JP4013432B2 - 半導体パッケージ - Google Patents

半導体パッケージ Download PDF

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Publication number
JP4013432B2
JP4013432B2 JP2000002594A JP2000002594A JP4013432B2 JP 4013432 B2 JP4013432 B2 JP 4013432B2 JP 2000002594 A JP2000002594 A JP 2000002594A JP 2000002594 A JP2000002594 A JP 2000002594A JP 4013432 B2 JP4013432 B2 JP 4013432B2
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JP
Japan
Prior art keywords
cavity
semiconductor package
holes
back conductive
dielectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2000002594A
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English (en)
Japanese (ja)
Other versions
JP2001196500A5 (enrdf_load_stackoverflow
JP2001196500A (ja
Inventor
努 田牧
輝雄 古屋
吉弘 坪田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
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Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2000002594A priority Critical patent/JP4013432B2/ja
Publication of JP2001196500A publication Critical patent/JP2001196500A/ja
Publication of JP2001196500A5 publication Critical patent/JP2001196500A5/ja
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Publication of JP4013432B2 publication Critical patent/JP4013432B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2000002594A 2000-01-11 2000-01-11 半導体パッケージ Expired - Fee Related JP4013432B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000002594A JP4013432B2 (ja) 2000-01-11 2000-01-11 半導体パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000002594A JP4013432B2 (ja) 2000-01-11 2000-01-11 半導体パッケージ

Publications (3)

Publication Number Publication Date
JP2001196500A JP2001196500A (ja) 2001-07-19
JP2001196500A5 JP2001196500A5 (enrdf_load_stackoverflow) 2006-12-21
JP4013432B2 true JP4013432B2 (ja) 2007-11-28

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ID=18531684

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000002594A Expired - Fee Related JP4013432B2 (ja) 2000-01-11 2000-01-11 半導体パッケージ

Country Status (1)

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JP (1) JP4013432B2 (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1775765B1 (en) * 2004-06-28 2018-05-02 Mitsubishi Electric Corporation Multilayer dielectric substrate and semiconductor package
KR100650732B1 (ko) 2004-12-28 2006-11-27 주식회사 하이닉스반도체 스택 칩 패키지
JP5132760B2 (ja) * 2008-03-17 2013-01-30 三菱電機株式会社 多層誘電体基板および半導体パッケージ
JP5377096B2 (ja) 2008-09-08 2013-12-25 株式会社東芝 高周波パッケージ装置およびその製造方法

Also Published As

Publication number Publication date
JP2001196500A (ja) 2001-07-19

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