP 4113099B2 JP 2003375645 A JP2003375645 A JP 2003375645A JP 2003375645 A JP2003375645 A JP 2003375645A JP 4113099 B2 JP4113099 B2 JP 4113099B2
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- containing precursor
- halogen
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 133
- 239000002184 metal Substances 0.000 title claims abstract description 133
- 239000000758 substrate Substances 0.000 title claims abstract description 62
- 238000000034 method Methods 0.000 title claims description 136
- 239000004065 semiconductor Substances 0.000 title claims description 24
- 238000000151 deposition Methods 0.000 title claims description 18
- 239000002243 precursor Substances 0.000 claims abstract description 133
- 150000005309 metal halides Chemical class 0.000 claims abstract description 79
- 229910001507 metal halide Inorganic materials 0.000 claims abstract description 76
- 229910052736 halogen Inorganic materials 0.000 claims abstract description 67
- 150000002367 halogens Chemical class 0.000 claims abstract description 66
- 239000003638 chemical reducing agent Substances 0.000 claims abstract description 31
- 239000010949 copper Substances 0.000 claims description 110
- 229910052802 copper Inorganic materials 0.000 claims description 66
- 230000008569 process Effects 0.000 claims description 64
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 58
- 230000004888 barrier function Effects 0.000 claims description 38
- -1 silicon halide compound Chemical class 0.000 claims description 31
- 125000000217 alkyl group Chemical group 0.000 claims description 23
- 150000001875 compounds Chemical class 0.000 claims description 21
- 125000003118 aryl group Chemical group 0.000 claims description 19
- 239000002253 acid Substances 0.000 claims description 14
- 238000006243 chemical reaction Methods 0.000 claims description 13
- 239000001257 hydrogen Substances 0.000 claims description 12
- 229910052739 hydrogen Inorganic materials 0.000 claims description 12
- 229910002065 alloy metal Inorganic materials 0.000 claims description 11
- UCXUKTLCVSGCNR-UHFFFAOYSA-N diethylsilane Chemical group CC[SiH2]CC UCXUKTLCVSGCNR-UHFFFAOYSA-N 0.000 claims description 11
- 229910052799 carbon Inorganic materials 0.000 claims description 9
- 125000001424 substituent group Chemical group 0.000 claims description 9
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims description 8
- 125000003342 alkenyl group Chemical group 0.000 claims description 7
- 125000000304 alkynyl group Chemical group 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 7
- 229910052757 nitrogen Inorganic materials 0.000 claims description 7
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical class [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 claims description 7
- 125000004665 trialkylsilyl group Chemical group 0.000 claims description 7
- 125000005106 triarylsilyl group Chemical group 0.000 claims description 7
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 claims description 6
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 6
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical class [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims description 6
- 150000001336 alkenes Chemical class 0.000 claims description 6
- 125000002947 alkylene group Chemical group 0.000 claims description 6
- 229910002091 carbon monoxide Inorganic materials 0.000 claims description 6
- 150000001993 dienes Chemical class 0.000 claims description 6
- 229910000077 silane Inorganic materials 0.000 claims description 6
- 125000003545 alkoxy group Chemical group 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- 150000002527 isonitriles Chemical class 0.000 claims description 5
- 239000003446 ligand Substances 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 229910052718 tin Inorganic materials 0.000 claims description 5
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- UORVGPXVDQYIDP-UHFFFAOYSA-N borane Chemical compound B UORVGPXVDQYIDP-UHFFFAOYSA-N 0.000 claims description 4
- 229910000071 diazene Inorganic materials 0.000 claims description 4
- 229910052733 gallium Inorganic materials 0.000 claims description 4
- 229910000078 germane Inorganic materials 0.000 claims description 4
- 229910052741 iridium Inorganic materials 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 125000005389 trialkylsiloxy group Chemical group 0.000 claims description 4
- 229910052727 yttrium Inorganic materials 0.000 claims description 4
- MEOSMFUUJVIIKB-UHFFFAOYSA-N [W].[C] Chemical compound [W].[C] MEOSMFUUJVIIKB-UHFFFAOYSA-N 0.000 claims description 3
- 150000004703 alkoxides Chemical class 0.000 claims description 3
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical compound [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 2
- 229910000086 alane Inorganic materials 0.000 claims description 2
- 125000005262 alkoxyamine group Chemical group 0.000 claims description 2
- 150000001408 amides Chemical class 0.000 claims description 2
- 229910000085 borane Inorganic materials 0.000 claims description 2
- 229910052796 boron Inorganic materials 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229910052763 palladium Inorganic materials 0.000 claims description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-M phenolate Chemical compound [O-]C1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-M 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 229910052702 rhenium Inorganic materials 0.000 claims description 2
- 229910052703 rhodium Inorganic materials 0.000 claims description 2
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical class [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 claims description 2
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims 3
- 150000003482 tantalum compounds Chemical class 0.000 claims 2
- 150000003609 titanium compounds Chemical class 0.000 claims 2
- 229910052707 ruthenium Inorganic materials 0.000 claims 1
- 229910021332 silicide Inorganic materials 0.000 claims 1
- 150000003606 tin compounds Chemical class 0.000 claims 1
- 239000012808 vapor phase Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 154
- 238000000231 atomic layer deposition Methods 0.000 description 44
- 239000010409 thin film Substances 0.000 description 35
- 238000012545 processing Methods 0.000 description 25
- 239000002356 single layer Substances 0.000 description 23
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 19
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 16
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 15
- 229910000041 hydrogen chloride Inorganic materials 0.000 description 15
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 15
- 239000000463 material Substances 0.000 description 14
- 241000894007 species Species 0.000 description 14
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 13
- 239000012691 Cu precursor Substances 0.000 description 12
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 10
- 230000015572 biosynthetic process Effects 0.000 description 10
- 239000007789 gas Substances 0.000 description 10
- 150000004820 halides Chemical class 0.000 description 10
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 9
- 238000005229 chemical vapour deposition Methods 0.000 description 9
- 239000003153 chemical reaction reagent Substances 0.000 description 8
- 239000010408 film Substances 0.000 description 8
- 238000006722 reduction reaction Methods 0.000 description 8
- 239000007787 solid Substances 0.000 description 8
- 239000012159 carrier gas Substances 0.000 description 7
- 230000008021 deposition Effects 0.000 description 7
- 230000009467 reduction Effects 0.000 description 7
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 7
- 229910021591 Copper(I) chloride Inorganic materials 0.000 description 6
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 6
- 238000010926 purge Methods 0.000 description 6
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 239000004020 conductor Substances 0.000 description 5
- 238000000921 elemental analysis Methods 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 239000002244 precipitate Substances 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 4
- 150000007513 acids Chemical class 0.000 description 4
- 239000000460 chlorine Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 229910001092 metal group alloy Inorganic materials 0.000 description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 238000001179 sorption measurement Methods 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 4
- 229910018512 Al—OH Inorganic materials 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 3
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 3
- 239000005751 Copper oxide Substances 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000003877 atomic layer epitaxy Methods 0.000 description 3
- 239000006227 byproduct Substances 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 229910000431 copper oxide Inorganic materials 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 238000002149 energy-dispersive X-ray emission spectroscopy Methods 0.000 description 3
- 125000005843 halogen group Chemical group 0.000 description 3
- 150000002431 hydrogen Chemical class 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 239000012299 nitrogen atmosphere Substances 0.000 description 3
- 230000000087 stabilizing effect Effects 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 2
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- DTQVDTLACAAQTR-UHFFFAOYSA-N Trifluoroacetic acid Chemical compound OC(=O)C(F)(F)F DTQVDTLACAAQTR-UHFFFAOYSA-N 0.000 description 2
- 239000002099 adlayer Substances 0.000 description 2
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- ILAHWRKJUDSMFH-UHFFFAOYSA-N boron tribromide Chemical compound BrB(Br)Br ILAHWRKJUDSMFH-UHFFFAOYSA-N 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- SOYVLBDERBHIME-UHFFFAOYSA-N chloro(diethyl)silicon Chemical compound CC[Si](Cl)CC SOYVLBDERBHIME-UHFFFAOYSA-N 0.000 description 2
- IJOOHPMOJXWVHK-UHFFFAOYSA-N chlorotrimethylsilane Chemical compound C[Si](C)(C)Cl IJOOHPMOJXWVHK-UHFFFAOYSA-N 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- QAMFBRUWYYMMGJ-UHFFFAOYSA-N hexafluoroacetylacetone Chemical compound FC(F)(F)C(=O)CC(=O)C(F)(F)F QAMFBRUWYYMMGJ-UHFFFAOYSA-N 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
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- 229910052715 tantalum Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- LALRXNPLTWZJIJ-UHFFFAOYSA-N triethylborane Chemical compound CCB(CC)CC LALRXNPLTWZJIJ-UHFFFAOYSA-N 0.000 description 2
- VXEGSRKPIUDPQT-UHFFFAOYSA-N 4-[4-(4-methoxyphenyl)piperazin-1-yl]aniline Chemical compound C1=CC(OC)=CC=C1N1CCN(C=2C=CC(N)=CC=2)CC1 VXEGSRKPIUDPQT-UHFFFAOYSA-N 0.000 description 1
- 239000005046 Chlorosilane Substances 0.000 description 1
- 239000005749 Copper compound Substances 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910000570 Cupronickel Inorganic materials 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 208000033962 Fontaine progeroid syndrome Diseases 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-N Hydrogen bromide Chemical compound Br CPELXLSAUQHCOX-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
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- 229910008482 TiSiN Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910008807 WSiN Inorganic materials 0.000 description 1
- GPWHDDKQSYOYBF-UHFFFAOYSA-N ac1l2u0q Chemical compound Br[Br-]Br GPWHDDKQSYOYBF-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- CECABOMBVQNBEC-UHFFFAOYSA-K aluminium iodide Chemical compound I[Al](I)I CECABOMBVQNBEC-UHFFFAOYSA-K 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
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- 150000001491 aromatic compounds Chemical class 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- YMEKEHSRPZAOGO-UHFFFAOYSA-N boron triiodide Chemical compound IB(I)I YMEKEHSRPZAOGO-UHFFFAOYSA-N 0.000 description 1
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- 239000001569 carbon dioxide Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
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- 150000001879 copper Chemical class 0.000 description 1
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- SBTSVTLGWRLWOD-UHFFFAOYSA-L copper(ii) triflate Chemical compound [Cu+2].[O-]S(=O)(=O)C(F)(F)F.[O-]S(=O)(=O)C(F)(F)F SBTSVTLGWRLWOD-UHFFFAOYSA-L 0.000 description 1
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- GCSJLQSCSDMKTP-UHFFFAOYSA-N ethenyl(trimethyl)silane Chemical compound C[Si](C)(C)C=C GCSJLQSCSDMKTP-UHFFFAOYSA-N 0.000 description 1
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- 238000002474 experimental method Methods 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- UPWPDUACHOATKO-UHFFFAOYSA-K gallium trichloride Chemical compound Cl[Ga](Cl)Cl UPWPDUACHOATKO-UHFFFAOYSA-K 0.000 description 1
- 238000002290 gas chromatography-mass spectrometry Methods 0.000 description 1
- 150000008282 halocarbons Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
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- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 230000036571 hydration Effects 0.000 description 1
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- 229930195733 hydrocarbon Natural products 0.000 description 1
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- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical compound I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
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- QRXWMOHMRWLFEY-UHFFFAOYSA-N isoniazide Chemical compound NNC(=O)C1=CC=NC=C1 QRXWMOHMRWLFEY-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
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- 150000002825 nitriles Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000013110 organic ligand Substances 0.000 description 1
- 229910052762 osmium Inorganic materials 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
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- 238000002360 preparation method Methods 0.000 description 1
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- 125000001453 quaternary ammonium group Chemical group 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
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- 238000007789 sealing Methods 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- AIFMYMZGQVTROK-UHFFFAOYSA-N silicon tetrabromide Chemical compound Br[Si](Br)(Br)Br AIFMYMZGQVTROK-UHFFFAOYSA-N 0.000 description 1
- 239000005049 silicon tetrachloride Substances 0.000 description 1
- JHGCXUUFRJCMON-UHFFFAOYSA-J silicon(4+);tetraiodide Chemical compound [Si+4].[I-].[I-].[I-].[I-] JHGCXUUFRJCMON-UHFFFAOYSA-J 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000006557 surface reaction Methods 0.000 description 1
- PUGUQINMNYINPK-UHFFFAOYSA-N tert-butyl 4-(2-chloroacetyl)piperazine-1-carboxylate Chemical compound CC(C)(C)OC(=O)N1CCN(C(=O)CCl)CC1 PUGUQINMNYINPK-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- XJDNKRIXUMDJCW-UHFFFAOYSA-J titanium tetrachloride Chemical compound Cl[Ti](Cl)(Cl)Cl XJDNKRIXUMDJCW-UHFFFAOYSA-J 0.000 description 1
- FAQYAMRNWDIXMY-UHFFFAOYSA-N trichloroborane Chemical compound ClB(Cl)Cl FAQYAMRNWDIXMY-UHFFFAOYSA-N 0.000 description 1
- ITMCEJHCFYSIIV-UHFFFAOYSA-N triflic acid Chemical compound OS(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-N 0.000 description 1
- WRTMQOHKMFDUKX-UHFFFAOYSA-N triiodide Chemical compound I[I-]I WRTMQOHKMFDUKX-UHFFFAOYSA-N 0.000 description 1
- 239000005051 trimethylchlorosilane Substances 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
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Description
M及びM’は、それぞれ、金属、例えばCu、Ag、Au、Оs又はIrであり、
X及びX’は、それぞれ、N又はОであり、
Y及びY’は、それぞれ、Si、C、Sn、Ge、B又はAlであり、
Z及びZ’は、それぞれ、C、N又はОであり、
R1、R2、R1’及びR2’は、アルキル、アルキニル、アルケニル、部分フッ素化アルキル、アリール、アルキル置換アリール、部分フッ素化アリール、フルオロアルキル置換アリール、トリアルキルシリル又はトリアリールシリルの任意の組み合わせであることができ、
R3、R4、R3’及びR4’は、水素、アルキル、部分フッ素化アルキル、トリアルキルシリル、トリアリールシリル、トリアルキルシロキシ、トリアリールシロキシ、アリール、アルキル置換アリール、部分フッ素化アリール、フルオロアルキル置換アリール又はアルコキシの任意の組み合わせであることができ、そして
R5、R6、R5’及びR6’は、水素、アルケニル、アルキニル、アルキル、部分フッ素化アルキル、アリール、アルキル置換アリール、部分フッ素化アリール、フルオロアルキル置換アリール、トリアルキルシリル、トリアリールシリル、トリアルキルシロキシ、トリアリールシロキシ、アルコキシ、SiR7R8N(R9R10)基又はSiR7R8ОR11基(式中、R7、R8、R9、R10及びR11はアルキルであることができる)の任意の組み合わせであることができる。これらの置換基のすべてにおいて、アルキル及びアルコキシは1〜8個の炭素を有することができ、アルケニル及びアルキニルはそれぞれ2〜8個の炭素を有することができ、アリールは6個の炭素を有することができる。また、式中のX及びX’がОである態様の場合、上式は上記した置換基R1及びR1’を担持するだけである。式中のZ及びZ’がОである態様の場合、置換基R5、R6、R5’及びR6’は存在しない。式中のZ及びZ’がNである態様の場合、置換基R6及びR6’は存在しない。元素X/X’、Y/Y’及び(又は)Z/Z’がそれぞれ置換基の対R1/R2及び対R1’/R2’、対R3/R4及び対R3’/R4’及び(又は)対R5/R6及び対R5’/R6’を有する任意の態様の場合、このような対を有する成分は、互いに独立して一緒に結合して、環構造体を形成することができる。また、置換基の対R7及びR8及び対R9及びR10を含む成分も、一緒に結合して環構造体を形成することができる。例えば、式中のX及びX’がNである態様において、対の成分R1及びR2は、対の成分R1’及びR2’ができるのと同じように、一緒に結合して環構造体を形成することができる。金属含有前駆体の別の例は、その製造方法とともに、番号を参照してその全文を本願明細書に記載したものとする、米国特許出願公開第2002/0013487号公報及び本願の譲受人に対して譲渡された米国特許出願(番号未定;代理人整理番号:06023P2)に示されている。
テトラヒドロフランに溶解したCu(I)(hfac)(tmvs)の塩化水素による処理
本発明の譲受人の1部門であるSchumacher, Inc.からCupraSelectTMとして商業的に入手可能な、23.2gの量のCu(I)(hfac)(tmvs)を、窒素雰囲気下で攪拌しながら、約250mlの量の溶媒、テトラヒドロフラン(THF)に溶解して溶液を調製した。室温で攪拌しながら、1モル当量の塩化水素(HCl)(ジエチルエーテル中で2.0M)を溶液に徐々に添加した。HClの添加の結果、白色の塩化銅の粉末サンプル、3.67g及び理論値の58%、が瞬時に沈殿した。サンプルをろ過し、ポンプ乾燥した。次いで、この工程全体を繰り返して合計で2種類の塩化銅のサンプルを得た。
実施例2
THFに溶解した[-CuNMe2SiMe2CH2CuNMe2SiMe2CH2-]のHClによる処理
米国特許出願公開第2002/0013487号公報に開示されている1方法に従って調製した6.9gの量の[-CuNMe2SiMe2CH2CuNMe2SiMe2CH2-]を、窒素雰囲気下で攪拌しながら、約100mlの量のTHFに溶解して反応混合物を得た。室温で攪拌しながら、2モル当量のHCl(ジエチルエーテル中で2.0M)を反応混合物に添加した。得られた反応性生物から塩化銅の沈殿サンプル、3.02g及び理論値の78%、が得られた。サンプルをろ過し、ポンプ乾燥した。
実施例3
Cu(I)(hfac)(tmvs)及び塩化水素を使用したCuCl膜の成長とそれに引き続くジエチルシラン還元によるALDでのCu膜の作製
TiNの200Å厚の拡散層を被覆した3”×0.5”のシリコンウエハを、引き続いて大気圧でハロゲン含有前駆体、窒素及び金属含有前駆体で処理室のパージを行うための三方混合弁を備えた処理室を含むALD反応装置の処理室に収容した。25℃の温度でウエハを保持した。窒素雰囲気下、銅の前駆体Cu(I)(hfac)(tmvs)を15℃の温度まで冷却した。銅の前駆体からの蒸気を大気圧の処理室に、約1,800立方センチメートル毎秒(sccm)の流量で2秒間にわたって導入した。次いで、処理室の窒素ガスを1,800sccmの流量で約50秒間にわたってフラッシュして残っていたCu(I)(hfac)(tmvs)蒸気を除去した。次いで、テトラヒドロフラン溶媒中に無水HClを含む0.5Mの溶液からの蒸気を処理室に、1,800sccmで1秒間にわたって導入した。処理室を窒素ガスで約50秒間のパルスでもってフラッシュして残余のHCl蒸気を除去した。次いで、銅の前駆体の蒸気を2秒間にわたってパルス導入し、約20〜30nmの薄膜が形成されるまで、約250サイクルにわたって上記サイクルを繰り返した。
105…導電性層
110…埋め込み領域
120…バリア層
130…金属層(シード層)
140…バルク導電性材料
Claims (27)
- 半導体基板の表面に金属層を堆積する方法であって、
前記表面の少なくとも一部の上で、ハロゲン含有前駆体及び金属含有前駆体から金属ハライド層をALD又はCVDプロセスで成長させること、及び
前記金属ハライド層を還元剤に曝露して前記金属層を提供すること
を含みかつ、その際、
前記成長工程が、
前記表面の少なくとも一部の上でハロゲン含有前駆体を化学吸着させること、及び
前記表面の少なくとも一部の上で金属含有前駆体を化学吸着させること
を含み、前記前駆体内の金属とハロゲンを反応させて前記金属ハライド層を形成すること、及び
前記ALDプロセスを行うときには、前記ハロゲン含有前駆体及び前記金属含有前駆体を順次供給して前記金属ハライド層を形成し、かつ
前記CVDプロセスを行うときには、前記ハロゲン含有前駆体及び前記金属含有前駆体を共反応させて前記金属ハライド層を形成すること、
を特徴とする、方法。 - 前記ハロゲン含有前駆体が、ハロゲン含有酸、ハロゲン含有シラン、アルキルクロロシラン、アルキルブロモシラン、アルキルヨードシラン、シリコンハライド化合物、ハロゲン化錫化合物、ゲルマン化合物、三ハロゲン化ホウ素化合物、アルキルアルミニウムハライド化合物、アルミニウムハライド化合物、ガリウムハライド化合物又はその組み合わせからなる群からの少なくとも一員である、請求項1に記載の方法。
- 前記ハロゲン含有前駆体がハロゲン含有酸である、請求項2に記載の方法。
- 前記ハロゲン含有前駆体がHClである、請求項3に記載の方法。
- 前記金属含有前駆体が銅を含む、請求項1〜4のいずれか1項に記載の方法。
- 前記金属含有前駆体が、Cu(I)β−ジケトネート(L)(式中、(L)は、オレフィン、ジエン、シリルオレフィン、シリルアルキレンのアルキレン、イソニトリル、一酸化炭素及びトリアルキルホスフィンから選ばれた安定化配位子である)、Cu(II)ビス(β−ジケトネート)、Cu(II)ビス(β−ジイミン)、Cu(I)β−ジイミン(L)(式中、(L)は、オレフィン、シリルオレフィン、シリルアルキレンのアルキレン、ジエン、イソニトリル、一酸化炭素及びトリアルキルホスフィンから選ばれた安定化配位子である)、Cu(I)アルコキシド、Cu(I)アミド、Cu(II)β−ケトイミン、Cu(I)β−ケトイミン(L)(式中、(L)は、オレフィン、シリルオレフィン、シリルアルキレンのアルキレン、ジエン、イソニトリル、一酸化炭素及びトリアルキルホスフィンから選ばれた配位子である)、Cu(II)ビス(アルコキシアミン)、Cu(I)アルキル、Cu(I)アリール又はCu(I)フェノキシドからなる群からの少なくとも一員である、請求項5に記載の方法。
- 前記金属含有前駆体が、次の構造式によって表される少なくとも1種類の化合物を含む、請求項1〜6のいずれか1項に記載の方法:
M及びM’は、それぞれ、Cu、Ag、Au、Оs又はIrであり、
X及びX’は、それぞれ、N又はОであり、
Y及びY’は、それぞれ、Si、C、Sn、Ge、B又はAlであり、
Z及びZ’は、それぞれ、C、N又はОであり、
R1、R2、R1’及びR2’は、それぞれ独立して、アルキル、アルケニル、アルキニル、部分フッ素化アルキル、アリール、アルキル置換アリール、部分フッ素化アリール、フルオロアルキル置換アリール、トリアルキルシリルであり、あるいはX及びX’がNである時にトリアリールシリルであり、
R1及びR1’は、それぞれ独立して、アルキル、アルケニル、アルキニル、部分フッ素化アルキル、アリール、アルキル置換アリール、部分フッ素化アリール、フルオロアルキル置換アリール、トリアルキルシリルであり、あるいはX及びX’がОである時にトリアリールシリルであり、
R3、R4、R3’及びR4’は、それぞれ独立して、水素、アルキル、部分フッ素化アルキル、トリアルキルシリル、トリアリールシリル、トリアルキルシロキシ、トリアリールシロキシ、アリール、アルキル置換アリール、部分フッ素化アリール、フルオロアルキル置換アリール又はアルコキシであり、
R5、R6、R5’及びR6’は、それぞれ独立して、水素、アルキル、アルケニル、アルキニル、部分フッ素化アルキル、アリール、アルキル置換アリール、部分フッ素化アリール、フルオロアルキル置換アリール、トリアルキルシロキシ、トリアリールシロキシ、トリアルキルシリル、トリアリールシリルもしくはアルコキシ、SiR7R8N(R9R10)基又はSiR7R8ОR11基であり、式中のR7、R8、R9、R10及びR11はアルキルであることができ、
但し、X及びX’がそれぞれОである場合、R2及びR2’のところには置換基は存在せず、
また、Z及びZ’がそれぞれNである場合、R6及びR6’のところには置換基は存在せず、
さらに、Z及びZ’がそれぞれОである場合、R5、R6、R5’又はR6’のところには置換基は存在せず、そして
前記アルキル及びアルコキシドは1〜8個の炭素を有し、前記アルケニル及びアルキニルは2〜8個の炭素を有し、かつ前記アリールは6個の炭素を有する)。 - 前記半導体基板がバリア層を有し、このバリア層の上に前記金属ハライド層が成長せしめられる、請求項1〜7のいずれか1項に記載の方法。
- 前記バリア層が、窒化チタン化合物、チタン化合物、窒化タンタル化合物、タングステン窒化炭素化合物、タンタル化合物、前記のシリサイド化合物又はその混合物からなる群から選ばれた少なくとも一員である、請求項8に記載の方法。
- 前記還元剤が、水素、シラン、ボラン、アラン、ゲルマン、ヒドラジン又はその混合物からなる群から選ばれた少なくとも一員である、請求項1〜9のいずれか1項に記載の方法。
- 前記還元剤がシランである、請求項10に記載の方法。
- 前記還元剤がジエチルシランである、請求項11に記載の方法。
- 前記成長工程の完結に先がけて前記曝露工程を実施する、請求項1〜12のいずれか1項に記載の方法。
- 前記成長工程の完結の後に前記曝露工程を実施する、請求項1〜12のいずれか1項に記載の方法。
- 基板の表面に金属層を形成する方法であって、
前記表面をハロゲン含有前駆体及び金属含有前駆体と接触させることによって金属ハライド層をALD又はCVDプロセスで成長させ、その際、前記前駆体中のハロゲン及び金属を反応させて前記金属ハライド層を形成すること、及び
前記金属ハライド層を還元剤に曝露して前記金属層を提供すること
を含んでなる、方法。 - 合金金属含有前駆体から合金金属ハライド層を成長させる工程をさらに含み、その際、前記合金金属含有前駆体の金属は、前記金属含有前駆体の金属とは異なるものとする、請求項15に記載の方法。
- 前記合金金属含有前駆体が、Ag、Au、Оs、Ir、Pt、Pd、Rh、Re、Ni、Cо、Ru又はその組み合わせからなる群からの少なくとも一員である、請求項15又は16に記載の方法。
- 前記第2の成長工程を前記曝露工程に先がけて実施する、請求項15〜17のいずれか1項に記載の方法。
- 前記成膜工程の完結に先がけて前記曝露工程を実施する、請求項15〜17のいずれか1項に記載の方法。
- 前記成膜工程の完結の後に前記曝露工程を実施する、請求項15〜17のいずれか1項に記載の方法。
- 半導体基板の表面に金属層を堆積する方法であって、
前記表面の少なくとも一部の上で、酸を含むハロゲン含有前駆体及び金属含有前駆体から金属ハライド層をALD又はCVDプロセスで成長させ、その際、前記半導体基板がバリア層を有し、このバリア層の上に前記金属ハライド層が成長せしめられること、及び
前記金属ハライド層を還元剤に曝露して前記金属層を提供すること
を含んでなる、方法。 - 前記酸が、ハロゲン化水素酸又はフッ素化された酸からなる群から選ばれた少なくとも一員である、請求項21に記載の方法。
- 前記バリア層が、窒化チタン化合物、チタン化合物、窒化タンタル化合物、タングステン窒化炭素化合物、タンタル化合物、前記のシリサイド化合物又はその混合物からなる群から選ばれた少なくとも1種の化合物である、請求項21に記載の方法。
- 基板の表面の少なくとも一部に金属層を堆積する方法であって、
内部に前記基板を収容した反応室にハロゲン含有前駆体及び金属含有前駆体の蒸気相パルスを交番的に導入して金属ハライド層を提供すること、及び
前記金属ハライド層を還元剤に曝露して前記金属層を提供すること
を含んでなる、方法。 - 物品の表面に金属層を堆積する方法であって、
その物品の表面の少なくとも一部の上で、ハロゲン含有前駆体及び金属含有前駆体を含む複数の前駆体から金属ハライド層をALD又はCVDプロセスで成長させ、その際、前記ハロゲン含有前駆体は、金属を実質的に含まないか、さもなければ前記金属層のものとは異なる金属を含有すること、及び
前記金属ハライド層を還元剤に曝露して前記金属層を提供すること
を含んでなる、方法。 - 前記成長工程における前記複数の前駆体が合金金属含有前駆体をさらに含んでいる、請求項25に記載の方法。
- 少なくとも1種の金属を含む金属層を物品の表面に形成する方法であって、
その物品の表面の上で、その表面にハロゲン含有前駆体、金属含有前駆体、及び任意に合金金属含有前駆体を接触させることによって金属ハライド層をALD又はCVDプロセスで成長させ、その際、前記前駆体内のハロゲン、金属及び任意に合金金属を反応させて金属ハライド層を形成させ、かつ前記ハロゲン含有前駆体は、金属を実質的に含まないか、さもなければ前記金属層のものとは異なる金属を含有すること、及び
前記金属ハライド層を還元剤に曝露して前記金属層を提供すること
を含んでなる、方法。
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US28790302A | 2002-11-05 | 2002-11-05 | |
US10/324,781 US6869876B2 (en) | 2002-11-05 | 2002-12-20 | Process for atomic layer deposition of metal films |
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EP (1) | EP1426463B1 (ja) |
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AT (1) | ATE381628T1 (ja) |
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Families Citing this family (73)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6727169B1 (en) * | 1999-10-15 | 2004-04-27 | Asm International, N.V. | Method of making conformal lining layers for damascene metallization |
US7494927B2 (en) * | 2000-05-15 | 2009-02-24 | Asm International N.V. | Method of growing electrical conductors |
US7049226B2 (en) * | 2001-09-26 | 2006-05-23 | Applied Materials, Inc. | Integration of ALD tantalum nitride for copper metallization |
US6989172B2 (en) * | 2003-01-27 | 2006-01-24 | Micell Technologies, Inc. | Method of coating microelectronic substrates |
US7205960B2 (en) | 2003-02-19 | 2007-04-17 | Mirage Innovations Ltd. | Chromatic planar optic display system |
US7534967B2 (en) * | 2003-02-25 | 2009-05-19 | University Of North Texas | Conductor structures including penetrable materials |
US6951813B2 (en) * | 2003-04-04 | 2005-10-04 | Micron Technology, Inc. | Methods of forming metal-containing layers including a metal bonded to halogens and trialkylaluminum |
US7311946B2 (en) * | 2003-05-02 | 2007-12-25 | Air Products And Chemicals, Inc. | Methods for depositing metal films on diffusion barrier layers by CVD or ALD processes |
US7067407B2 (en) * | 2003-08-04 | 2006-06-27 | Asm International, N.V. | Method of growing electrical conductors |
US7048968B2 (en) * | 2003-08-22 | 2006-05-23 | Micron Technology, Inc. | Methods of depositing materials over substrates, and methods of forming layers over substrates |
KR100528069B1 (ko) * | 2003-09-02 | 2005-11-15 | 동부아남반도체 주식회사 | 반도체 소자 및 그 제조 방법 |
US7312163B2 (en) * | 2003-09-24 | 2007-12-25 | Micron Technology, Inc. | Atomic layer deposition methods, and methods of forming materials over semiconductor substrates |
US20050085031A1 (en) * | 2003-10-15 | 2005-04-21 | Applied Materials, Inc. | Heterogeneous activation layers formed by ionic and electroless reactions used for IC interconnect capping layers |
US7419702B2 (en) * | 2004-03-31 | 2008-09-02 | Tokyo Electron Limited | Method for processing a substrate |
US20080166870A1 (en) * | 2004-06-04 | 2008-07-10 | International Business Machines Corporation | Fabrication of Interconnect Structures |
KR100602087B1 (ko) * | 2004-07-09 | 2006-07-14 | 동부일렉트로닉스 주식회사 | 반도체 소자 및 그 제조방법 |
US7294851B2 (en) * | 2004-11-03 | 2007-11-13 | Infineon Technologies Ag | Dense seed layer and method of formation |
US7205422B2 (en) * | 2004-12-30 | 2007-04-17 | Air Products And Chemicals, Inc. | Volatile metal β-ketoiminate and metal β-diiminate complexes |
US7034169B1 (en) | 2004-12-30 | 2006-04-25 | Air Products And Chemicals, Inc. | Volatile metal β-ketoiminate complexes |
US8025922B2 (en) | 2005-03-15 | 2011-09-27 | Asm International N.V. | Enhanced deposition of noble metals |
US7666773B2 (en) * | 2005-03-15 | 2010-02-23 | Asm International N.V. | Selective deposition of noble metal thin films |
US7573640B2 (en) * | 2005-04-04 | 2009-08-11 | Mirage Innovations Ltd. | Multi-plane optical apparatus |
US8435905B2 (en) * | 2005-06-13 | 2013-05-07 | Hitachi Kokusai Electric Inc. | Manufacturing method of semiconductor device, and substrate processing apparatus |
US20070014919A1 (en) * | 2005-07-15 | 2007-01-18 | Jani Hamalainen | Atomic layer deposition of noble metal oxides |
US7314828B2 (en) * | 2005-07-19 | 2008-01-01 | Taiwan Semiconductor Manufacturing Company, Ltd. | Repairing method for low-k dielectric materials |
US20070054048A1 (en) * | 2005-09-07 | 2007-03-08 | Suvi Haukka | Extended deposition range by hot spots |
EP1942364A1 (en) | 2005-09-14 | 2008-07-09 | Mirage Innovations Ltd. | Diffractive optical relay and method for manufacturing the same |
EP1932051A1 (en) * | 2005-09-14 | 2008-06-18 | Mirage Innovations Ltd. | Diffraction grating with a spatially varying duty-cycle |
US20080043334A1 (en) * | 2006-08-18 | 2008-02-21 | Mirage Innovations Ltd. | Diffractive optical relay and method for manufacturing the same |
WO2007052265A2 (en) * | 2005-11-03 | 2007-05-10 | Mirage Innovations Ltd. | Binocular optical relay device |
JP4975414B2 (ja) * | 2005-11-16 | 2012-07-11 | エーエスエム インターナショナル エヌ.ヴェー. | Cvd又はaldによる膜の堆積のための方法 |
WO2008023375A1 (en) * | 2006-08-23 | 2008-02-28 | Mirage Innovations Ltd. | Diffractive optical relay device with improved color uniformity |
US7435484B2 (en) * | 2006-09-01 | 2008-10-14 | Asm Japan K.K. | Ruthenium thin film-formed structure |
KR100807216B1 (ko) * | 2006-09-29 | 2008-02-28 | 삼성전자주식회사 | 두께 균일성을 향상할 수 있는 박막 형성 장치 및 방법 |
US7692222B2 (en) * | 2006-11-07 | 2010-04-06 | Raytheon Company | Atomic layer deposition in the formation of gate structures for III-V semiconductor |
US20080124484A1 (en) * | 2006-11-08 | 2008-05-29 | Asm Japan K.K. | Method of forming ru film and metal wiring structure |
US8017182B2 (en) * | 2007-06-21 | 2011-09-13 | Asm International N.V. | Method for depositing thin films by mixed pulsed CVD and ALD |
US7638170B2 (en) * | 2007-06-21 | 2009-12-29 | Asm International N.V. | Low resistivity metal carbonitride thin film deposition by atomic layer deposition |
US20100302644A1 (en) * | 2007-09-18 | 2010-12-02 | Mirage Innovations Ltd | Slanted optical device |
US8017183B2 (en) * | 2007-09-26 | 2011-09-13 | Eastman Kodak Company | Organosiloxane materials for selective area deposition of inorganic materials |
US20090087339A1 (en) * | 2007-09-28 | 2009-04-02 | Asm Japan K.K. | METHOD FOR FORMING RUTHENIUM COMPLEX FILM USING Beta-DIKETONE-COORDINATED RUTHENIUM PRECURSOR |
US8263795B2 (en) * | 2007-11-05 | 2012-09-11 | Air Products And Chemicals, Inc. | Copper precursors for thin film deposition |
US20090130466A1 (en) * | 2007-11-16 | 2009-05-21 | Air Products And Chemicals, Inc. | Deposition Of Metal Films On Diffusion Layers By Atomic Layer Deposition And Organometallic Precursor Complexes Therefor |
US9157150B2 (en) * | 2007-12-04 | 2015-10-13 | Cypress Semiconductor Corporation | Method of operating a processing chamber used in forming electronic devices |
DE102007058571B4 (de) * | 2007-12-05 | 2012-02-16 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Substrat mit einer Kupfer enthaltenden Beschichtung und Verfahren zu deren Herstellung mittels Atomic Layer Deposition und Verwendung des Verfahrens |
US7655564B2 (en) * | 2007-12-12 | 2010-02-02 | Asm Japan, K.K. | Method for forming Ta-Ru liner layer for Cu wiring |
US8993051B2 (en) | 2007-12-12 | 2015-03-31 | Technische Universiteit Delft | Method for covering particles, especially a battery electrode material particles, and particles obtained with such method and a battery comprising such particle |
KR20090067505A (ko) * | 2007-12-21 | 2009-06-25 | 에이에스엠지니텍코리아 주식회사 | 루테늄막 증착 방법 |
US7799674B2 (en) * | 2008-02-19 | 2010-09-21 | Asm Japan K.K. | Ruthenium alloy film for copper interconnects |
US8084104B2 (en) * | 2008-08-29 | 2011-12-27 | Asm Japan K.K. | Atomic composition controlled ruthenium alloy film formed by plasma-enhanced atomic layer deposition |
US8133555B2 (en) | 2008-10-14 | 2012-03-13 | Asm Japan K.K. | Method for forming metal film by ALD using beta-diketone metal complex |
JP5384291B2 (ja) * | 2008-11-26 | 2014-01-08 | 株式会社日立国際電気 | 半導体装置の製造方法、基板処理方法及び基板処理装置 |
US9379011B2 (en) | 2008-12-19 | 2016-06-28 | Asm International N.V. | Methods for depositing nickel films and for making nickel silicide and nickel germanide |
US8557702B2 (en) * | 2009-02-02 | 2013-10-15 | Asm America, Inc. | Plasma-enhanced atomic layers deposition of conductive material over dielectric layers |
CN102414797A (zh) * | 2009-04-29 | 2012-04-11 | 应用材料公司 | 在HVPE中形成原位预GaN沉积层的方法 |
US20110020546A1 (en) * | 2009-05-15 | 2011-01-27 | Asm International N.V. | Low Temperature ALD of Noble Metals |
US8329569B2 (en) * | 2009-07-31 | 2012-12-11 | Asm America, Inc. | Deposition of ruthenium or ruthenium dioxide |
KR101958606B1 (ko) * | 2010-07-06 | 2019-03-14 | 아토테크 도이칠란드 게엠베하 | 인쇄회로기판의 제조 방법 |
US20120070981A1 (en) * | 2010-09-17 | 2012-03-22 | Clendenning Scott B | Atomic layer deposition of a copper-containing seed layer |
US8871617B2 (en) | 2011-04-22 | 2014-10-28 | Asm Ip Holding B.V. | Deposition and reduction of mixed metal oxide thin films |
US9005705B2 (en) * | 2011-09-14 | 2015-04-14 | Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V. | Method for the production of a substrate having a coating comprising copper, and coated substrate and device prepared by this method |
CN110592554A (zh) * | 2013-06-26 | 2019-12-20 | 应用材料公司 | 沉积金属合金膜的方法 |
CN105492656B (zh) * | 2013-06-28 | 2018-03-23 | 韦恩州立大学 | 作为用于在衬底上形成层的还原剂的二(三甲基甲硅烷基)六元环系统和相关化合物 |
JP6147693B2 (ja) * | 2014-03-31 | 2017-06-14 | 株式会社日立国際電気 | 半導体装置の製造方法、基板処理装置、およびプログラム |
US9607842B1 (en) | 2015-10-02 | 2017-03-28 | Asm Ip Holding B.V. | Methods of forming metal silicides |
TWI784036B (zh) * | 2017-08-30 | 2022-11-21 | 荷蘭商Asm智慧財產控股公司 | 層形成方法 |
KR102103346B1 (ko) * | 2017-11-15 | 2020-04-22 | 에스케이트리켐 주식회사 | 박막 증착용 전구체 용액 및 이를 이용한 박막 형성 방법. |
KR20210031492A (ko) * | 2018-07-12 | 2021-03-19 | 바스프 에스이 | 금속 또는 반금속-함유 필름의 제조 방법 |
CN109273402B (zh) * | 2018-09-13 | 2020-08-25 | 德淮半导体有限公司 | 金属阻挡层的制作方法、金属互连结构及其制作方法 |
JP2020132904A (ja) * | 2019-02-13 | 2020-08-31 | 東京エレクトロン株式会社 | 基板処理方法及び基板処理装置 |
CN112652677B (zh) * | 2020-12-09 | 2023-10-27 | 晋能光伏技术有限责任公司 | 一种perc电池背面钝化工艺 |
TW202235654A (zh) * | 2021-02-16 | 2022-09-16 | 美商應用材料股份有限公司 | 用於原子層沉積之還原劑 |
US20230317634A1 (en) * | 2022-04-05 | 2023-10-05 | Applied Materials, Inc. | Coatings with diffusion barriers for corrosion and contamination protection |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6482262B1 (en) * | 1959-10-10 | 2002-11-19 | Asm Microchemistry Oy | Deposition of transition metal carbides |
US5306666A (en) | 1992-07-24 | 1994-04-26 | Nippon Steel Corporation | Process for forming a thin metal film by chemical vapor deposition |
EP1266054B1 (en) | 2000-03-07 | 2006-12-20 | Asm International N.V. | Graded thin films |
US6482740B2 (en) | 2000-05-15 | 2002-11-19 | Asm Microchemistry Oy | Method of growing electrical conductors by reducing metal oxide film with organic compound containing -OH, -CHO, or -COOH |
US6482733B2 (en) | 2000-05-15 | 2002-11-19 | Asm Microchemistry Oy | Protective layers prior to alternating layer deposition |
US6368954B1 (en) | 2000-07-28 | 2002-04-09 | Advanced Micro Devices, Inc. | Method of copper interconnect formation using atomic layer copper deposition |
US6951804B2 (en) | 2001-02-02 | 2005-10-04 | Applied Materials, Inc. | Formation of a tantalum-nitride layer |
US20020117399A1 (en) | 2001-02-23 | 2002-08-29 | Applied Materials, Inc. | Atomically thin highly resistive barrier layer in a copper via |
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