JP4073138B2 - 石英中に含有される金属の分析方法 - Google Patents
石英中に含有される金属の分析方法 Download PDFInfo
- Publication number
- JP4073138B2 JP4073138B2 JP2000029806A JP2000029806A JP4073138B2 JP 4073138 B2 JP4073138 B2 JP 4073138B2 JP 2000029806 A JP2000029806 A JP 2000029806A JP 2000029806 A JP2000029806 A JP 2000029806A JP 4073138 B2 JP4073138 B2 JP 4073138B2
- Authority
- JP
- Japan
- Prior art keywords
- quartz
- analyzing
- layer
- metal
- metal contained
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims description 92
- 239000010453 quartz Substances 0.000 title claims description 80
- 239000002184 metal Substances 0.000 title claims description 56
- 229910052751 metal Inorganic materials 0.000 title claims description 56
- 238000000034 method Methods 0.000 title claims description 38
- 150000002739 metals Chemical class 0.000 title description 2
- 238000004458 analytical method Methods 0.000 claims description 65
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 63
- 238000000354 decomposition reaction Methods 0.000 claims description 63
- 239000000243 solution Substances 0.000 claims description 46
- 238000009792 diffusion process Methods 0.000 claims description 25
- QPJSUIGXIBEQAC-UHFFFAOYSA-N n-(2,4-dichloro-5-propan-2-yloxyphenyl)acetamide Chemical compound CC(C)OC1=CC(NC(C)=O)=C(Cl)C=C1Cl QPJSUIGXIBEQAC-UHFFFAOYSA-N 0.000 claims description 13
- 239000004065 semiconductor Substances 0.000 claims description 11
- 238000001479 atomic absorption spectroscopy Methods 0.000 claims description 8
- 238000001095 inductively coupled plasma mass spectrometry Methods 0.000 claims description 8
- 238000002354 inductively-coupled plasma atomic emission spectroscopy Methods 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 239000011259 mixed solution Substances 0.000 claims description 7
- 238000005530 etching Methods 0.000 claims description 6
- 238000009826 distribution Methods 0.000 claims description 5
- 230000014759 maintenance of location Effects 0.000 claims description 3
- 239000012491 analyte Substances 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 18
- 229910052802 copper Inorganic materials 0.000 description 16
- 239000010949 copper Substances 0.000 description 16
- 239000007788 liquid Substances 0.000 description 10
- 238000002474 experimental method Methods 0.000 description 9
- 238000005259 measurement Methods 0.000 description 9
- 238000011109 contamination Methods 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 8
- 235000012431 wafers Nutrition 0.000 description 8
- 239000000203 mixture Substances 0.000 description 6
- 238000004445 quantitative analysis Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000012795 verification Methods 0.000 description 5
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 4
- 239000013590 bulk material Substances 0.000 description 4
- 238000012864 cross contamination Methods 0.000 description 4
- 238000001514 detection method Methods 0.000 description 4
- 229910017604 nitric acid Inorganic materials 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000010306 acid treatment Methods 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 206010037660 Pyrexia Diseases 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- -1 for example Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000001004 secondary ion mass spectrometry Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Landscapes
- Weting (AREA)
- Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000029806A JP4073138B2 (ja) | 2000-02-07 | 2000-02-07 | 石英中に含有される金属の分析方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000029806A JP4073138B2 (ja) | 2000-02-07 | 2000-02-07 | 石英中に含有される金属の分析方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001223251A JP2001223251A (ja) | 2001-08-17 |
| JP2001223251A5 JP2001223251A5 (enExample) | 2006-03-23 |
| JP4073138B2 true JP4073138B2 (ja) | 2008-04-09 |
Family
ID=18554904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000029806A Expired - Fee Related JP4073138B2 (ja) | 2000-02-07 | 2000-02-07 | 石英中に含有される金属の分析方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4073138B2 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3890047B2 (ja) * | 2003-10-08 | 2007-03-07 | 東京エレクトロン株式会社 | 石英中の金属分析方法及び分析用治具 |
| US8021623B2 (en) | 2003-10-08 | 2011-09-20 | Tokyo Electron Limited | Examination method and examination assistant device for quartz product of semiconductor processing apparatus |
| JP4881656B2 (ja) * | 2006-06-02 | 2012-02-22 | 東京エレクトロン株式会社 | 石英部材の分析方法 |
| JP5101477B2 (ja) * | 2008-12-09 | 2012-12-19 | コバレントマテリアル株式会社 | セラミックス部材の不純物分析方法 |
| JP2011257436A (ja) * | 2011-10-04 | 2011-12-22 | Tokyo Electron Ltd | 石英部材 |
| JP6885287B2 (ja) * | 2017-09-29 | 2021-06-09 | 株式会社Sumco | 石英ルツボの不純物分析方法 |
-
2000
- 2000-02-07 JP JP2000029806A patent/JP4073138B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2001223251A (ja) | 2001-08-17 |
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