JP4067782B2 - 高アスペクト比な貫孔部を有する工業用部品の製造方法 - Google Patents

高アスペクト比な貫孔部を有する工業用部品の製造方法 Download PDF

Info

Publication number
JP4067782B2
JP4067782B2 JP2001131490A JP2001131490A JP4067782B2 JP 4067782 B2 JP4067782 B2 JP 4067782B2 JP 2001131490 A JP2001131490 A JP 2001131490A JP 2001131490 A JP2001131490 A JP 2001131490A JP 4067782 B2 JP4067782 B2 JP 4067782B2
Authority
JP
Japan
Prior art keywords
plate
hole
punch
die
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2001131490A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002160195A (ja
JP2002160195A5 (enExample
Inventor
幸久 武内
裕之 辻
和正 北村
良則 山口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Priority to JP2001131490A priority Critical patent/JP4067782B2/ja
Priority to US09/883,133 priority patent/US6637102B2/en
Priority to DE2001615549 priority patent/DE60115549T2/de
Priority to DE60134435T priority patent/DE60134435D1/de
Priority to EP05026190A priority patent/EP1634683B1/en
Priority to EP20010306147 priority patent/EP1175978B1/en
Priority to CNB011328495A priority patent/CN1144635C/zh
Publication of JP2002160195A publication Critical patent/JP2002160195A/ja
Publication of JP2002160195A5 publication Critical patent/JP2002160195A5/ja
Application granted granted Critical
Publication of JP4067782B2 publication Critical patent/JP4067782B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Landscapes

  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
JP2001131490A 2000-07-19 2001-04-27 高アスペクト比な貫孔部を有する工業用部品の製造方法 Expired - Lifetime JP4067782B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2001131490A JP4067782B2 (ja) 2000-07-19 2001-04-27 高アスペクト比な貫孔部を有する工業用部品の製造方法
US09/883,133 US6637102B2 (en) 2000-07-19 2001-06-15 Process for producing an industrial member having throughholes of high aspect ratio
DE60134435T DE60134435D1 (de) 2000-07-19 2001-07-17 Verfahren zur Herstellung von Werkstücken mit Durchgangslöchern mit hohem Aspektverhältis
EP05026190A EP1634683B1 (en) 2000-07-19 2001-07-17 Method for fabrication of industrial parts having high-aspect-ratio-through-hole section
DE2001615549 DE60115549T2 (de) 2000-07-19 2001-07-17 Verfahren zur Herstellung von Werkstücken mit Durchgangslöchern mit hohem Aspektverhältis
EP20010306147 EP1175978B1 (en) 2000-07-19 2001-07-17 Method for fabrication of industrial parts having high-aspect-ratio through-hole sections
CNB011328495A CN1144635C (zh) 2000-07-19 2001-07-19 加工具有大高宽比通孔的工业部件的方法

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2000-218378 2000-07-19
JP2000218378 2000-07-19
JP2000280573 2000-09-14
JP2000-280573 2000-09-14
JP2001131490A JP4067782B2 (ja) 2000-07-19 2001-04-27 高アスペクト比な貫孔部を有する工業用部品の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2005300918A Division JP2006068900A (ja) 2000-07-19 2005-10-14 高アスペクト比な貫孔部を有する工業用部品の製造方法

Publications (3)

Publication Number Publication Date
JP2002160195A JP2002160195A (ja) 2002-06-04
JP2002160195A5 JP2002160195A5 (enExample) 2005-09-22
JP4067782B2 true JP4067782B2 (ja) 2008-03-26

Family

ID=27344109

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001131490A Expired - Lifetime JP4067782B2 (ja) 2000-07-19 2001-04-27 高アスペクト比な貫孔部を有する工業用部品の製造方法

Country Status (1)

Country Link
JP (1) JP4067782B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4723199B2 (ja) * 2003-06-19 2011-07-13 日本碍子株式会社 筒形圧電アクチュエータ並びに筒形圧電アクチュエータアレイ及び製造方法
JP4847039B2 (ja) 2004-05-28 2011-12-28 日本碍子株式会社 圧電／電歪構造体及び圧電／電歪構造体の製造方法
JP5123491B2 (ja) 2005-06-10 2013-01-23 日本碍子株式会社 積層型圧電／電歪素子
US7443080B2 (en) 2006-01-23 2008-10-28 Ngk Insulators, Ltd. Laminated piezoelectric/electrostrictive device
JP2007260820A (ja) * 2006-03-28 2007-10-11 Ngk Insulators Ltd 高アスペクト比な貫孔部を有する工業用部品の製造方法
US8865121B2 (en) 2009-06-18 2014-10-21 Basf Se Organotemplate-free synthetic process for the production of a zeolitic material

Also Published As

Publication number Publication date
JP2002160195A (ja) 2002-06-04

Similar Documents

Publication Publication Date Title
JP3930300B2 (ja) 打抜同時積層用打抜金型
JP4172920B2 (ja) 打抜加工のカス取り方法及び打抜加工品の製造方法
EP1842634B1 (en) Method of manufacturing industrial component having through holes with high aspect ratio
US6637102B2 (en) Process for producing an industrial member having throughholes of high aspect ratio
JP4067782B2 (ja) 高アスペクト比な貫孔部を有する工業用部品の製造方法
US6502302B2 (en) Process for producing an industrial member having throughholes of high aspect ratio
EP1175978B1 (en) Method for fabrication of industrial parts having high-aspect-ratio through-hole sections
JP2006068900A (ja) 高アスペクト比な貫孔部を有する工業用部品の製造方法
JP3920036B2 (ja) 高アスペクト比な貫孔部を有する工業用部品の製造方法
JPH1158297A (ja) パンチ金型
JP2002160195A5 (enExample)
JP7318877B1 (ja) 積層体の製造装置及び製造方法
JP3036315B2 (ja) 積層セラミック電子部品の製造方法
TWI870876B (zh) 用於形成多層印刷電路板的多層板的系統和方法
JPH11207696A (ja) パンチ金型
JP2002178297A (ja) 穴明け用金型
JP3880612B1 (ja) 母板加工用金型、加工板の製造方法、及び製品板の製造方法
JPH0445902A (ja) 多層セラミックス基板の積層方法
JP2002052540A (ja) 積層金型の生産方法
JP2009043449A (ja) フラット配線用中間導体の製法及びフラット配線の製法
JPH10172861A (ja) セラミック電子部品の製造方法およびセラミックブロックのカット方法
CN117672898A (zh) 磁性电子元件的巨量转移方法及装置
JP2003158040A (ja) 積層セラミック電子部品のプレス装置
JP2006332635A (ja) セラミック電子部品の製造方法及び製造装置
JP2000122020A (ja) シート材の打ち抜きカス除去方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20050128

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20050411

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20070611

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20070703

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070727

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20080108

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20080109

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110118

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

Ref document number: 4067782

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120118

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130118

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140118

Year of fee payment: 6

EXPY Cancellation because of completion of term