JP3918359B2 - 研磨パッド用重合体組成物および研磨パッド - Google Patents

研磨パッド用重合体組成物および研磨パッド Download PDF

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Publication number
JP3918359B2
JP3918359B2 JP12684299A JP12684299A JP3918359B2 JP 3918359 B2 JP3918359 B2 JP 3918359B2 JP 12684299 A JP12684299 A JP 12684299A JP 12684299 A JP12684299 A JP 12684299A JP 3918359 B2 JP3918359 B2 JP 3918359B2
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Japan
Prior art keywords
water
polishing pad
polymer
potassium
polymer composition
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Expired - Lifetime
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JP12684299A
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Japanese (ja)
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JP2000034416A (ja
JP2000034416A5 (https=
Inventor
亨 長谷川
英雄 中西
豊 小林
知男 河村
俊博 小川
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JSR Corp
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JSR Corp
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Priority to JP12684299A priority Critical patent/JP3918359B2/ja
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Publication of JP2000034416A5 publication Critical patent/JP2000034416A5/ja
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  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP12684299A 1998-05-15 1999-05-07 研磨パッド用重合体組成物および研磨パッド Expired - Lifetime JP3918359B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12684299A JP3918359B2 (ja) 1998-05-15 1999-05-07 研磨パッド用重合体組成物および研磨パッド

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP10-133527 1998-05-15
JP13352798 1998-05-15
JP12684299A JP3918359B2 (ja) 1998-05-15 1999-05-07 研磨パッド用重合体組成物および研磨パッド

Publications (3)

Publication Number Publication Date
JP2000034416A JP2000034416A (ja) 2000-02-02
JP2000034416A5 JP2000034416A5 (https=) 2004-12-16
JP3918359B2 true JP3918359B2 (ja) 2007-05-23

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JP12684299A Expired - Lifetime JP3918359B2 (ja) 1998-05-15 1999-05-07 研磨パッド用重合体組成物および研磨パッド

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JP (1) JP3918359B2 (https=)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6953388B2 (en) 1999-12-22 2005-10-11 Toray Industries, Inc. Polishing pad, and method and apparatus for polishing
JP3925041B2 (ja) 2000-05-31 2007-06-06 Ｊｓｒ株式会社 研磨パッド用組成物及びこれを用いた研磨パッド
JP2002190460A (ja) * 2000-10-12 2002-07-05 Toshiba Corp 研磨布、研磨装置および半導体装置の製造方法
JP3826702B2 (ja) * 2000-10-24 2006-09-27 Ｊｓｒ株式会社 研磨パッド用組成物及びこれを用いた研磨パッド
KR100858392B1 (ko) * 2001-04-25 2008-09-11 제이에스알 가부시끼가이샤 반도체 웨이퍼용 연마 패드와, 이를 구비한 반도체웨이퍼용 연마 적층체와, 반도체 웨이퍼의 연마 방법
JP2003100682A (ja) * 2001-09-25 2003-04-04 Jsr Corp 半導体ウエハ用研磨パッド
JP2003311604A (ja) * 2002-04-26 2003-11-05 Chiyoda Kk 研磨パッド
US20040058623A1 (en) * 2002-09-20 2004-03-25 Lam Research Corporation Polishing media for chemical mechanical planarization (CMP)
JP4039214B2 (ja) 2002-11-05 2008-01-30 Ｊｓｒ株式会社 研磨パッド
US20040224622A1 (en) 2003-04-15 2004-11-11 Jsr Corporation Polishing pad and production method thereof
JP4292025B2 (ja) 2003-05-23 2009-07-08 Ｊｓｒ株式会社 研磨パッド
US7086932B2 (en) * 2004-05-11 2006-08-08 Freudenberg Nonwovens Polishing pad
US7442116B2 (en) 2003-11-04 2008-10-28 Jsr Corporation Chemical mechanical polishing pad
KR100640141B1 (ko) 2004-04-21 2006-10-31 제이에스알 가부시끼가이샤 화학 기계 연마 패드 및 그 제조 방법 및 화학 기계 연마방법
DE602005007125D1 (de) 2004-09-17 2008-07-10 Jsr Corp Chemisch-mechanisches Polierkissen und chemisch-mechanisches Polierverfahren
JP4475404B2 (ja) 2004-10-14 2010-06-09 Ｊｓｒ株式会社 研磨パッド
KR20070070094A (ko) 2005-12-28 2007-07-03 제이에스알 가부시끼가이샤 화학 기계 연마 패드 및 화학 기계 연마 방법
EP1975985A4 (en) 2006-01-25 2011-08-10 Jsr Corp CHEMICAL-MECHANICAL POLISHING ELEMENT AND METHOD OF MANUFACTURING THEREOF
KR20080090496A (ko) 2006-02-03 2008-10-08 제이에스알 가부시끼가이샤 화학 기계 연마 패드
JP2009117815A (ja) 2007-10-18 2009-05-28 Jsr Corp 化学機械研磨パッドの製造方法
JPWO2009072405A1 (ja) * 2007-12-07 2011-04-21 Jsr株式会社 化学機械研磨パッドおよび化学機械研磨方法
JP2008149458A (ja) * 2008-03-03 2008-07-03 Jsr Corp 研磨パッド用組成物及びこれを用いた研磨パッド
JP5248954B2 (ja) 2008-09-02 2013-07-31 スリーエム イノベイティブ プロパティズ カンパニー 抱接化合物を含む研磨材製品
JP5062455B2 (ja) 2010-07-12 2012-10-31 Ｊｓｒ株式会社 化学機械研磨パッドおよび化学機械研磨方法
KR101656414B1 (ko) * 2014-10-22 2016-09-12 주식회사 케이씨텍 분산성이 개선된 슬러리 조성물
KR102638363B1 (ko) 2018-12-03 2024-02-19 주식회사 쿠라레 연마층용 폴리우레탄, 연마층 및 연마 패드

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63212464A (ja) * 1987-02-26 1988-09-05 Nikko Rika Kk 研磨板
US5453312A (en) * 1993-10-29 1995-09-26 Minnesota Mining And Manufacturing Company Abrasive article, a process for its manufacture, and a method of using it to reduce a workpiece surface
JPH07214473A (ja) * 1994-02-01 1995-08-15 Takino Gomme Seisakusho:Kk ゴム質研磨材とその製法
JPH10204418A (ja) * 1997-01-27 1998-08-04 Kao Corp 研磨材組成物及びこれを用いたカーボン材料からなる基板の製造方法
EP1011919B1 (en) * 1997-08-06 2004-10-20 Rodel Holdings, Inc. Method of manufacturing a polishing pad
JPH11285961A (ja) * 1998-04-03 1999-10-19 Nikon Corp 研磨パッド及び研磨方法

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