JP3930885B2 - 銅および銅合金用のマイクロエッチング剤 - Google Patents

銅および銅合金用のマイクロエッチング剤 Download PDF

Info

Publication number
JP3930885B2
JP3930885B2 JP2005008234A JP2005008234A JP3930885B2 JP 3930885 B2 JP3930885 B2 JP 3930885B2 JP 2005008234 A JP2005008234 A JP 2005008234A JP 2005008234 A JP2005008234 A JP 2005008234A JP 3930885 B2 JP3930885 B2 JP 3930885B2
Authority
JP
Japan
Prior art keywords
copper
microetching agent
microetching
tetrazole
roughened
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2005008234A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005187945A (ja
JP2005187945A5 (enExample
Inventor
宣夫 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JCU Corp
Original Assignee
Ebara Udylite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Udylite Co Ltd filed Critical Ebara Udylite Co Ltd
Priority to JP2005008234A priority Critical patent/JP3930885B2/ja
Publication of JP2005187945A publication Critical patent/JP2005187945A/ja
Publication of JP2005187945A5 publication Critical patent/JP2005187945A5/ja
Application granted granted Critical
Publication of JP3930885B2 publication Critical patent/JP3930885B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2005008234A 2000-12-27 2005-01-14 銅および銅合金用のマイクロエッチング剤 Expired - Lifetime JP3930885B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005008234A JP3930885B2 (ja) 2000-12-27 2005-01-14 銅および銅合金用のマイクロエッチング剤

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000397187 2000-12-27
JP2005008234A JP3930885B2 (ja) 2000-12-27 2005-01-14 銅および銅合金用のマイクロエッチング剤

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2001389051A Division JP3930732B2 (ja) 2000-12-27 2001-12-21 銅および銅合金用のマイクロエッチング剤並びにこれを用いる銅または銅合金の微細粗化方法

Publications (3)

Publication Number Publication Date
JP2005187945A JP2005187945A (ja) 2005-07-14
JP2005187945A5 JP2005187945A5 (enExample) 2007-03-15
JP3930885B2 true JP3930885B2 (ja) 2007-06-13

Family

ID=34796997

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005008234A Expired - Lifetime JP3930885B2 (ja) 2000-12-27 2005-01-14 銅および銅合金用のマイクロエッチング剤

Country Status (1)

Country Link
JP (1) JP3930885B2 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3932193B2 (ja) * 2000-12-27 2007-06-20 荏原ユージライト株式会社 銅および銅合金用のマイクロエッチング剤並びにこれを用いる銅または銅合金の微細粗化方法
JP4881916B2 (ja) * 2007-06-14 2012-02-22 メック株式会社 表面粗化剤
JP5499517B2 (ja) * 2009-05-21 2014-05-21 三菱瓦斯化学株式会社 金属表面処理方法
JP5571364B2 (ja) * 2009-11-27 2014-08-13 日立化成株式会社 半導体実装用導電基材の表面処理方法、ならびにこの処理方法を用いてなる導電基材および半導体パッケージ
JP5535060B2 (ja) * 2010-12-28 2014-07-02 株式会社Ａｄｅｋａ 銅含有材料用エッチング剤組成物及び銅含有材料のエッチング方法
JP5692108B2 (ja) * 2012-02-03 2015-04-01 日立化成株式会社 半導体実装用導電基材の表面処理方法、ならびにこの処理方法を用いてなる導電基材および半導体パッケージ
JP6256733B2 (ja) * 2012-02-29 2018-01-10 日立金属株式会社 セラミックス回路基板の製造方法およびセラミックス回路基板
JP6464578B2 (ja) 2013-08-01 2019-02-06 三菱瓦斯化学株式会社 プリント配線板の製造方法
JP6782561B2 (ja) * 2015-07-16 2020-11-11 Ｊｘ金属株式会社 キャリア付銅箔、積層体、積層体の製造方法、プリント配線板の製造方法及び電子機器の製造方法
KR102340997B1 (ko) * 2016-10-21 2021-12-21 가부시키가이샤 아데카 에칭액 조성물 및 에칭 방법

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3407141A (en) * 1966-02-03 1968-10-22 Allied Chem Dissolution of metal with acidified hydrogen peroxide solutions
US3597290A (en) * 1968-03-25 1971-08-03 Mitsubishi Edogawa Kagaku Kk Method for chemically dissolving metal
US3668131A (en) * 1968-08-09 1972-06-06 Allied Chem Dissolution of metal with acidified hydrogen peroxide solutions
JPH1129883A (ja) * 1997-07-08 1999-02-02 Mec Kk 銅および銅合金のマイクロエッチング剤
JP2000064067A (ja) * 1998-06-09 2000-02-29 Ebara Densan Ltd エッチング液および銅表面の粗化処理方法
JP4264679B2 (ja) * 1999-04-09 2009-05-20 三菱瓦斯化学株式会社 プリント配線板の製造方法

Also Published As

Publication number Publication date
JP2005187945A (ja) 2005-07-14

Similar Documents

Publication Publication Date Title
US6746621B2 (en) Micro-etching composition for copper or copper alloy, micro-etching method, and method for manufacturing printed circuit board
JP5402939B2 (ja) 銅の表面処理方法及び銅
US6733886B2 (en) Laminate and method of manufacturing the same
TWI411705B (zh) Etchant
EP3680363B1 (en) Microetching agent for copper, copper surface roughening method and wiring board production method
JP4278705B1 (ja) エッチング液
JP2001200380A (ja) 銅または銅合金のエッチング剤
JP2005502196A (ja) フレキシブル回路用液晶ポリマー
CN108138332B (zh) 用于铜和铜合金表面的表面处理剂以及用于处理铜或铜合金表面的方法
JP4644365B2 (ja) 銅表面を前処理するための溶液及び方法
JP3930885B2 (ja) 銅および銅合金用のマイクロエッチング剤
CN103510089B (zh) 蚀刻用液体组合物和使用其的多层印刷电路板的制造方法
JP3930732B2 (ja) 銅および銅合金用のマイクロエッチング剤並びにこれを用いる銅または銅合金の微細粗化方法
CN103703164A (zh) 提供有机抗蚀剂与铜或铜合金表面的粘附的方法
JP4143262B2 (ja) 銅表面の前処理のための方法
JPWO2007040046A1 (ja) ニッケル−クロム合金用エッチング液
JP3932193B2 (ja) 銅および銅合金用のマイクロエッチング剤並びにこれを用いる銅または銅合金の微細粗化方法
JP4834731B2 (ja) 改良マイクロエッチング液
JP2010150613A (ja) 銅の表面処理剤および表面処理方法、並びに銅表面の皮膜
JP3540887B2 (ja) 選択的ニッケル剥離液およびこれを用いる剥離方法
JP4431860B2 (ja) 銅および銅合金の表面処理剤
JP2884935B2 (ja) ニッケル又はニッケル合金のエッチング液及びこのエッチング液を用いる方法並びにこのエッチング液を用いて配線板を製造する方法
CN101501250B (zh) 镀锡或者镀锡合金用晶须防止剂和利用其的晶须防止方法
CN120082889B (zh) 一种碱性微蚀溶液及其制备方法与微蚀方法
JP4776217B2 (ja) 銅メタライズド積層板及びその製造方法

Legal Events

Date Code Title Description
A256 Written notification of co-pending application filed on the same date by different applicants

Free format text: JAPANESE INTERMEDIATE CODE: A2516

Effective date: 20061128

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070125

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20070220

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20070309

R150 Certificate of patent or registration of utility model

Ref document number: 3930885

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110316

Year of fee payment: 4

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120316

Year of fee payment: 5

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120316

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130316

Year of fee payment: 6

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130316

Year of fee payment: 6

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130316

Year of fee payment: 6

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140316

Year of fee payment: 7

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term