JP3998389B2 - 基板処理装置 - Google Patents

基板処理装置 Download PDF

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Publication number
JP3998389B2
JP3998389B2 JP2000039158A JP2000039158A JP3998389B2 JP 3998389 B2 JP3998389 B2 JP 3998389B2 JP 2000039158 A JP2000039158 A JP 2000039158A JP 2000039158 A JP2000039158 A JP 2000039158A JP 3998389 B2 JP3998389 B2 JP 3998389B2
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Japan
Prior art keywords
plate
heat
substrate
cooling
heat pipe
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Expired - Fee Related
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JP2000039158A
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Japanese (ja)
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JP2001230172A (ja
JP2001230172A5 (enrdf_load_stackoverflow
Inventor
英一 白川
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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JP2000039158A 2000-02-17 2000-02-17 基板処理装置 Expired - Fee Related JP3998389B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000039158A JP3998389B2 (ja) 2000-02-17 2000-02-17 基板処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000039158A JP3998389B2 (ja) 2000-02-17 2000-02-17 基板処理装置

Publications (3)

Publication Number Publication Date
JP2001230172A JP2001230172A (ja) 2001-08-24
JP2001230172A5 JP2001230172A5 (enrdf_load_stackoverflow) 2005-09-02
JP3998389B2 true JP3998389B2 (ja) 2007-10-24

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ID=18562769

Family Applications (1)

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JP2000039158A Expired - Fee Related JP3998389B2 (ja) 2000-02-17 2000-02-17 基板処理装置

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JP (1) JP3998389B2 (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3996845B2 (ja) * 2002-12-27 2007-10-24 大日本スクリーン製造株式会社 基板処理装置
JP4410147B2 (ja) 2005-05-09 2010-02-03 東京エレクトロン株式会社 加熱装置、塗布、現像装置及び加熱方法
JP4606355B2 (ja) * 2006-03-14 2011-01-05 東京エレクトロン株式会社 熱処理装置、熱処理方法及び記憶媒体
CN110997974A (zh) * 2017-08-21 2020-04-10 堺显示器制品株式会社 蒸镀装置、蒸镀方法以及有机el显示装置的制造方法

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JP2001230172A (ja) 2001-08-24

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