JP3992092B2 - 試料研磨装置、試料研磨方法及び研磨パッド - Google Patents

試料研磨装置、試料研磨方法及び研磨パッド Download PDF

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Publication number
JP3992092B2
JP3992092B2 JP2000107194A JP2000107194A JP3992092B2 JP 3992092 B2 JP3992092 B2 JP 3992092B2 JP 2000107194 A JP2000107194 A JP 2000107194A JP 2000107194 A JP2000107194 A JP 2000107194A JP 3992092 B2 JP3992092 B2 JP 3992092B2
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Japan
Prior art keywords
sample
polishing
adhesive
pad
rubber
Prior art date
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Expired - Fee Related
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JP2000107194A
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English (en)
Japanese (ja)
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JP2001287157A (ja
JP2001287157A5 (enExample
Inventor
明彦 佐口
渉 高橋
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2000107194A priority Critical patent/JP3992092B2/ja
Priority to US09/826,847 priority patent/US6726538B2/en
Publication of JP2001287157A publication Critical patent/JP2001287157A/ja
Publication of JP2001287157A5 publication Critical patent/JP2001287157A5/ja
Application granted granted Critical
Publication of JP3992092B2 publication Critical patent/JP3992092B2/ja
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Expired - Fee Related legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2000107194A 2000-04-07 2000-04-07 試料研磨装置、試料研磨方法及び研磨パッド Expired - Fee Related JP3992092B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2000107194A JP3992092B2 (ja) 2000-04-07 2000-04-07 試料研磨装置、試料研磨方法及び研磨パッド
US09/826,847 US6726538B2 (en) 2000-04-07 2001-04-06 Sample polishing apparatus and sample polishing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000107194A JP3992092B2 (ja) 2000-04-07 2000-04-07 試料研磨装置、試料研磨方法及び研磨パッド

Publications (3)

Publication Number Publication Date
JP2001287157A JP2001287157A (ja) 2001-10-16
JP2001287157A5 JP2001287157A5 (enExample) 2005-10-27
JP3992092B2 true JP3992092B2 (ja) 2007-10-17

Family

ID=18620218

Family Applications (1)

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JP2000107194A Expired - Fee Related JP3992092B2 (ja) 2000-04-07 2000-04-07 試料研磨装置、試料研磨方法及び研磨パッド

Country Status (2)

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US (1) US6726538B2 (enExample)
JP (1) JP3992092B2 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040102140A1 (en) * 2002-11-21 2004-05-27 Wood Jeffrey H. Contour following end effectors for lapping/polishing
US7118452B2 (en) * 2004-02-12 2006-10-10 The Boeing Company Pneumatically actuated flexible coupling end effectors for lapping/polishing
JP4743578B2 (ja) * 2004-05-18 2011-08-10 日東電工株式会社 半導体ウェハ加工用保護シート、及び半導体ウェハの裏面研削方法
JP6138011B2 (ja) * 2013-09-27 2017-05-31 富士紡ホールディングス株式会社 保持パッド及び保持具
US9630269B2 (en) * 2013-10-30 2017-04-25 Globalfoundries Inc. Mechanism to attach a die to a substrate
JP6705362B2 (ja) * 2016-10-25 2020-06-03 信越半導体株式会社 研磨ヘッドおよび研磨装置
TWI642772B (zh) * 2017-03-31 2018-12-01 智勝科技股份有限公司 研磨墊及研磨方法
JP2019058955A (ja) * 2017-09-22 2019-04-18 信越半導体株式会社 研磨ヘッド及び研磨ヘッドの製造方法
JP7026943B2 (ja) * 2018-05-08 2022-03-01 丸石産業株式会社 研磨パッド及び該研磨パッドによる研磨方法
KR102607586B1 (ko) * 2018-11-05 2023-11-30 삼성디스플레이 주식회사 기판 지지 장치 및 이를 이용한 기판 연마 방법
KR102270392B1 (ko) * 2019-10-01 2021-06-30 에스케이실트론 주식회사 웨이퍼 연마 헤드, 웨이퍼 연마 헤드의 제조방법 및 그를 구비한 웨이퍼 연마 장치

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56169332A (en) 1980-05-31 1981-12-26 Nec Home Electronics Ltd Manufacture of semiconductor device
JPH0811788B2 (ja) 1985-10-30 1996-02-07 日東電工株式会社 半導体ウエハの保護部材
JP2588060B2 (ja) 1990-11-30 1997-03-05 住友シチックス株式会社 半導体ウェーハの研磨用チャック
US5443416A (en) * 1993-09-09 1995-08-22 Cybeq Systems Incorporated Rotary union for coupling fluids in a wafer polishing apparatus
US5820448A (en) * 1993-12-27 1998-10-13 Applied Materials, Inc. Carrier head with a layer of conformable material for a chemical mechanical polishing system
JPH08181092A (ja) 1994-12-26 1996-07-12 Sumitomo Metal Ind Ltd 半導体ウエハ研磨用保持プレート
US6036587A (en) * 1996-10-10 2000-03-14 Applied Materials, Inc. Carrier head with layer of conformable material for a chemical mechanical polishing system
US6056632A (en) * 1997-02-13 2000-05-02 Speedfam-Ipec Corp. Semiconductor wafer polishing apparatus with a variable polishing force wafer carrier head
US5916015A (en) * 1997-07-25 1999-06-29 Speedfam Corporation Wafer carrier for semiconductor wafer polishing machine
US6080050A (en) * 1997-12-31 2000-06-27 Applied Materials, Inc. Carrier head including a flexible membrane and a compliant backing member for a chemical mechanical polishing apparatus
US6030275A (en) * 1998-03-17 2000-02-29 International Business Machines Corporation Variable control of carrier curvature with direct feedback loop
JPH11285966A (ja) * 1998-04-02 1999-10-19 Speedfam-Ipec Co Ltd キャリア及びｃｍｐ装置

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Publication number Publication date
JP2001287157A (ja) 2001-10-16
US20010039167A1 (en) 2001-11-08
US6726538B2 (en) 2004-04-27

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