JP4092797B2 - 半導体装置用接着剤シートおよびそれを用いた部品ならびに半導体装置 - Google Patents

半導体装置用接着剤シートおよびそれを用いた部品ならびに半導体装置 Download PDF

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Publication number
JP4092797B2
JP4092797B2 JP33379398A JP33379398A JP4092797B2 JP 4092797 B2 JP4092797 B2 JP 4092797B2 JP 33379398 A JP33379398 A JP 33379398A JP 33379398 A JP33379398 A JP 33379398A JP 4092797 B2 JP4092797 B2 JP 4092797B2
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JP
Japan
Prior art keywords
adhesive layer
semiconductor device
adhesive
layer
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP33379398A
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English (en)
Japanese (ja)
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JP2000164644A (ja
JP2000164644A5 (enExample
Inventor
秀雄 高橋
泰司 澤村
誉悦 白石
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Toray Industries Inc
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Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Priority to JP33379398A priority Critical patent/JP4092797B2/ja
Publication of JP2000164644A publication Critical patent/JP2000164644A/ja
Publication of JP2000164644A5 publication Critical patent/JP2000164644A5/ja
Application granted granted Critical
Publication of JP4092797B2 publication Critical patent/JP4092797B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP33379398A 1998-11-25 1998-11-25 半導体装置用接着剤シートおよびそれを用いた部品ならびに半導体装置 Expired - Lifetime JP4092797B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP33379398A JP4092797B2 (ja) 1998-11-25 1998-11-25 半導体装置用接着剤シートおよびそれを用いた部品ならびに半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33379398A JP4092797B2 (ja) 1998-11-25 1998-11-25 半導体装置用接着剤シートおよびそれを用いた部品ならびに半導体装置

Publications (3)

Publication Number Publication Date
JP2000164644A JP2000164644A (ja) 2000-06-16
JP2000164644A5 JP2000164644A5 (enExample) 2006-01-12
JP4092797B2 true JP4092797B2 (ja) 2008-05-28

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ID=18270027

Family Applications (1)

Application Number Title Priority Date Filing Date
JP33379398A Expired - Lifetime JP4092797B2 (ja) 1998-11-25 1998-11-25 半導体装置用接着剤シートおよびそれを用いた部品ならびに半導体装置

Country Status (1)

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JP (1) JP4092797B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8893639B1 (en) 2013-01-31 2014-11-25 Brp Us Inc. Accessory attachment system for a marine outboard engine

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5375067B2 (ja) * 2008-12-15 2013-12-25 住友ベークライト株式会社 樹脂組成物および樹脂組成物を使用して作製した半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8893639B1 (en) 2013-01-31 2014-11-25 Brp Us Inc. Accessory attachment system for a marine outboard engine

Also Published As

Publication number Publication date
JP2000164644A (ja) 2000-06-16

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