JP3954639B2 - 集積回路をテストする方法および装置 - Google Patents

集積回路をテストする方法および装置 Download PDF

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Publication number
JP3954639B2
JP3954639B2 JP2006502669A JP2006502669A JP3954639B2 JP 3954639 B2 JP3954639 B2 JP 3954639B2 JP 2006502669 A JP2006502669 A JP 2006502669A JP 2006502669 A JP2006502669 A JP 2006502669A JP 3954639 B2 JP3954639 B2 JP 3954639B2
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Japan
Prior art keywords
test
module
operating system
site
controller
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Expired - Fee Related
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JP2006502669A
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English (en)
Japanese (ja)
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JP2006518460A5 (enExample
JP2006518460A (ja
Inventor
アンカン プラマニック
マーク エルストン
リーオン チェン
ロバート サウアー
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Advantest Corp
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Advantest Corp
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Publication date
Priority claimed from US10/403,817 external-priority patent/US7290192B2/en
Priority claimed from US10/404,002 external-priority patent/US7460988B2/en
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of JP2006518460A publication Critical patent/JP2006518460A/ja
Publication of JP2006518460A5 publication Critical patent/JP2006518460A5/ja
Application granted granted Critical
Publication of JP3954639B2 publication Critical patent/JP3954639B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration
    • G01R31/31907—Modular tester, e.g. controlling and coordinating instruments in a bus based architecture
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/3183—Generation of test inputs, e.g. test vectors, patterns or sequences
    • G01R31/318307—Generation of test inputs, e.g. test vectors, patterns or sequences computer-aided, e.g. automatic test program generator [ATPG], program translations, test program debugging
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/3183—Generation of test inputs, e.g. test vectors, patterns or sequences
    • G01R31/318342—Generation of test inputs, e.g. test vectors, patterns or sequences by preliminary fault modelling, e.g. analysis, simulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Test And Diagnosis Of Digital Computers (AREA)
  • Non-Volatile Memory (AREA)
JP2006502669A 2003-02-14 2004-02-16 集積回路をテストする方法および装置 Expired - Fee Related JP3954639B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US44783903P 2003-02-14 2003-02-14
US44962203P 2003-02-24 2003-02-24
US10/403,817 US7290192B2 (en) 2003-03-31 2003-03-31 Test apparatus and test method for testing plurality of devices in parallel
US10/404,002 US7460988B2 (en) 2003-03-31 2003-03-31 Test emulator, test module emulator, and record medium storing program therein
PCT/JP2004/001648 WO2004072669A1 (en) 2003-02-14 2004-02-16 Method and apparatus for testing integrated circuits

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2006252498A Division JP2007052028A (ja) 2003-02-14 2006-09-19 集積回路をテストする方法および装置

Publications (3)

Publication Number Publication Date
JP2006518460A JP2006518460A (ja) 2006-08-10
JP2006518460A5 JP2006518460A5 (enExample) 2006-09-21
JP3954639B2 true JP3954639B2 (ja) 2007-08-08

Family

ID=32872965

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2006502670A Expired - Fee Related JP3939336B2 (ja) 2003-02-14 2004-02-16 半導体集積回路用のテストプログラムを開発する方法および構造
JP2006502669A Expired - Fee Related JP3954639B2 (ja) 2003-02-14 2004-02-16 集積回路をテストする方法および装置
JP2006252498A Withdrawn JP2007052028A (ja) 2003-02-14 2006-09-19 集積回路をテストする方法および装置

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2006502670A Expired - Fee Related JP3939336B2 (ja) 2003-02-14 2004-02-16 半導体集積回路用のテストプログラムを開発する方法および構造

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2006252498A Withdrawn JP2007052028A (ja) 2003-02-14 2006-09-19 集積回路をテストする方法および装置

Country Status (8)

Country Link
EP (2) EP1592975B1 (enExample)
JP (3) JP3939336B2 (enExample)
KR (2) KR20050099626A (enExample)
CN (1) CN1784609B (enExample)
AT (1) ATE384269T1 (enExample)
DE (1) DE602004011320T2 (enExample)
TW (1) TWI344595B (enExample)
WO (2) WO2004072669A1 (enExample)

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US7184917B2 (en) 2003-02-14 2007-02-27 Advantest America R&D Center, Inc. Method and system for controlling interchangeable components in a modular test system
US7437261B2 (en) 2003-02-14 2008-10-14 Advantest Corporation Method and apparatus for testing integrated circuits
US7197417B2 (en) * 2003-02-14 2007-03-27 Advantest America R&D Center, Inc. Method and structure to develop a test program for semiconductor integrated circuits
US7210087B2 (en) 2004-05-22 2007-04-24 Advantest America R&D Center, Inc. Method and system for simulating a modular test system
US7197416B2 (en) 2004-05-22 2007-03-27 Advantest America R&D Center, Inc. Supporting calibration and diagnostics in an open architecture test system
US7430486B2 (en) * 2004-05-22 2008-09-30 Advantest America R&D Center, Inc. Datalog support in a modular test system
US7543200B2 (en) 2005-02-17 2009-06-02 Advantest Corporation Method and system for scheduling tests in a parallel test system
US8214800B2 (en) * 2005-03-02 2012-07-03 Advantest Corporation Compact representation of vendor hardware module revisions in an open architecture test system
JP2006275986A (ja) * 2005-03-30 2006-10-12 Advantest Corp 診断プログラム、切替プログラム、試験装置、および診断方法
US7253607B2 (en) * 2005-04-29 2007-08-07 Teradyne, Inc. Site-aware objects
DE602005002131T2 (de) 2005-05-20 2008-05-15 Verigy (Singapore) Pte. Ltd. Prüfvorrichtung mit Anpassung des Prüfparameters
US7788562B2 (en) * 2006-11-29 2010-08-31 Advantest Corporation Pattern controlled, full speed ATE compare capability for deterministic and non-deterministic IC data
JP5022262B2 (ja) * 2008-02-12 2012-09-12 株式会社アドバンテスト デバッグ中にツールを使用可能な試験システム及び方法
US8949784B2 (en) 2008-10-03 2015-02-03 Microsoft Technology Licensing, Llc Type system for declarative data scripting language
US8692566B2 (en) 2008-12-08 2014-04-08 Advantest Corporation Test apparatus and test method
US8405415B2 (en) 2009-09-10 2013-03-26 Advantest Corporation Test apparatus synchronous module and synchronous method
US8261119B2 (en) 2009-09-10 2012-09-04 Advantest Corporation Test apparatus for testing device has synchronization module which synchronizes analog test module to digital test module based on synchronization signal received from digital test module
US7906981B1 (en) 2009-09-10 2011-03-15 Advantest Corporation Test apparatus and test method
CN102193553A (zh) * 2010-03-02 2011-09-21 珠海格力电器股份有限公司 空调控制器功能的测试方法、装置及系统
TWI470421B (zh) * 2010-03-16 2015-01-21 Via Tech Inc 微處理器及其除錯方法
US8868371B2 (en) * 2011-09-09 2014-10-21 Infineon Technologies Ag Method and device for determining test sets of operating parameter values for an electronic component
US9400307B2 (en) 2013-03-13 2016-07-26 Keysight Technologies, Inc. Test system for improving throughout or maintenance properties of semiconductor testing
CN104144084B (zh) * 2013-05-10 2017-12-01 腾讯科技（深圳）有限公司 终端状态的监控方法及装置
CN104298590B (zh) * 2013-07-16 2019-05-10 爱德万测试公司 用于按管脚apg的快速语义处理器
US10539609B2 (en) * 2014-12-08 2020-01-21 Nxp Usa, Inc. Method of converting high-level test specification language to low-level test implementation language
KR20180084385A (ko) 2017-01-17 2018-07-25 한국항공우주산업 주식회사 데이터베이스 기반의 자동시험장비의 운용 시스템 및 그 운용 방법
US10592370B2 (en) * 2017-04-28 2020-03-17 Advantest Corporation User control of automated test features with software application programming interface (API)
US10890621B2 (en) * 2017-05-30 2021-01-12 Raytheon Company Systems and methods for testing an embedded controller
KR102179508B1 (ko) 2019-07-05 2020-11-16 한국항공우주산업 주식회사 자동화 시험장비의 운용 시스템
TWI748300B (zh) * 2019-12-09 2021-12-01 新唐科技股份有限公司 測試系統和測試方法
CN111459840A (zh) * 2020-04-26 2020-07-28 恩亿科(北京)数据科技有限公司 一种进程的调试方法及装置
CN112311627B (zh) * 2020-10-29 2022-09-09 许昌许继软件技术有限公司 一种基于xml格式的规约描述文件的电力规约通用测试方法及系统
CN113051114A (zh) * 2021-03-19 2021-06-29 无锡市软测认证有限公司 一种用于提高芯片测试效率的方法
US11574696B2 (en) * 2021-04-12 2023-02-07 Nanya Technology Corporation Semiconductor test system and method
KR102314419B1 (ko) * 2021-07-27 2021-10-19 (주) 에이블리 반도체 테스트 패턴 발생 장치 및 방법
CN114818669B (zh) * 2022-04-26 2023-06-27 北京中科智加科技有限公司 一种人名纠错模型的构建方法和计算机设备
KR102790875B1 (ko) * 2022-06-27 2025-04-04 주식회사 와이씨 반도체 디바이스 할당 정보에 따른 전원 공급 제어를 위한 반도체 디바이스 테스트 장치 및 그 시스템
CN115630594B (zh) * 2022-12-19 2023-03-21 杭州加速科技有限公司 一种芯片设计仿真文件到Pattern文件的转换方法及其系统
CN116520754B (zh) * 2023-06-27 2023-09-22 厦门芯泰达集成电路有限公司 基于预加载模式的dps模块控制方法、系统
CN117291145A (zh) * 2023-11-24 2023-12-26 之江实验室 片上系统的验证方法、系统和电子装置

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Also Published As

Publication number Publication date
TWI344595B (en) 2011-07-01
EP1592975A1 (en) 2005-11-09
JP2006518460A (ja) 2006-08-10
DE602004011320T2 (de) 2009-02-05
EP1592976B1 (en) 2008-01-16
JP2006520947A (ja) 2006-09-14
WO2004072670A1 (en) 2004-08-26
ATE384269T1 (de) 2008-02-15
EP1592975B1 (en) 2008-03-26
WO2004072669A1 (en) 2004-08-26
JP2007052028A (ja) 2007-03-01
EP1592976A1 (en) 2005-11-09
TW200508855A (en) 2005-03-01
CN1784609B (zh) 2011-02-23
DE602004011320D1 (de) 2008-03-06
KR20050099626A (ko) 2005-10-14
KR20050101216A (ko) 2005-10-20
CN1784609A (zh) 2006-06-07
JP3939336B2 (ja) 2007-07-04

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