JP3994439B2 - 積層セラミック電子部品端子電極用導体ペースト - Google Patents

積層セラミック電子部品端子電極用導体ペースト Download PDF

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Publication number
JP3994439B2
JP3994439B2 JP2004179372A JP2004179372A JP3994439B2 JP 3994439 B2 JP3994439 B2 JP 3994439B2 JP 2004179372 A JP2004179372 A JP 2004179372A JP 2004179372 A JP2004179372 A JP 2004179372A JP 3994439 B2 JP3994439 B2 JP 3994439B2
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Japan
Prior art keywords
powder
electronic component
multilayer ceramic
paste
conductor paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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JP2004179372A
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English (en)
Japanese (ja)
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JP2006004734A (ja
JP2006004734A5 (enExample
Inventor
友子 内田
恵 河原
隆 加藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shoei Chemical Inc
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Shoei Chemical Inc
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Publication date
Application filed by Shoei Chemical Inc filed Critical Shoei Chemical Inc
Priority to JP2004179372A priority Critical patent/JP3994439B2/ja
Publication of JP2006004734A publication Critical patent/JP2006004734A/ja
Publication of JP2006004734A5 publication Critical patent/JP2006004734A5/ja
Application granted granted Critical
Publication of JP3994439B2 publication Critical patent/JP3994439B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Conductive Materials (AREA)
JP2004179372A 2004-06-17 2004-06-17 積層セラミック電子部品端子電極用導体ペースト Expired - Lifetime JP3994439B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004179372A JP3994439B2 (ja) 2004-06-17 2004-06-17 積層セラミック電子部品端子電極用導体ペースト

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004179372A JP3994439B2 (ja) 2004-06-17 2004-06-17 積層セラミック電子部品端子電極用導体ペースト

Publications (3)

Publication Number Publication Date
JP2006004734A JP2006004734A (ja) 2006-01-05
JP2006004734A5 JP2006004734A5 (enExample) 2007-06-07
JP3994439B2 true JP3994439B2 (ja) 2007-10-17

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ID=35772951

Family Applications (1)

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JP2004179372A Expired - Lifetime JP3994439B2 (ja) 2004-06-17 2004-06-17 積層セラミック電子部品端子電極用導体ペースト

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JP (1) JP3994439B2 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101151683B (zh) * 2005-04-06 2011-06-22 株式会社村田制作所 导体粉末及其制造方法以及导电性树脂组合物
JP2014182891A (ja) * 2013-03-18 2014-09-29 Fdk Corp 導電性ペースト、積層チップインダクタ、及びセラミック電子部品
JP2015035581A (ja) * 2013-07-10 2015-02-19 株式会社村田製作所 セラミック電子部品およびその製造方法
JP6546309B1 (ja) * 2018-03-19 2019-07-17 株式会社ノリタケカンパニーリミテド 経時粘度が安定な導電性ペースト
KR102147408B1 (ko) * 2018-08-23 2020-08-24 삼성전기주식회사 적층 세라믹 전자부품 및 그 제조방법
KR102545056B1 (ko) * 2021-07-13 2023-06-21 (주)창성 가지형 분말을 적용한 구리페이스트 조성물 및 이를 이용한 세라믹제품
CN120092307A (zh) 2022-10-19 2025-06-03 昭荣化学工业株式会社 导电性糊剂和电子部件的制造方法
JPWO2025192532A1 (enExample) * 2024-03-11 2025-09-18
WO2025192531A1 (ja) * 2024-03-11 2025-09-18 昭栄化学工業株式会社 銅を主成分とする導電性粉末
WO2025192533A1 (ja) * 2024-03-11 2025-09-18 昭栄化学工業株式会社 銅を主成分とする導電性粉末、導電性ペースト、電子部品の製造方法、導電性粉末の製造方法

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Publication number Publication date
JP2006004734A (ja) 2006-01-05

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