JP3916846B2 - 基板研磨装置及び基板研磨方法 - Google Patents

基板研磨装置及び基板研磨方法 Download PDF

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Publication number
JP3916846B2
JP3916846B2 JP2000157007A JP2000157007A JP3916846B2 JP 3916846 B2 JP3916846 B2 JP 3916846B2 JP 2000157007 A JP2000157007 A JP 2000157007A JP 2000157007 A JP2000157007 A JP 2000157007A JP 3916846 B2 JP3916846 B2 JP 3916846B2
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Japan
Prior art keywords
polishing
substrate
semiconductor substrate
film thickness
plating film
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Expired - Fee Related
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JP2000157007A
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English (en)
Japanese (ja)
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JP2001338902A5 (pt
JP2001338902A (ja
Inventor
憲雄 木村
達也 小濱
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Ebara Corp
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Ebara Corp
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Priority to JP2000157007A priority Critical patent/JP3916846B2/ja
Priority to US09/864,208 priority patent/US20020023715A1/en
Publication of JP2001338902A publication Critical patent/JP2001338902A/ja
Publication of JP2001338902A5 publication Critical patent/JP2001338902A5/ja
Application granted granted Critical
Publication of JP3916846B2 publication Critical patent/JP3916846B2/ja
Priority to US11/806,581 priority patent/US20070238395A1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2000157007A 2000-05-26 2000-05-26 基板研磨装置及び基板研磨方法 Expired - Fee Related JP3916846B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2000157007A JP3916846B2 (ja) 2000-05-26 2000-05-26 基板研磨装置及び基板研磨方法
US09/864,208 US20020023715A1 (en) 2000-05-26 2001-05-25 Substrate polishing apparatus and substrate polishing mehod
US11/806,581 US20070238395A1 (en) 2000-05-26 2007-06-01 Substrate polishing apparatus and substrate polishing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000157007A JP3916846B2 (ja) 2000-05-26 2000-05-26 基板研磨装置及び基板研磨方法

Publications (3)

Publication Number Publication Date
JP2001338902A JP2001338902A (ja) 2001-12-07
JP2001338902A5 JP2001338902A5 (pt) 2005-07-07
JP3916846B2 true JP3916846B2 (ja) 2007-05-23

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Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3916375B2 (ja) 2000-06-02 2007-05-16 株式会社荏原製作所 ポリッシング方法および装置
JP4698144B2 (ja) 2003-07-31 2011-06-08 富士通セミコンダクター株式会社 半導体装置の製造方法
JP5744382B2 (ja) * 2008-07-24 2015-07-08 株式会社荏原製作所 基板処理装置および基板処理方法
KR101958874B1 (ko) 2008-06-04 2019-03-15 가부시키가이샤 에바라 세이사꾸쇼 기판처리장치, 기판처리방법, 기판 파지기구, 및 기판 파지방법
KR101065168B1 (ko) 2009-09-09 2011-09-16 주식회사 아이매스 웨이퍼용 회전식 연마장치
CN103367105B (zh) * 2012-03-26 2016-08-10 上海华虹宏力半导体制造有限公司 一种笔形海绵固定装置
JP6740065B2 (ja) * 2016-09-13 2020-08-12 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置、基板処理装置、基板洗浄方法および基板処理方法
JP2019167520A (ja) * 2018-03-22 2019-10-03 住友精化株式会社 ポリプロピレンカーボネート含有溶液及びポリプロピレンカーボネート含有層、並びに複合部材の製造方法

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JP2001338902A (ja) 2001-12-07

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