JP3965964B2 - 樹脂用接着剤および樹脂積層体 - Google Patents
樹脂用接着剤および樹脂積層体 Download PDFInfo
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- JP3965964B2 JP3965964B2 JP2001332091A JP2001332091A JP3965964B2 JP 3965964 B2 JP3965964 B2 JP 3965964B2 JP 2001332091 A JP2001332091 A JP 2001332091A JP 2001332091 A JP2001332091 A JP 2001332091A JP 3965964 B2 JP3965964 B2 JP 3965964B2
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- weight
- resin
- adhesive
- parts
- methyl methacrylate
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001332091A JP3965964B2 (ja) | 2001-10-30 | 2001-10-30 | 樹脂用接着剤および樹脂積層体 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001332091A JP3965964B2 (ja) | 2001-10-30 | 2001-10-30 | 樹脂用接着剤および樹脂積層体 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003129006A JP2003129006A (ja) | 2003-05-08 |
| JP2003129006A5 JP2003129006A5 (enExample) | 2005-04-07 |
| JP3965964B2 true JP3965964B2 (ja) | 2007-08-29 |
Family
ID=19147561
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001332091A Expired - Fee Related JP3965964B2 (ja) | 2001-10-30 | 2001-10-30 | 樹脂用接着剤および樹脂積層体 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3965964B2 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5111711B2 (ja) * | 2002-01-31 | 2013-01-09 | 日立化成工業株式会社 | 接着剤組成物、回路接続用接着剤組成物及び回路接続方法 |
| JP2012224775A (ja) * | 2011-04-21 | 2012-11-15 | Panasonic Corp | ラジカル硬化型成形用樹脂組成物および樹脂成形品 |
| JP6393994B2 (ja) * | 2014-01-29 | 2018-09-26 | 日立化成株式会社 | 接着剤組成物、接着剤組成物を用いた電子部材、及び半導体装置の製造方法 |
-
2001
- 2001-10-30 JP JP2001332091A patent/JP3965964B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2003129006A (ja) | 2003-05-08 |
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