JP3990679B2 - 半導体実装用回路基板を備えた半導体装置 - Google Patents
半導体実装用回路基板を備えた半導体装置 Download PDFInfo
- Publication number
- JP3990679B2 JP3990679B2 JP2004110855A JP2004110855A JP3990679B2 JP 3990679 B2 JP3990679 B2 JP 3990679B2 JP 2004110855 A JP2004110855 A JP 2004110855A JP 2004110855 A JP2004110855 A JP 2004110855A JP 3990679 B2 JP3990679 B2 JP 3990679B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- semiconductor
- mounting
- semiconductor mounting
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Description
図1は、半導体実装用回路基板2のPCB対向面5を示す平面図であり、図2は図1に示される半導体実装用回路基板2の側面図である。
図4は、半導体実装用回路基板2の半導体チップが実装される半導体実装面6を示す平面図である。
図7(a)(b)は、半導体実装用回路基板2をPCB対向面5から半導体実装面6までの厚み方向の構成を概略的に示す断面図である。半導体実装用回路基板2は、一主面が半導体実装面6となる絶縁層81および一主面がPCB対向面5となる絶縁層85と、その間に形成される第1導体層82、誘電体層83および第2導体層84とで構成される。
12 接続パッド
13a〜13d 補強パッド
27 半田バンプ
25 配線パターン
41〜43 基板認識用パターン
50 半導体チップ実装領域
51a〜51d パッケージ禁止領域
53 仮想電極パッド位置
61 リード配線
82 第1導体層
83 誘電体層
84 第2導体層
Claims (1)
- 半導体実装用回路基板の一主面が半導体チップの載置された領域よりも大きく形成され、前記半導体実装用回路基板の一主面の前記半導体チップの載置された領域以外に複数のパッケージ禁止領域が設けられるとともに、前記パッケージ禁止領域の少なくとも1つの形状が他のパッケージ禁止領域の形状とは異なるように形成されており、前記半導体チップを被覆するパッケージが前記半導体実装用回路基板の一主面の前記パッケージ禁止領域以外の全ての領域に設けられたことを特徴とする半導体装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004110855A JP3990679B2 (ja) | 1996-11-08 | 2004-04-05 | 半導体実装用回路基板を備えた半導体装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29646596 | 1996-11-08 | ||
JP2004110855A JP3990679B2 (ja) | 1996-11-08 | 2004-04-05 | 半導体実装用回路基板を備えた半導体装置 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP30279197A Division JP3555828B2 (ja) | 1996-11-08 | 1997-11-05 | 半導体実装用回路基板を備えた半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2004214699A JP2004214699A (ja) | 2004-07-29 |
JP3990679B2 true JP3990679B2 (ja) | 2007-10-17 |
Family
ID=32827252
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004110855A Expired - Lifetime JP3990679B2 (ja) | 1996-11-08 | 2004-04-05 | 半導体実装用回路基板を備えた半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3990679B2 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4632870B2 (ja) | 2005-06-10 | 2011-02-16 | Necシステムテクノロジー株式会社 | Lsiパッケージ及び回路基板 |
JP4687340B2 (ja) * | 2005-09-02 | 2011-05-25 | ソニー株式会社 | 半導体装置 |
WO2007061124A1 (en) | 2005-11-24 | 2007-05-31 | Ricoh Company, Ltd. | Semiconductor wafer including semiconductor chips divided by scribe line and process-monitor electrode pads formed on scribe line |
JP4698473B2 (ja) * | 2006-04-27 | 2011-06-08 | 京セラ株式会社 | 構造体の製造方法及び電子装置 |
US20120060292A9 (en) | 2010-02-02 | 2012-03-15 | Edmund Scott Davis | Methods for using head positioning pillows to optimize respiratory titration |
JP5430496B2 (ja) * | 2010-05-27 | 2014-02-26 | 京セラ株式会社 | 電子部品搭載用パッケージ |
JP6171516B2 (ja) * | 2013-04-12 | 2017-08-02 | セイコーエプソン株式会社 | 電子デバイス、電子デバイスの製造方法、電子機器、および移動体 |
-
2004
- 2004-04-05 JP JP2004110855A patent/JP3990679B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP2004214699A (ja) | 2004-07-29 |
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