JP3999309B2 - 高輝度単一モードvcsel - Google Patents
高輝度単一モードvcsel Download PDFInfo
- Publication number
- JP3999309B2 JP3999309B2 JP16219597A JP16219597A JP3999309B2 JP 3999309 B2 JP3999309 B2 JP 3999309B2 JP 16219597 A JP16219597 A JP 16219597A JP 16219597 A JP16219597 A JP 16219597A JP 3999309 B2 JP3999309 B2 JP 3999309B2
- Authority
- JP
- Japan
- Prior art keywords
- refractive index
- mirror
- control layer
- vcsel
- loss
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000003287 optical effect Effects 0.000 claims description 264
- 239000000463 material Substances 0.000 claims description 96
- 239000003989 dielectric material Substances 0.000 claims description 40
- 239000004065 semiconductor Substances 0.000 claims description 33
- 230000003667 anti-reflective effect Effects 0.000 claims description 28
- 230000002093 peripheral effect Effects 0.000 claims description 28
- 238000009792 diffusion process Methods 0.000 claims description 9
- 230000002265 prevention Effects 0.000 claims 1
- 239000010410 layer Substances 0.000 description 341
- 238000002310 reflectometry Methods 0.000 description 66
- 229920002120 photoresistant polymer Polymers 0.000 description 32
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 17
- 238000000034 method Methods 0.000 description 17
- 230000008569 process Effects 0.000 description 13
- 230000015572 biosynthetic process Effects 0.000 description 12
- 238000005253 cladding Methods 0.000 description 11
- 230000007423 decrease Effects 0.000 description 10
- 239000000758 substrate Substances 0.000 description 10
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 239000000377 silicon dioxide Substances 0.000 description 8
- 235000012239 silicon dioxide Nutrition 0.000 description 8
- 239000002019 doping agent Substances 0.000 description 7
- 238000005530 etching Methods 0.000 description 7
- 229910052581 Si3N4 Inorganic materials 0.000 description 6
- 229910004298 SiO 2 Inorganic materials 0.000 description 6
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 6
- 238000009826 distribution Methods 0.000 description 5
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 4
- 229910010413 TiO 2 Inorganic materials 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000004408 titanium dioxide Substances 0.000 description 4
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000737 periodic effect Effects 0.000 description 3
- 230000007480 spreading Effects 0.000 description 3
- 238000003892 spreading Methods 0.000 description 3
- 239000002344 surface layer Substances 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- -1 hydrogen ions Chemical class 0.000 description 2
- 238000007373 indentation Methods 0.000 description 2
- 238000010849 ion bombardment Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 2
- 238000001451 molecular beam epitaxy Methods 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- XKRFYHLGVUSROY-UHFFFAOYSA-N argon Substances [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000001427 coherent effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
- H01S5/18386—Details of the emission surface for influencing the near- or far-field, e.g. a grating on the surface
- H01S5/18388—Lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S2301/00—Functional characteristics
- H01S2301/16—Semiconductor lasers with special structural design to influence the modes, e.g. specific multimode
- H01S2301/166—Single transverse or lateral mode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/1089—Unstable resonators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
- H01S5/18308—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] having a special structure for lateral current or light confinement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
- H01S5/18308—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] having a special structure for lateral current or light confinement
- H01S5/18322—Position of the structure
- H01S5/18327—Structure being part of a DBR
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
- H01S5/18361—Structure of the reflectors, e.g. hybrid mirrors
- H01S5/18369—Structure of the reflectors, e.g. hybrid mirrors based on dielectric materials
- H01S5/18372—Structure of the reflectors, e.g. hybrid mirrors based on dielectric materials by native oxidation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/2054—Methods of obtaining the confinement
- H01S5/2059—Methods of obtaining the confinement by means of particular conductivity zones, e.g. obtained by particle bombardment or diffusion
- H01S5/2063—Methods of obtaining the confinement by means of particular conductivity zones, e.g. obtained by particle bombardment or diffusion obtained by particle bombardment
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/667,259 US5838715A (en) | 1996-06-20 | 1996-06-20 | High intensity single-mode VCSELs |
| US667,259 | 1996-06-20 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPH1056233A JPH1056233A (ja) | 1998-02-24 |
| JPH1056233A5 JPH1056233A5 (enExample) | 2005-04-21 |
| JP3999309B2 true JP3999309B2 (ja) | 2007-10-31 |
Family
ID=24677489
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16219597A Expired - Lifetime JP3999309B2 (ja) | 1996-06-20 | 1997-06-19 | 高輝度単一モードvcsel |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US5838715A (enExample) |
| JP (1) | JP3999309B2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20200169061A1 (en) * | 2017-07-18 | 2020-05-28 | Sony Corporation | Light emitting element and light emitting element array |
Families Citing this family (95)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2783210B2 (ja) * | 1995-09-04 | 1998-08-06 | 日本電気株式会社 | 面発光型ダイオード |
| KR100258927B1 (ko) * | 1996-10-29 | 2000-06-15 | 윤종용 | 다중 트랙 스캔 가능한 호환형 광픽업장치 |
| US6243407B1 (en) * | 1997-03-21 | 2001-06-05 | Novalux, Inc. | High power laser devices |
| US6124912A (en) * | 1997-06-09 | 2000-09-26 | National Semiconductor Corporation | Reflectance enhancing thin film stack in which pairs of dielectric layers are on a reflector and liquid crystal is on the dielectric layers |
| US5966399A (en) * | 1997-10-02 | 1999-10-12 | Motorola, Inc. | Vertical cavity surface emitting laser with integrated diffractive lens and method of fabrication |
| US5956364A (en) * | 1997-10-02 | 1999-09-21 | Motorola, Inc. | Vertical cavity surface emitting laser with shaped cavity mirror and method of fabrication |
| US6051446A (en) * | 1998-04-09 | 2000-04-18 | National Semiconductor Corporation | Thin liquid crystal transducer pixel cell having self-aligned support pillars |
| US6487231B1 (en) * | 1998-04-14 | 2002-11-26 | Bandwidth 9, Inc. | Vertical cavity apparatus with tunnel junction |
| US6760357B1 (en) * | 1998-04-14 | 2004-07-06 | Bandwidth9 | Vertical cavity apparatus with tunnel junction |
| US6452652B1 (en) | 1998-06-12 | 2002-09-17 | National Semiconductor Corporation | Light absorbing thin film stack in a light valve structure |
| JP3697903B2 (ja) | 1998-07-06 | 2005-09-21 | 富士ゼロックス株式会社 | 面発光レーザおよび面発光レーザアレイ |
| US6300241B1 (en) | 1998-08-19 | 2001-10-09 | National Semiconductor Corporation | Silicon interconnect passivation and metallization process optimized to maximize reflectance |
| US6542527B1 (en) | 1998-08-27 | 2003-04-01 | Regents Of The University Of Minnesota | Vertical cavity surface emitting laser |
| US6107114A (en) * | 1998-11-19 | 2000-08-22 | National Semiconductor Corporation | Process flow optimized to protect reflectance of silicon light valve |
| DE19908426C2 (de) * | 1999-02-26 | 2001-03-22 | Siemens Ag | Vertikalresonator-Laserdiode mit einer lichtabsorbierenden Schicht und Verfahren zu ihrer Herstellung |
| US6306561B1 (en) | 1999-03-04 | 2001-10-23 | National Semiconductor Corporation | Double metal pixel array for light valve utilizing lateral sublithographic spacer isolation |
| US6392734B1 (en) | 1999-03-04 | 2002-05-21 | National Semiconductor Corporation | Double metal pixel array for silicon LC light valve featuring shielded inter-pixel isolation regions |
| US6392733B1 (en) | 1999-03-04 | 2002-05-21 | National Semiconductor Corporation | Single metal pixel array for silicon LC light valve featuring shielded inter-pixel isolation regions |
| US6303273B1 (en) | 1999-03-04 | 2001-10-16 | National Semiconductor Corporation | Single metal pixel array for light valve utilizing lateral sublithographic spacer isolation |
| US6356327B1 (en) | 1999-03-29 | 2002-03-12 | National Semiconductor Corporation | Pixel array for silicon LC light valve featuring reflective metal surface underlying inter-pixel regions |
| US6233033B1 (en) | 1999-03-29 | 2001-05-15 | National Semiconductor Corp. | Pixel array for LC silicon light valve featuring pixels with overlapping edges |
| US6577362B1 (en) | 1999-05-24 | 2003-06-10 | National Semiconductor Corporation | Pixel cell for silicon LC light valve having enhanced storage capacitance |
| US6751245B1 (en) | 1999-06-02 | 2004-06-15 | Optical Communication Products, Inc. | Single mode vertical cavity surface emitting laser |
| CA2380659C (en) * | 1999-06-02 | 2008-08-05 | Cielo Communications, Inc. | Single mode vertical cavity surface emitting laser |
| US6373543B1 (en) | 1999-07-16 | 2002-04-16 | National Semiconductor Corporation | Process for forming silicon LC pixel cell having planar alignment layers of uniform thickness |
| US6411638B1 (en) * | 1999-08-31 | 2002-06-25 | Honeywell Inc. | Coupled cavity anti-guided vertical-cavity surface-emitting laser |
| US6583033B2 (en) * | 2000-08-22 | 2003-06-24 | The Regents Of The University Of California | Method of fabricating a distributed Bragg reflector by controlling material composition using molecular beam epitaxy |
| US6515305B2 (en) * | 2000-09-18 | 2003-02-04 | Regents Of The University Of Minnesota | Vertical cavity surface emitting laser with single mode confinement |
| KR100393057B1 (ko) | 2000-10-20 | 2003-07-31 | 삼성전자주식회사 | 마이크로 렌즈 일체형 표면광 레이저 |
| US6529541B1 (en) | 2000-11-13 | 2003-03-04 | Fuji Xerox Co., Ltd. | Surface emitting semiconductor laser |
| US6650683B2 (en) * | 2000-11-20 | 2003-11-18 | Fuji Xerox Co, Ltd. | Surface emitting semiconductor laser |
| US6990135B2 (en) | 2002-10-28 | 2006-01-24 | Finisar Corporation | Distributed bragg reflector for optoelectronic device |
| US7065124B2 (en) | 2000-11-28 | 2006-06-20 | Finlsar Corporation | Electron affinity engineered VCSELs |
| US6905900B1 (en) | 2000-11-28 | 2005-06-14 | Finisar Corporation | Versatile method and system for single mode VCSELs |
| US6727520B2 (en) * | 2000-12-29 | 2004-04-27 | Honeywell International Inc. | Spatially modulated reflector for an optoelectronic device |
| DE10111871A1 (de) | 2001-03-13 | 2002-09-19 | Heidelberger Druckmasch Ag | Bebilderungseinrichtung für eine Druckform mit einem Array von VCSEL-Lichtquellen |
| US20020163688A1 (en) * | 2001-03-26 | 2002-11-07 | Zuhua Zhu | Optical communications system and vertical cavity surface emitting laser therefor |
| US6878958B2 (en) * | 2001-03-26 | 2005-04-12 | Gazillion Bits, Inc. | Vertical cavity surface emitting laser with buried dielectric distributed Bragg reflector |
| US6608849B2 (en) * | 2001-06-13 | 2003-08-19 | Wisconsin Alumni Research Foundation | Vertical-cavity surface-emitting semiconductor laser arrays |
| US6606199B2 (en) | 2001-10-10 | 2003-08-12 | Honeywell International Inc. | Graded thickness optical element and method of manufacture therefor |
| KR100475848B1 (ko) * | 2002-03-07 | 2005-03-18 | 주식회사 테라스테이트 | 수직공진형 표면 발광레이저 |
| US6795478B2 (en) * | 2002-03-28 | 2004-09-21 | Applied Optoelectronics, Inc. | VCSEL with antiguide current confinement layer |
| TW533632B (en) * | 2002-06-07 | 2003-05-21 | Ind Tech Res Inst | Single-mode vertical cavity surface emitting laser device |
| KR100499128B1 (ko) | 2002-07-19 | 2005-07-04 | 삼성전기주식회사 | 전류제한층이 형성된 반도체 레이저 다이오드 및 그제조방법 |
| US6965626B2 (en) | 2002-09-03 | 2005-11-15 | Finisar Corporation | Single mode VCSEL |
| US7002613B2 (en) * | 2002-09-06 | 2006-02-21 | Heidelberger Druckmaschinen Ag | Method for printing an image on a printing substrate and device for inputting energy to a printing-ink carrier |
| JP3729263B2 (ja) * | 2002-09-25 | 2005-12-21 | セイコーエプソン株式会社 | 面発光型半導体レーザおよびその製造方法、光モジュール、光伝達装置 |
| US6813293B2 (en) | 2002-11-21 | 2004-11-02 | Finisar Corporation | Long wavelength VCSEL with tunnel junction, and implant |
| JP2004288674A (ja) * | 2003-03-19 | 2004-10-14 | Fuji Xerox Co Ltd | 面発光型半導体レーザおよびそれを用いた光通信システム |
| US6973105B2 (en) * | 2003-03-21 | 2005-12-06 | Agilent Technologies, Inc. | Method and apparatus to enable adaptive equalization at high bandwidths when using single-mode VCSELs over multimode fibers |
| JP3838218B2 (ja) | 2003-05-19 | 2006-10-25 | ソニー株式会社 | 面発光型半導体レーザ素子及びその製造方法 |
| US7298942B2 (en) | 2003-06-06 | 2007-11-20 | Finisar Corporation | Pluggable optical optic system having a lens fiber stop |
| US7433381B2 (en) | 2003-06-25 | 2008-10-07 | Finisar Corporation | InP based long wavelength VCSEL |
| US7075962B2 (en) | 2003-06-27 | 2006-07-11 | Finisar Corporation | VCSEL having thermal management |
| US7054345B2 (en) | 2003-06-27 | 2006-05-30 | Finisar Corporation | Enhanced lateral oxidation |
| US7277461B2 (en) | 2003-06-27 | 2007-10-02 | Finisar Corporation | Dielectric VCSEL gain guide |
| US7149383B2 (en) | 2003-06-30 | 2006-12-12 | Finisar Corporation | Optical system with reduced back reflection |
| US6961489B2 (en) | 2003-06-30 | 2005-11-01 | Finisar Corporation | High speed optical system |
| US7210857B2 (en) | 2003-07-16 | 2007-05-01 | Finisar Corporation | Optical coupling system |
| US6887801B2 (en) | 2003-07-18 | 2005-05-03 | Finisar Corporation | Edge bead control method and apparatus |
| US7031363B2 (en) | 2003-10-29 | 2006-04-18 | Finisar Corporation | Long wavelength VCSEL device processing |
| JP4507567B2 (ja) | 2003-11-18 | 2010-07-21 | セイコーエプソン株式会社 | 面発光レーザの製造方法 |
| JP4437913B2 (ja) * | 2003-11-25 | 2010-03-24 | 富士ゼロックス株式会社 | 表面発光型半導体レーザ素子およびその製造方法 |
| JP2005340567A (ja) * | 2004-05-28 | 2005-12-08 | Fuji Xerox Co Ltd | 表面発光型半導体レーザ素子およびその製造方法 |
| JP3876895B2 (ja) * | 2004-06-04 | 2007-02-07 | ソニー株式会社 | 面発光半導体レーザ |
| US7372886B2 (en) | 2004-06-07 | 2008-05-13 | Avago Technologies Fiber Ip Pte Ltd | High thermal conductivity vertical cavity surface emitting laser (VCSEL) |
| JP4752201B2 (ja) * | 2004-06-29 | 2011-08-17 | 富士ゼロックス株式会社 | 面発光型半導体レーザ装置およびその製造方法 |
| US7829912B2 (en) | 2006-07-31 | 2010-11-09 | Finisar Corporation | Efficient carrier injection in a semiconductor device |
| US7596165B2 (en) | 2004-08-31 | 2009-09-29 | Finisar Corporation | Distributed Bragg Reflector for optoelectronic device |
| US7920612B2 (en) | 2004-08-31 | 2011-04-05 | Finisar Corporation | Light emitting semiconductor device having an electrical confinement barrier near the active region |
| JP4207878B2 (ja) * | 2004-10-15 | 2009-01-14 | セイコーエプソン株式会社 | 面発光レーザ、面発光レーザの製造方法、デバイス及び電子機器 |
| JP2006114753A (ja) * | 2004-10-15 | 2006-04-27 | Seiko Epson Corp | 面発光レーザ、面発光レーザの製造方法、デバイス及び電子機器 |
| US7483469B2 (en) * | 2004-11-01 | 2009-01-27 | Seiko Epson Corporation | Surface-emitting type semiconductor laser and its manufacturing method, optical module, and light transmission device |
| WO2006056208A2 (en) * | 2004-11-29 | 2006-06-01 | Alight Technologies A/S | Single-mode photonic-crystal vcsels |
| JP4515949B2 (ja) * | 2005-03-31 | 2010-08-04 | 株式会社東芝 | 面型光半導体素子 |
| JP5376104B2 (ja) * | 2005-07-04 | 2013-12-25 | ソニー株式会社 | 面発光型半導体レーザ |
| JP5194432B2 (ja) * | 2005-11-30 | 2013-05-08 | 株式会社リコー | 面発光レーザ素子 |
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| JP5202502B2 (ja) * | 2009-12-01 | 2013-06-05 | 株式会社東芝 | 面型光半導体素子 |
| JP5717485B2 (ja) * | 2011-03-16 | 2015-05-13 | キヤノン株式会社 | 面発光レーザ、面発光レーザアレイ及び画像形成装置 |
| JP2013161965A (ja) * | 2012-02-06 | 2013-08-19 | Kyoto Univ | 半導体発光素子 |
| CN113851928B (zh) | 2016-11-02 | 2024-09-20 | 索尼公司 | 发光元件及其制造方法 |
| US20220385041A1 (en) * | 2021-05-27 | 2022-12-01 | Lumentum Operations Llc | Emitter with variable light reflectivity |
| TWI823611B (zh) * | 2021-10-13 | 2023-11-21 | 全新光電科技股份有限公司 | 具有模態過濾層的垂直腔面射型半導體雷射二極體 |
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| JPS6042890A (ja) * | 1983-08-18 | 1985-03-07 | Mitsubishi Electric Corp | 面発光形半導体レ−ザ及びその製造方法 |
| DE4135813C2 (de) * | 1990-10-31 | 1997-11-06 | Toshiba Kawasaki Kk | Oberflächenemittierende Halbleiter-Laservorrichtung |
| US5073041A (en) * | 1990-11-13 | 1991-12-17 | Bell Communications Research, Inc. | Integrated assembly comprising vertical cavity surface-emitting laser array with Fresnel microlenses |
| US5216263A (en) * | 1990-11-29 | 1993-06-01 | Xerox Corporation | High density, independently addressable, surface emitting semiconductor laser-light emitting diode arrays |
| US5633527A (en) * | 1995-02-06 | 1997-05-27 | Sandia Corporation | Unitary lens semiconductor device |
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1996
- 1996-06-20 US US08/667,259 patent/US5838715A/en not_active Expired - Lifetime
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1997
- 1997-06-19 JP JP16219597A patent/JP3999309B2/ja not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20200169061A1 (en) * | 2017-07-18 | 2020-05-28 | Sony Corporation | Light emitting element and light emitting element array |
| US11594859B2 (en) * | 2017-07-18 | 2023-02-28 | Sony Corporation | Light emitting element and light emitting element array |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH1056233A (ja) | 1998-02-24 |
| US5838715A (en) | 1998-11-17 |
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