JP3961749B2 - 基板洗浄装置及び基板処理装置、基板処理方法 - Google Patents

基板洗浄装置及び基板処理装置、基板処理方法 Download PDF

Info

Publication number
JP3961749B2
JP3961749B2 JP2000242905A JP2000242905A JP3961749B2 JP 3961749 B2 JP3961749 B2 JP 3961749B2 JP 2000242905 A JP2000242905 A JP 2000242905A JP 2000242905 A JP2000242905 A JP 2000242905A JP 3961749 B2 JP3961749 B2 JP 3961749B2
Authority
JP
Japan
Prior art keywords
substrate
cleaning
unit
processed
cleaning tank
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2000242905A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002057137A (ja
JP2002057137A5 (US06573293-20030603-C00009.png
Inventor
宏 外崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2000242905A priority Critical patent/JP3961749B2/ja
Priority to US09/915,289 priority patent/US6616512B2/en
Publication of JP2002057137A publication Critical patent/JP2002057137A/ja
Publication of JP2002057137A5 publication Critical patent/JP2002057137A5/ja
Application granted granted Critical
Publication of JP3961749B2 publication Critical patent/JP3961749B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Landscapes

  • Cleaning In General (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2000242905A 2000-07-28 2000-08-10 基板洗浄装置及び基板処理装置、基板処理方法 Expired - Lifetime JP3961749B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2000242905A JP3961749B2 (ja) 2000-08-10 2000-08-10 基板洗浄装置及び基板処理装置、基板処理方法
US09/915,289 US6616512B2 (en) 2000-07-28 2001-07-27 Substrate cleaning apparatus and substrate polishing apparatus with substrate cleaning apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000242905A JP3961749B2 (ja) 2000-08-10 2000-08-10 基板洗浄装置及び基板処理装置、基板処理方法

Publications (3)

Publication Number Publication Date
JP2002057137A JP2002057137A (ja) 2002-02-22
JP2002057137A5 JP2002057137A5 (US06573293-20030603-C00009.png) 2005-08-04
JP3961749B2 true JP3961749B2 (ja) 2007-08-22

Family

ID=18733846

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000242905A Expired - Lifetime JP3961749B2 (ja) 2000-07-28 2000-08-10 基板洗浄装置及び基板処理装置、基板処理方法

Country Status (1)

Country Link
JP (1) JP3961749B2 (US06573293-20030603-C00009.png)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100423206C (zh) * 2003-07-02 2008-10-01 上海思恩电子技术有限公司 用加热化学气体产生的雾状化学剂处理基片的方法及系统
JP4733616B2 (ja) * 2006-11-01 2011-07-27 積水化学工業株式会社 表面処理装置
JP5844681B2 (ja) * 2011-07-06 2016-01-20 東京エレクトロン株式会社 基板液処理装置及び基板液処理方法
CN102989736B (zh) * 2012-11-26 2015-03-18 北京七星华创电子股份有限公司 一种排风装置
JP6338275B2 (ja) * 2014-06-27 2018-06-06 株式会社Screenホールディングス 基板処理方法および基板処理装置
CN110587471B (zh) * 2019-10-22 2021-08-27 武汉新芯集成电路制造有限公司 一种自清洁防护罩
CN112005890B (zh) * 2020-09-14 2022-04-15 王芝林 一种生态养猪场用室内水帘风机降温系统
JP2022079045A (ja) * 2020-11-16 2022-05-26 株式会社ディスコ 加工装置

Also Published As

Publication number Publication date
JP2002057137A (ja) 2002-02-22

Similar Documents

Publication Publication Date Title
US7472713B2 (en) Substrate processing apparatus
JP2006114884A (ja) 基板洗浄処理装置及び基板処理ユニット
JP3834542B2 (ja) 基板洗浄装置及び基板洗浄方法
US5904611A (en) Precision polishing apparatus
JP4807528B2 (ja) 1つ以上のウエハ上に液体を排出して乾燥処理するための装置及び方法
KR20030036087A (ko) 기판세정장치 및 기판세정방법
KR970011644B1 (ko) 도포 처리 장치
TWI661467B (zh) 基板處理裝置及基板處理方法
JPH0878368A (ja) ワークの処理方法および装置
US6368183B1 (en) Wafer cleaning apparatus and associated wafer processing methods
JP2002353181A (ja) 枚葉式基板洗浄方法および枚葉式基板洗浄装置
WO2003105201A1 (ja) 基板処理装置、基板処理方法及び現像装置
JP3961749B2 (ja) 基板洗浄装置及び基板処理装置、基板処理方法
JP3495208B2 (ja) 基板処理装置
TW202015150A (zh) 基板處理裝置及基板處理方法
US6616512B2 (en) Substrate cleaning apparatus and substrate polishing apparatus with substrate cleaning apparatus
TWI674153B (zh) 基板洗淨裝置及具備其之基板處理裝置
JP2002043272A (ja) 基板洗浄装置及び基板処理装置
JPH10223593A (ja) 枚葉式ウェハ洗浄装置
KR101757820B1 (ko) 포토 마스크 처리 장치
JP4040906B2 (ja) スピン処理装置
JP4369022B2 (ja) スピン処理装置
JP2003257925A (ja) スピン処理装置及びスピン処理方法
JP4727080B2 (ja) スピン処理装置
JP3862435B2 (ja) ポリッシング装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20050107

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20050107

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20050107

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20061201

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20061212

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070207

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20070207

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20070515

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20070517

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

Ref document number: 3961749

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110525

Year of fee payment: 4

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110525

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120525

Year of fee payment: 5

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130525

Year of fee payment: 6

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140525

Year of fee payment: 7

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term