JP4105613B2 - 基板処理装置 - Google Patents

基板処理装置 Download PDF

Info

Publication number
JP4105613B2
JP4105613B2 JP2003312301A JP2003312301A JP4105613B2 JP 4105613 B2 JP4105613 B2 JP 4105613B2 JP 2003312301 A JP2003312301 A JP 2003312301A JP 2003312301 A JP2003312301 A JP 2003312301A JP 4105613 B2 JP4105613 B2 JP 4105613B2
Authority
JP
Japan
Prior art keywords
detection
substrate
slit nozzle
processing apparatus
detection sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003312301A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005085773A (ja
Inventor
善則 高木
賢太郎 西岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Holdings Co Ltd
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Screen Holdings Co Ltd
Dainippon Screen Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Screen Holdings Co Ltd, Dainippon Screen Manufacturing Co Ltd filed Critical Screen Holdings Co Ltd
Priority to JP2003312301A priority Critical patent/JP4105613B2/ja
Priority to TW093120783A priority patent/TWI289481B/zh
Priority to CNB2004100575147A priority patent/CN1315583C/zh
Priority to KR1020040069948A priority patent/KR100701518B1/ko
Publication of JP2005085773A publication Critical patent/JP2005085773A/ja
Application granted granted Critical
Publication of JP4105613B2 publication Critical patent/JP4105613B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Nonlinear Science (AREA)
  • Coating Apparatus (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Materials For Photolithography (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2003312301A 2003-09-04 2003-09-04 基板処理装置 Expired - Fee Related JP4105613B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2003312301A JP4105613B2 (ja) 2003-09-04 2003-09-04 基板処理装置
TW093120783A TWI289481B (en) 2003-09-04 2004-07-12 Substrate processing apparatus
CNB2004100575147A CN1315583C (zh) 2003-09-04 2004-08-12 基板处理装置
KR1020040069948A KR100701518B1 (ko) 2003-09-04 2004-09-02 기판처리장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003312301A JP4105613B2 (ja) 2003-09-04 2003-09-04 基板処理装置

Publications (2)

Publication Number Publication Date
JP2005085773A JP2005085773A (ja) 2005-03-31
JP4105613B2 true JP4105613B2 (ja) 2008-06-25

Family

ID=34413594

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003312301A Expired - Fee Related JP4105613B2 (ja) 2003-09-04 2003-09-04 基板処理装置

Country Status (4)

Country Link
JP (1) JP4105613B2 (ko)
KR (1) KR100701518B1 (ko)
CN (1) CN1315583C (ko)
TW (1) TWI289481B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101413217B (zh) * 2007-10-15 2013-07-24 拜耳材料科技股份有限公司 具有粘弹阻尼性能的地板覆盖物

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101146437B1 (ko) * 2005-06-30 2012-05-21 엘지디스플레이 주식회사 코팅장비 및 그 운용방법
JP4803714B2 (ja) * 2005-09-21 2011-10-26 東京応化工業株式会社 塗布装置及び塗布方法
JP4587950B2 (ja) * 2005-12-22 2010-11-24 大日本スクリーン製造株式会社 基板処理装置
JP2007250851A (ja) * 2006-03-16 2007-09-27 Dainippon Screen Mfg Co Ltd 基板処理装置、基板処理システムおよび基板処理方法
KR101267530B1 (ko) * 2008-04-30 2013-05-23 엘지디스플레이 주식회사 포토레지스트 코팅장비 및 방법
JP5304474B2 (ja) * 2009-06-22 2013-10-02 東京エレクトロン株式会社 液処理装置、液処理方法及び記憶媒体
JP5679866B2 (ja) * 2011-02-28 2015-03-04 東レエンジニアリング株式会社 塗布装置および塗布方法
JP6319193B2 (ja) * 2015-06-03 2018-05-09 東京エレクトロン株式会社 基板処理装置及び基板処理方法
CN109482423B (zh) * 2017-09-12 2021-05-18 南昌欧菲生物识别技术有限公司 超声波传感器制造方法及涂布机台
JP6869279B2 (ja) * 2019-02-19 2021-05-12 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
CN110000046A (zh) * 2019-04-29 2019-07-12 华工制造装备数字化国家工程中心有限公司 一种用于硬质载体的液体涂布设备及方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2740588B2 (ja) * 1991-07-24 1998-04-15 日立テクノエンジニアリング株式会社 塗布描画装置
JPH05293417A (ja) * 1992-04-20 1993-11-09 Nissan Motor Co Ltd 粘性材料の塗布パターン検査装置
US5830297A (en) * 1995-07-24 1998-11-03 Matsushita Electric Industrial Co., Ltd. Method and apparatus for application of adhesive
JPH09329423A (ja) * 1996-04-09 1997-12-22 Dainippon Screen Mfg Co Ltd レジスト膜の塗布むら検出装置
JP3501599B2 (ja) * 1996-10-23 2004-03-02 キヤノン株式会社 記録装置および吐出不良の検出方法
JPH11300257A (ja) * 1998-04-24 1999-11-02 Toray Ind Inc 凹凸基材への塗液の塗布装置およびプラズマディスプレイの製造装置
JP3653688B2 (ja) * 1998-07-10 2005-06-02 平田機工株式会社 スリットコート式塗布装置とスリットコート式塗布方法
JP3933357B2 (ja) * 1999-09-29 2007-06-20 ローム株式会社 レーザセンサ
JP3820830B2 (ja) * 2000-02-01 2006-09-13 セイコーエプソン株式会社 印刷装置に関する不動作ノズル検出方法および印刷装置、並びにそのためのプログラムを記録した記録媒体
JP4273627B2 (ja) * 2000-04-11 2009-06-03 セイコーエプソン株式会社 焦点を移動させながら行うインク滴吐出検査
JP4325084B2 (ja) * 2000-06-19 2009-09-02 東レ株式会社 塗布方法およびそれを用いたカラーフィルタの製造方法
WO2002053297A1 (fr) * 2000-12-27 2002-07-11 Toray Industries, Inc. Embout buccal et dispositif, et procede d'application d'un fluide de revetement
CN1257799C (zh) * 2001-09-05 2006-05-31 财团法人工业技术研究院 滤色片喷涂制造法及设备

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101413217B (zh) * 2007-10-15 2013-07-24 拜耳材料科技股份有限公司 具有粘弹阻尼性能的地板覆盖物

Also Published As

Publication number Publication date
KR100701518B1 (ko) 2007-03-29
KR20050024266A (ko) 2005-03-10
TW200510077A (en) 2005-03-16
CN1315583C (zh) 2007-05-16
CN1589975A (zh) 2005-03-09
JP2005085773A (ja) 2005-03-31
TWI289481B (en) 2007-11-11

Similar Documents

Publication Publication Date Title
KR100676240B1 (ko) 기판 처리 장치
KR100658460B1 (ko) 기판 처리 장치
JP4105613B2 (ja) 基板処理装置
JP5679866B2 (ja) 塗布装置および塗布方法
US20080024773A1 (en) Surface inspection apparatus and surface inspection method
KR101314017B1 (ko) 광학식 이물질 검출 장치 및 이것을 탑재한 처리액 도포장치
JP2007173387A (ja) 基板処理装置
JP4587950B2 (ja) 基板処理装置
JP3987378B2 (ja) 基板処理装置
JP2011082230A (ja) 基板塗布装置
JP2014065011A (ja) 塗布装置および塗布方法
KR20200085646A (ko) 피가공물의 가공 방법
JP2009115711A (ja) 基板処理装置
KR100921833B1 (ko) 평판디스플레이용 글래스 상부 또는 하부의 이물 검출 장치및 이물 검출 방법
JP4520975B2 (ja) 塗布方法及び塗布装置
JP2007173532A (ja) 基板処理装置
KR100838431B1 (ko) 기판 처리 장치
KR100841203B1 (ko) 기판 처리 장치, 기판 처리 시스템 및 기판 처리 방법
JP2006167610A (ja) 基板処理装置
KR20060081864A (ko) 웨이퍼 이송장치
JP2004081983A (ja) 基板処理装置
JP2010234237A (ja) 塗布装置及び塗布方法
JP2001203254A (ja) 基板搬送装置およびこれを備える露光装置
JP4490803B2 (ja) 基板処理装置
KR20070096683A (ko) 반도체 제조 장치

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20051122

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20070921

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20071002

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20071127

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20071127

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20071225

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080220

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20080318

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20080327

R150 Certificate of patent or registration of utility model

Ref document number: 4105613

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110404

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110404

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110404

Year of fee payment: 3

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120404

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130404

Year of fee payment: 5

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130404

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130404

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140404

Year of fee payment: 6

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees