JP3954233B2 - ポジ型フォトレジスト組成物 - Google Patents

ポジ型フォトレジスト組成物 Download PDF

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Publication number
JP3954233B2
JP3954233B2 JP08240799A JP8240799A JP3954233B2 JP 3954233 B2 JP3954233 B2 JP 3954233B2 JP 08240799 A JP08240799 A JP 08240799A JP 8240799 A JP8240799 A JP 8240799A JP 3954233 B2 JP3954233 B2 JP 3954233B2
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JP
Japan
Prior art keywords
group
copolymer
photoresist composition
general formula
positive photoresist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP08240799A
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English (en)
Japanese (ja)
Other versions
JPH11344808A5 (enExample
JPH11344808A (ja
Inventor
史郎 丹
亨 藤森
利明 青合
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Priority to JP08240799A priority Critical patent/JP3954233B2/ja
Publication of JPH11344808A publication Critical patent/JPH11344808A/ja
Publication of JPH11344808A5 publication Critical patent/JPH11344808A5/ja
Application granted granted Critical
Publication of JP3954233B2 publication Critical patent/JP3954233B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Materials For Photolithography (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
JP08240799A 1998-03-30 1999-03-25 ポジ型フォトレジスト組成物 Expired - Fee Related JP3954233B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP08240799A JP3954233B2 (ja) 1998-03-30 1999-03-25 ポジ型フォトレジスト組成物

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP10-84164 1998-03-30
JP8416498 1998-03-30
JP08240799A JP3954233B2 (ja) 1998-03-30 1999-03-25 ポジ型フォトレジスト組成物

Publications (3)

Publication Number Publication Date
JPH11344808A JPH11344808A (ja) 1999-12-14
JPH11344808A5 JPH11344808A5 (enExample) 2005-07-07
JP3954233B2 true JP3954233B2 (ja) 2007-08-08

Family

ID=26423436

Family Applications (1)

Application Number Title Priority Date Filing Date
JP08240799A Expired - Fee Related JP3954233B2 (ja) 1998-03-30 1999-03-25 ポジ型フォトレジスト組成物

Country Status (1)

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JP (1) JP3954233B2 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3285086B2 (ja) 1999-05-20 2002-05-27 日本電気株式会社 化学増幅型レジスト組成物
WO2001055789A2 (en) * 2000-01-25 2001-08-02 Infineon Technologies Ag Chemically amplified short wavelength resist
EP1126321A1 (en) * 2000-02-10 2001-08-22 Shipley Company LLC Positive photoresists containing crosslinked polymers
KR100674073B1 (ko) * 2000-03-07 2007-01-26 신에쓰 가가꾸 고교 가부시끼가이샤 화학 증폭 포지티브형 레지스트 재료
TWI253543B (en) * 2000-07-19 2006-04-21 Shinetsu Chemical Co Chemically amplified positive resist composition
JP3956088B2 (ja) * 2000-07-19 2007-08-08 信越化学工業株式会社 化学増幅ポジ型レジスト材料
JP4694686B2 (ja) * 2000-08-31 2011-06-08 東京応化工業株式会社 半導体素子製造方法
CN100339767C (zh) 2001-06-22 2007-09-26 和光纯药工业株式会社 抗蚀剂组合物
JP4536546B2 (ja) * 2005-02-21 2010-09-01 東京応化工業株式会社 ポジ型レジスト組成物及びそれを用いたレジストパターン形成方法
JP4893270B2 (ja) * 2006-11-29 2012-03-07 住友化学株式会社 化学増幅型ポジ型レジスト組成物
JP5553488B2 (ja) * 2008-06-06 2014-07-16 株式会社ダイセル リソグラフィー用重合体並びにその製造方法
CN103052670B (zh) 2010-07-30 2016-03-02 三菱瓦斯化学株式会社 化合物、放射线敏感性组合物和抗蚀图案形成方法
US20170058079A1 (en) 2015-08-24 2017-03-02 A School Corporation Kansai University Polymer compound, radiation sensitive composition and pattern forming method
US20170059989A1 (en) 2015-08-24 2017-03-02 A School Corporation Kansai University Polymer compound, radiation sensitive composition and pattern forming method

Also Published As

Publication number Publication date
JPH11344808A (ja) 1999-12-14

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