JP4104070B2 - 基板処理装置及び半導体装置の製造方法及び加熱装置及び断熱材 - Google Patents

基板処理装置及び半導体装置の製造方法及び加熱装置及び断熱材 Download PDF

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Publication number
JP4104070B2
JP4104070B2 JP2004025040A JP2004025040A JP4104070B2 JP 4104070 B2 JP4104070 B2 JP 4104070B2 JP 2004025040 A JP2004025040 A JP 2004025040A JP 2004025040 A JP2004025040 A JP 2004025040A JP 4104070 B2 JP4104070 B2 JP 4104070B2
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Prior art keywords
heat insulating
cooling gas
insulating material
heat generating
peripheral surface
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Expired - Lifetime
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JP2004025040A
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Japanese (ja)
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JP2005217335A5 (enExample
JP2005217335A (ja
Inventor
秀之 塚本
真一 島田
威憲 岡
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Kokusai Denki Electric Inc
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Hitachi Kokusai Electric Inc
Kokusai Denki Electric Inc
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Priority to JP2004025040A priority Critical patent/JP4104070B2/ja
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Publication of JP2005217335A5 publication Critical patent/JP2005217335A5/ja
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JP2004025040A 2004-02-02 2004-02-02 基板処理装置及び半導体装置の製造方法及び加熱装置及び断熱材 Expired - Lifetime JP4104070B2 (ja)

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JP2004025040A JP4104070B2 (ja) 2004-02-02 2004-02-02 基板処理装置及び半導体装置の製造方法及び加熱装置及び断熱材

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JP2004025040A JP4104070B2 (ja) 2004-02-02 2004-02-02 基板処理装置及び半導体装置の製造方法及び加熱装置及び断熱材

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JP2006302826A Division JP4669465B2 (ja) 2006-11-08 2006-11-08 基板処理装置及び半導体装置の製造方法及び加熱装置及び断熱材

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JP2005217335A JP2005217335A (ja) 2005-08-11
JP2005217335A5 JP2005217335A5 (enExample) 2006-12-21
JP4104070B2 true JP4104070B2 (ja) 2008-06-18

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Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4739057B2 (ja) 2006-02-20 2011-08-03 東京エレクトロン株式会社 熱処理装置、ヒータ及びその製造方法
JP5475216B2 (ja) * 2007-02-13 2014-04-16 ラム リサーチ コーポレーション プラズマ発生装置
JP5721219B2 (ja) * 2010-07-09 2015-05-20 株式会社日立国際電気 基板処理装置、半導体装置の製造方法及び加熱装置
JP5274696B2 (ja) * 2012-07-12 2013-08-28 株式会社日立国際電気 断熱構造体、加熱装置、加熱システム、基板処理装置および半導体装置の製造方法
JP6170847B2 (ja) * 2013-03-25 2017-07-26 株式会社日立国際電気 断熱構造体、加熱装置、基板処理装置および半導体装置の製造方法

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