JP3937996B2 - 感放射性樹脂組成物 - Google Patents

感放射性樹脂組成物 Download PDF

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Publication number
JP3937996B2
JP3937996B2 JP2002295260A JP2002295260A JP3937996B2 JP 3937996 B2 JP3937996 B2 JP 3937996B2 JP 2002295260 A JP2002295260 A JP 2002295260A JP 2002295260 A JP2002295260 A JP 2002295260A JP 3937996 B2 JP3937996 B2 JP 3937996B2
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JP
Japan
Prior art keywords
group
acid
alkali
resin
carbon atoms
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Expired - Fee Related
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JP2002295260A
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English (en)
Japanese (ja)
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JP2004133055A (ja
Inventor
健一 横山
史尚 宮島
智樹 永井
英司 米田
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JSR Corp
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JSR Corp
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Priority to JP2002295260A priority Critical patent/JP3937996B2/ja
Priority to KR1020030069430A priority patent/KR101000181B1/ko
Priority to US10/679,367 priority patent/US7314701B2/en
Publication of JP2004133055A publication Critical patent/JP2004133055A/ja
Application granted granted Critical
Publication of JP3937996B2 publication Critical patent/JP3937996B2/ja
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0382Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/039Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055Radiation sensitive composition or product or process of making
    • Y10S430/106Binder containing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055Radiation sensitive composition or product or process of making
    • Y10S430/106Binder containing
    • Y10S430/111Polymer of unsaturated acid or ester
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055Radiation sensitive composition or product or process of making
    • Y10S430/114Initiator containing
    • Y10S430/115Cationic or anionic
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055Radiation sensitive composition or product or process of making
    • Y10S430/114Initiator containing
    • Y10S430/12Nitrogen compound containing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055Radiation sensitive composition or product or process of making
    • Y10S430/114Initiator containing
    • Y10S430/122Sulfur compound containing
JP2002295260A 2002-10-08 2002-10-08 感放射性樹脂組成物 Expired - Fee Related JP3937996B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2002295260A JP3937996B2 (ja) 2002-10-08 2002-10-08 感放射性樹脂組成物
KR1020030069430A KR101000181B1 (ko) 2002-10-08 2003-10-07 감방사선성 수지 조성물
US10/679,367 US7314701B2 (en) 2002-10-08 2003-10-07 Radiation-sensitive resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002295260A JP3937996B2 (ja) 2002-10-08 2002-10-08 感放射性樹脂組成物

Publications (2)

Publication Number Publication Date
JP2004133055A JP2004133055A (ja) 2004-04-30
JP3937996B2 true JP3937996B2 (ja) 2007-06-27

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Family Applications (1)

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JP2002295260A Expired - Fee Related JP3937996B2 (ja) 2002-10-08 2002-10-08 感放射性樹脂組成物

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US (1) US7314701B2 (US07314701-20080101-C00005.png)
JP (1) JP3937996B2 (US07314701-20080101-C00005.png)
KR (1) KR101000181B1 (US07314701-20080101-C00005.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI687768B (zh) * 2018-08-09 2020-03-11 日商信越化學工業股份有限公司 光阻材料及圖案形成方法

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4081677B2 (ja) * 2003-05-21 2008-04-30 信越化学工業株式会社 レジスト材料及びパターン形成方法
JP4009852B2 (ja) * 2003-05-21 2007-11-21 信越化学工業株式会社 塩基性化合物、レジスト材料及びパターン形成方法
TWI300165B (en) * 2003-08-13 2008-08-21 Tokyo Ohka Kogyo Co Ltd Resin for resist, positive resist composition and resist pattern formation method
JP4140506B2 (ja) * 2003-10-28 2008-08-27 Jsr株式会社 感放射線性樹脂組成物
US7763412B2 (en) 2004-06-08 2010-07-27 Tokyo Ohka Kogyo Co., Ltd. Polymer, positive resist composition and method for forming resist pattern
JP4484774B2 (ja) * 2004-06-28 2010-06-16 キヤノン株式会社 液体吐出ヘッドの製造方法
JP4708113B2 (ja) 2004-09-13 2011-06-22 東京応化工業株式会社 レジスト組成物、レジストパターン形成方法
US8361691B2 (en) * 2006-09-08 2013-01-29 Jsr Corporation Radiation-sensitive composition and process for producing low-molecular compound for use therein
JP5947053B2 (ja) * 2011-02-25 2016-07-06 住友化学株式会社 レジスト組成物及びレジストパターンの製造方法
KR101946646B1 (ko) * 2011-05-30 2019-02-11 스미또모 가가꾸 가부시끼가이샤 경화성 수지 조성물
JP6701363B2 (ja) * 2016-09-29 2020-05-27 富士フイルム株式会社 感活性光線性又は感放射線性樹脂組成物、パターン形成方法及び電子デバイスの製造方法
WO2018163602A1 (ja) * 2017-03-09 2018-09-13 Jsr株式会社 メッキ造形物の製造方法、及びメッキ造形物製造用感光性樹脂組成物

Family Cites Families (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5238774A (en) 1985-08-07 1993-08-24 Japan Synthetic Rubber Co., Ltd. Radiation-sensitive composition containing 1,2-quinonediazide compound, alkali-soluble resin and monooxymonocarboxylic acid ester solvent
US5215857A (en) 1985-08-07 1993-06-01 Japan Synthetic Rubber Co., Ltd. 1,2-quinonediazide containing radiation-sensitive resin composition utilizing methyl 2-hydroxypropionate, ethyl 2-hydroxypropionate or methyl 3-methoxypropionate as the solvent
JPS62123444A (ja) 1985-08-07 1987-06-04 Japan Synthetic Rubber Co Ltd ポジ型感放射線性樹脂組成物
JPH0721046B2 (ja) * 1988-02-03 1995-03-08 株式会社日立製作所 プリント配線板製造用レジスト組成物
JP2552900B2 (ja) * 1988-06-07 1996-11-13 富士写真フイルム株式会社 ポジ型フオトレジスト組成物
JPH05127369A (ja) 1991-10-31 1993-05-25 Nec Corp レジスト材料
JP3293940B2 (ja) 1993-03-12 2002-06-17 株式会社東芝 感光性組成物及びそれを用いたパターン形成方法
JP3441167B2 (ja) 1993-06-30 2003-08-25 株式会社東芝 感光性組成物及びそれを用いたパターン形成方法
JP3297199B2 (ja) * 1993-09-14 2002-07-02 株式会社東芝 レジスト組成物
JP3116751B2 (ja) 1993-12-03 2000-12-11 ジェイエスアール株式会社 感放射線性樹脂組成物
US6692887B1 (en) 1996-02-09 2004-02-17 Jsr Corporation Radiation-sensitive resin composition
JP3722538B2 (ja) * 1996-03-01 2005-11-30 ローム・アンド・ハース電子材料株式会社 ポジ型フォトレジスト組成物
TW482943B (en) * 1996-04-25 2002-04-11 Fuji Photo Film Co Ltd Positive working photosensitive composition
KR100551653B1 (ko) * 1997-08-18 2006-05-25 제이에스알 가부시끼가이샤 감방사선성수지조성물
JP3941268B2 (ja) 1998-11-10 2007-07-04 Jsr株式会社 感放射線性樹脂組成物
TW550438B (en) 1999-04-26 2003-09-01 Jsr Corp Radiation-sensitive resin composition
TWI224241B (en) 1999-04-28 2004-11-21 Jsr Corp Positive resist composition
ATE315245T1 (de) 1999-09-17 2006-02-15 Jsr Corp Strahlungsempfindliche harzzusammensetzung
IL139513A (en) 1999-11-09 2004-12-15 Jsr Corp N -sulfonylaxamide and radiation-resistant resins that use these compounds
JP4161497B2 (ja) 1999-12-24 2008-10-08 Jsr株式会社 ネガ型感放射線性樹脂組成物
EP1122605A3 (en) 2000-02-04 2001-09-19 JSR Corporation Radiation-sensitive resin composition
US6531260B2 (en) 2000-04-07 2003-03-11 Jsr Corporation Polysiloxane, method of manufacturing same, silicon-containing alicyclic compound, and radiation-sensitive resin composition
JP4576737B2 (ja) 2000-06-09 2010-11-10 Jsr株式会社 感放射線性樹脂組成物
JP4838437B2 (ja) 2000-06-16 2011-12-14 Jsr株式会社 感放射線性樹脂組成物
US6514664B1 (en) * 2000-07-20 2003-02-04 Arch Specialty Chemicals, Inc. Radiation sensitive compositions containing image quality and profile enhancement additives
KR100760146B1 (ko) 2000-09-18 2007-09-18 제이에스알 가부시끼가이샤 감방사선성 수지 조성물
JP4438218B2 (ja) 2000-11-16 2010-03-24 Jsr株式会社 感放射線性樹脂組成物
US6838225B2 (en) 2001-01-18 2005-01-04 Jsr Corporation Radiation-sensitive resin composition
KR100795112B1 (ko) * 2001-02-05 2008-01-17 후지필름 가부시키가이샤 포지티브 레지스트 조성물
JP2002251012A (ja) 2001-02-23 2002-09-06 Fuji Photo Film Co Ltd ポジ型感光性組成物
JP4910238B2 (ja) 2001-03-06 2012-04-04 Jsr株式会社 化学増幅型感放射線性樹脂組成物
US20030054287A1 (en) * 2001-04-13 2003-03-20 Fuji Photo Film Co., Ltd. Resist composition
JP3988517B2 (ja) 2001-04-27 2007-10-10 Jsr株式会社 感放射線性樹脂組成物
US6506527B1 (en) 2001-04-30 2003-01-14 Eastman Kodak Company Stain-resistant polyester overcoat for a photographic element
JP4645789B2 (ja) 2001-06-18 2011-03-09 Jsr株式会社 ネガ型感放射線性樹脂組成物
KR100863119B1 (ko) 2001-06-29 2008-10-14 제이에스알 가부시끼가이샤 산발생제, 술폰산, 술폰산 유도체 및 감방사선성 수지조성물
JP3826777B2 (ja) 2001-12-05 2006-09-27 Jsr株式会社 感放射線性樹脂組成物
US6824954B2 (en) 2001-08-23 2004-11-30 Jsr Corporation Sulfonyloxime compound, and radiation sensitive acid generator, positive type radiation sensitive resin composition and negative type radiation sensitive resin composition using same
US6818379B2 (en) * 2001-12-03 2004-11-16 Sumitomo Chemical Company, Limited Sulfonium salt and use thereof
JP4123920B2 (ja) 2001-12-20 2008-07-23 Jsr株式会社 共重合体、重合体混合物および感放射線性樹脂組成物
TW200304042A (en) 2002-02-22 2003-09-16 Jsr Corp Radiation-sensitive resin composition
US6830868B2 (en) 2002-03-08 2004-12-14 Jsr Corporation Anthracene derivative and radiation-sensitive resin composition
US7531286B2 (en) 2002-03-15 2009-05-12 Jsr Corporation Radiation-sensitive resin composition
JP4048824B2 (ja) * 2002-05-09 2008-02-20 Jsr株式会社 感放射線性樹脂組成物
US7078148B2 (en) 2002-06-03 2006-07-18 Jsr Corporation Radiation sensitive resin composition
TWI314943B (en) 2002-08-29 2009-09-21 Radiation-sensitive resin composition

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI687768B (zh) * 2018-08-09 2020-03-11 日商信越化學工業股份有限公司 光阻材料及圖案形成方法

Also Published As

Publication number Publication date
KR101000181B1 (ko) 2010-12-10
KR20040032066A (ko) 2004-04-14
US7314701B2 (en) 2008-01-01
US20050095527A1 (en) 2005-05-05
JP2004133055A (ja) 2004-04-30

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