JP4109135B2 - 難エッチング材のエッチング方法 - Google Patents

難エッチング材のエッチング方法 Download PDF

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Publication number
JP4109135B2
JP4109135B2 JP2003039795A JP2003039795A JP4109135B2 JP 4109135 B2 JP4109135 B2 JP 4109135B2 JP 2003039795 A JP2003039795 A JP 2003039795A JP 2003039795 A JP2003039795 A JP 2003039795A JP 4109135 B2 JP4109135 B2 JP 4109135B2
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Prior art keywords
etching
mask
taper angle
etched
difficult
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Expired - Fee Related
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Japanese (ja)
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JP2003264171A (ja
JP2003264171A5 (enExample
Inventor
信行 三瀬
健 吉岡
良司 西尾
建人 臼井
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Hitachi High Tech Corp
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Hitachi High Technologies Corp
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JP2003039795A 2003-02-18 2003-02-18 難エッチング材のエッチング方法 Expired - Fee Related JP4109135B2 (ja)

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JP2003039795A JP4109135B2 (ja) 2003-02-18 2003-02-18 難エッチング材のエッチング方法

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Application Number Priority Date Filing Date Title
JP2003039795A JP4109135B2 (ja) 2003-02-18 2003-02-18 難エッチング材のエッチング方法

Related Parent Applications (1)

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JP2002061328A Division JP3840123B2 (ja) 2002-03-07 2002-03-07 難エッチング材のエッチング方法

Publications (3)

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JP2003264171A JP2003264171A (ja) 2003-09-19
JP2003264171A5 JP2003264171A5 (enExample) 2005-08-25
JP4109135B2 true JP4109135B2 (ja) 2008-07-02

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JP2003039795A Expired - Fee Related JP4109135B2 (ja) 2003-02-18 2003-02-18 難エッチング材のエッチング方法

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Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7358192B2 (en) * 2004-04-08 2008-04-15 Applied Materials, Inc. Method and apparatus for in-situ film stack processing
JP4653426B2 (ja) 2004-06-25 2011-03-16 セイコーエプソン株式会社 半導体装置
JP4905969B2 (ja) * 2007-03-08 2012-03-28 株式会社アルバック 磁気デバイスの製造装置
JP2011091374A (ja) * 2009-09-11 2011-05-06 Samco Inc サファイア基板のエッチング方法
US11119405B2 (en) 2018-10-12 2021-09-14 Applied Materials, Inc. Techniques for forming angled structures

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Publication number Publication date
JP2003264171A (ja) 2003-09-19

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