JP2006004734A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2006004734A5 JP2006004734A5 JP2004179372A JP2004179372A JP2006004734A5 JP 2006004734 A5 JP2006004734 A5 JP 2006004734A5 JP 2004179372 A JP2004179372 A JP 2004179372A JP 2004179372 A JP2004179372 A JP 2004179372A JP 2006004734 A5 JP2006004734 A5 JP 2006004734A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004179372A JP3994439B2 (ja) | 2004-06-17 | 2004-06-17 | 積層セラミック電子部品端子電極用導体ペースト |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004179372A JP3994439B2 (ja) | 2004-06-17 | 2004-06-17 | 積層セラミック電子部品端子電極用導体ペースト |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006004734A JP2006004734A (ja) | 2006-01-05 |
| JP2006004734A5 true JP2006004734A5 (enExample) | 2007-06-07 |
| JP3994439B2 JP3994439B2 (ja) | 2007-10-17 |
Family
ID=35772951
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004179372A Expired - Lifetime JP3994439B2 (ja) | 2004-06-17 | 2004-06-17 | 積層セラミック電子部品端子電極用導体ペースト |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3994439B2 (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101151683B (zh) * | 2005-04-06 | 2011-06-22 | 株式会社村田制作所 | 导体粉末及其制造方法以及导电性树脂组合物 |
| JP2014182891A (ja) * | 2013-03-18 | 2014-09-29 | Fdk Corp | 導電性ペースト、積層チップインダクタ、及びセラミック電子部品 |
| JP2015035581A (ja) * | 2013-07-10 | 2015-02-19 | 株式会社村田製作所 | セラミック電子部品およびその製造方法 |
| JP6546309B1 (ja) * | 2018-03-19 | 2019-07-17 | 株式会社ノリタケカンパニーリミテド | 経時粘度が安定な導電性ペースト |
| KR102147408B1 (ko) * | 2018-08-23 | 2020-08-24 | 삼성전기주식회사 | 적층 세라믹 전자부품 및 그 제조방법 |
| KR102545056B1 (ko) * | 2021-07-13 | 2023-06-21 | (주)창성 | 가지형 분말을 적용한 구리페이스트 조성물 및 이를 이용한 세라믹제품 |
| CN120092307A (zh) | 2022-10-19 | 2025-06-03 | 昭荣化学工业株式会社 | 导电性糊剂和电子部件的制造方法 |
| JPWO2025192532A1 (enExample) * | 2024-03-11 | 2025-09-18 | ||
| WO2025192531A1 (ja) * | 2024-03-11 | 2025-09-18 | 昭栄化学工業株式会社 | 銅を主成分とする導電性粉末 |
| WO2025192533A1 (ja) * | 2024-03-11 | 2025-09-18 | 昭栄化学工業株式会社 | 銅を主成分とする導電性粉末、導電性ペースト、電子部品の製造方法、導電性粉末の製造方法 |
-
2004
- 2004-06-17 JP JP2004179372A patent/JP3994439B2/ja not_active Expired - Lifetime