JP2005187945A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2005187945A5 JP2005187945A5 JP2005008234A JP2005008234A JP2005187945A5 JP 2005187945 A5 JP2005187945 A5 JP 2005187945A5 JP 2005008234 A JP2005008234 A JP 2005008234A JP 2005008234 A JP2005008234 A JP 2005008234A JP 2005187945 A5 JP2005187945 A5 JP 2005187945A5
- Authority
- JP
- Japan
- Prior art keywords
- copper
- tetrazole
- derivatives
- group
- aminotetrazole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 7
- 229910052802 copper Inorganic materials 0.000 claims 7
- 239000010949 copper Substances 0.000 claims 7
- 229910000881 Cu alloy Inorganic materials 0.000 claims 6
- 239000003795 chemical substances by application Substances 0.000 claims 6
- 150000003536 tetrazoles Chemical class 0.000 claims 5
- 150000001875 compounds Chemical class 0.000 claims 4
- 238000005530 etching Methods 0.000 claims 3
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 claims 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims 2
- 229910021645 metal ion Inorganic materials 0.000 claims 2
- WGPNLKPTYJCEKI-UHFFFAOYSA-N 1-ethyltetrazol-5-amine Chemical compound CCN1N=NN=C1N WGPNLKPTYJCEKI-UHFFFAOYSA-N 0.000 claims 1
- GTKOKCQMHAGFSM-UHFFFAOYSA-N 1-methyltetrazol-5-amine Chemical compound CN1N=NN=C1N GTKOKCQMHAGFSM-UHFFFAOYSA-N 0.000 claims 1
- ULRPISSMEBPJLN-UHFFFAOYSA-N 2h-tetrazol-5-amine Chemical compound NC1=NN=NN1 ULRPISSMEBPJLN-UHFFFAOYSA-N 0.000 claims 1
- WYXQDGGJZMWJOX-UHFFFAOYSA-N 5-ethyl-1-methyltetrazole Chemical compound CCC1=NN=NN1C WYXQDGGJZMWJOX-UHFFFAOYSA-N 0.000 claims 1
- XZGLNCKSNVGDNX-UHFFFAOYSA-N 5-methyl-2h-tetrazole Chemical compound CC=1N=NNN=1 XZGLNCKSNVGDNX-UHFFFAOYSA-N 0.000 claims 1
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical group [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 claims 1
- 150000001335 aliphatic alkanes Chemical class 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- -1 gold ion Chemical class 0.000 claims 1
- MUJIDPITZJWBSW-UHFFFAOYSA-N palladium(2+) Chemical compound [Pd+2] MUJIDPITZJWBSW-UHFFFAOYSA-N 0.000 claims 1
- 150000002978 peroxides Chemical class 0.000 claims 1
- 238000007788 roughening Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005008234A JP3930885B2 (ja) | 2000-12-27 | 2005-01-14 | 銅および銅合金用のマイクロエッチング剤 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000397187 | 2000-12-27 | ||
| JP2005008234A JP3930885B2 (ja) | 2000-12-27 | 2005-01-14 | 銅および銅合金用のマイクロエッチング剤 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001389051A Division JP3930732B2 (ja) | 2000-12-27 | 2001-12-21 | 銅および銅合金用のマイクロエッチング剤並びにこれを用いる銅または銅合金の微細粗化方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005187945A JP2005187945A (ja) | 2005-07-14 |
| JP2005187945A5 true JP2005187945A5 (enExample) | 2007-03-15 |
| JP3930885B2 JP3930885B2 (ja) | 2007-06-13 |
Family
ID=34796997
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005008234A Expired - Lifetime JP3930885B2 (ja) | 2000-12-27 | 2005-01-14 | 銅および銅合金用のマイクロエッチング剤 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3930885B2 (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3932193B2 (ja) * | 2000-12-27 | 2007-06-20 | 荏原ユージライト株式会社 | 銅および銅合金用のマイクロエッチング剤並びにこれを用いる銅または銅合金の微細粗化方法 |
| JP4881916B2 (ja) * | 2007-06-14 | 2012-02-22 | メック株式会社 | 表面粗化剤 |
| JP5499517B2 (ja) * | 2009-05-21 | 2014-05-21 | 三菱瓦斯化学株式会社 | 金属表面処理方法 |
| JP5571364B2 (ja) * | 2009-11-27 | 2014-08-13 | 日立化成株式会社 | 半導体実装用導電基材の表面処理方法、ならびにこの処理方法を用いてなる導電基材および半導体パッケージ |
| JP5535060B2 (ja) * | 2010-12-28 | 2014-07-02 | 株式会社Ａｄｅｋａ | 銅含有材料用エッチング剤組成物及び銅含有材料のエッチング方法 |
| JP5692108B2 (ja) * | 2012-02-03 | 2015-04-01 | 日立化成株式会社 | 半導体実装用導電基材の表面処理方法、ならびにこの処理方法を用いてなる導電基材および半導体パッケージ |
| JP6256733B2 (ja) * | 2012-02-29 | 2018-01-10 | 日立金属株式会社 | セラミックス回路基板の製造方法およびセラミックス回路基板 |
| JP6464578B2 (ja) | 2013-08-01 | 2019-02-06 | 三菱瓦斯化学株式会社 | プリント配線板の製造方法 |
| JP6782561B2 (ja) * | 2015-07-16 | 2020-11-11 | Ｊｘ金属株式会社 | キャリア付銅箔、積層体、積層体の製造方法、プリント配線板の製造方法及び電子機器の製造方法 |
| KR102340997B1 (ko) * | 2016-10-21 | 2021-12-21 | 가부시키가이샤 아데카 | 에칭액 조성물 및 에칭 방법 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3407141A (en) * | 1966-02-03 | 1968-10-22 | Allied Chem | Dissolution of metal with acidified hydrogen peroxide solutions |
| US3597290A (en) * | 1968-03-25 | 1971-08-03 | Mitsubishi Edogawa Kagaku Kk | Method for chemically dissolving metal |
| US3668131A (en) * | 1968-08-09 | 1972-06-06 | Allied Chem | Dissolution of metal with acidified hydrogen peroxide solutions |
| JPH1129883A (ja) * | 1997-07-08 | 1999-02-02 | Mec Kk | 銅および銅合金のマイクロエッチング剤 |
| JP2000064067A (ja) * | 1998-06-09 | 2000-02-29 | Ebara Densan Ltd | エッチング液および銅表面の粗化処理方法 |
| JP4264679B2 (ja) * | 1999-04-09 | 2009-05-20 | 三菱瓦斯化学株式会社 | プリント配線板の製造方法 |
-
2005
- 2005-01-14 JP JP2005008234A patent/JP3930885B2/ja not_active Expired - Lifetime