JP4056112B2 - マグネトロンスパッタ装置 - Google Patents

マグネトロンスパッタ装置 Download PDF

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Publication number
JP4056112B2
JP4056112B2 JP23638197A JP23638197A JP4056112B2 JP 4056112 B2 JP4056112 B2 JP 4056112B2 JP 23638197 A JP23638197 A JP 23638197A JP 23638197 A JP23638197 A JP 23638197A JP 4056112 B2 JP4056112 B2 JP 4056112B2
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JP
Japan
Prior art keywords
target
magnetic circuit
substrate
magnetron sputtering
film thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP23638197A
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English (en)
Japanese (ja)
Other versions
JPH1180943A (ja
JPH1180943A5 (enExample
Inventor
博 早田
政秀 横山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP23638197A priority Critical patent/JP4056112B2/ja
Publication of JPH1180943A publication Critical patent/JPH1180943A/ja
Publication of JPH1180943A5 publication Critical patent/JPH1180943A5/ja
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Publication of JP4056112B2 publication Critical patent/JP4056112B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Physical Vapour Deposition (AREA)
JP23638197A 1997-09-02 1997-09-02 マグネトロンスパッタ装置 Expired - Fee Related JP4056112B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23638197A JP4056112B2 (ja) 1997-09-02 1997-09-02 マグネトロンスパッタ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23638197A JP4056112B2 (ja) 1997-09-02 1997-09-02 マグネトロンスパッタ装置

Publications (3)

Publication Number Publication Date
JPH1180943A JPH1180943A (ja) 1999-03-26
JPH1180943A5 JPH1180943A5 (enExample) 2005-06-02
JP4056112B2 true JP4056112B2 (ja) 2008-03-05

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ID=16999952

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23638197A Expired - Fee Related JP4056112B2 (ja) 1997-09-02 1997-09-02 マグネトロンスパッタ装置

Country Status (1)

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JP (1) JP4056112B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2317537A1 (en) * 2009-10-29 2011-05-04 Applied Materials, Inc. Sputter deposition system and method
CN103290378B (zh) * 2013-05-30 2015-09-30 江西沃格光电股份有限公司 磁控溅射镀膜阴极机构
CN113737143A (zh) * 2021-08-24 2021-12-03 北海惠科半导体科技有限公司 磁控溅射装置

Also Published As

Publication number Publication date
JPH1180943A (ja) 1999-03-26

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