JP3903204B2 - 表示装置の製造方法 - Google Patents

表示装置の製造方法 Download PDF

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Publication number
JP3903204B2
JP3903204B2 JP2001015425A JP2001015425A JP3903204B2 JP 3903204 B2 JP3903204 B2 JP 3903204B2 JP 2001015425 A JP2001015425 A JP 2001015425A JP 2001015425 A JP2001015425 A JP 2001015425A JP 3903204 B2 JP3903204 B2 JP 3903204B2
Authority
JP
Japan
Prior art keywords
sealing member
display device
end side
light emitting
resin material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2001015425A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002216950A (ja
Inventor
祐一 岩瀬
靖典 鬼島
敏昌 酒寄
賢一 堀江
孝司 椙尾
武人 三浦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2001015425A priority Critical patent/JP3903204B2/ja
Application filed by Sony Corp filed Critical Sony Corp
Priority to PCT/JP2002/000501 priority patent/WO2002059861A1/ja
Priority to KR10-2003-7009704A priority patent/KR20030076623A/ko
Priority to TW091101138A priority patent/TWI308030B/zh
Priority to US10/466,901 priority patent/US8797484B2/en
Priority to EP02716357A priority patent/EP1361556A4/en
Priority to CNA028071603A priority patent/CN1578973A/zh
Publication of JP2002216950A publication Critical patent/JP2002216950A/ja
Application granted granted Critical
Publication of JP3903204B2 publication Critical patent/JP3903204B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
    • B32B37/003—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality to avoid air inclusion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1858—Handling of layers or the laminate using vacuum
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional radiating surfaces
    • H05B33/14—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
    • B32B2037/243—Coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1284—Application of adhesive
    • B32B37/1292—Application of adhesive selectively, e.g. in stripes, in patterns
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1866—Handling of layers or the laminate conforming the layers or laminate to a convex or concave profile
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/302—Details of OLEDs of OLED structures
    • H10K2102/3023—Direction of light emission
    • H10K2102/3026—Top emission

Landscapes

  • Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP2001015425A 2001-01-24 2001-01-24 表示装置の製造方法 Expired - Fee Related JP3903204B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2001015425A JP3903204B2 (ja) 2001-01-24 2001-01-24 表示装置の製造方法
KR10-2003-7009704A KR20030076623A (ko) 2001-01-24 2002-01-24 표시장치
TW091101138A TWI308030B (enExample) 2001-01-24 2002-01-24
US10/466,901 US8797484B2 (en) 2001-01-24 2002-01-24 Display apparatus
PCT/JP2002/000501 WO2002059861A1 (en) 2001-01-24 2002-01-24 Display device
EP02716357A EP1361556A4 (en) 2001-01-24 2002-01-24 DISPLAY DEVICE
CNA028071603A CN1578973A (zh) 2001-01-24 2002-01-24 显示装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001015425A JP3903204B2 (ja) 2001-01-24 2001-01-24 表示装置の製造方法

Publications (2)

Publication Number Publication Date
JP2002216950A JP2002216950A (ja) 2002-08-02
JP3903204B2 true JP3903204B2 (ja) 2007-04-11

Family

ID=18881977

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001015425A Expired - Fee Related JP3903204B2 (ja) 2001-01-24 2001-01-24 表示装置の製造方法

Country Status (7)

Country Link
US (1) US8797484B2 (enExample)
EP (1) EP1361556A4 (enExample)
JP (1) JP3903204B2 (enExample)
KR (1) KR20030076623A (enExample)
CN (1) CN1578973A (enExample)
TW (1) TWI308030B (enExample)
WO (1) WO2002059861A1 (enExample)

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* Cited by examiner, † Cited by third party
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JP4240276B2 (ja) 2002-07-05 2009-03-18 株式会社半導体エネルギー研究所 発光装置
JP2004191608A (ja) * 2002-12-11 2004-07-08 Sony Corp 表示装置およびその製造方法
TWI352553B (en) * 2002-12-26 2011-11-11 Semiconductor Energy Lab Light emitting device and a method for manufacturi
JP4581342B2 (ja) * 2003-06-13 2010-11-17 株式会社スリーボンド 貼合装置
US7135352B2 (en) 2004-02-26 2006-11-14 Eastman Kodak Company Method of fabricating a cover plate bonded over an encapsulated OLEDs
JP4300476B2 (ja) * 2004-04-27 2009-07-22 セイコーエプソン株式会社 有機ｅｌ装置の製造方法
JP2008226859A (ja) * 2004-10-22 2008-09-25 Seiko Epson Corp 有機エレクトロルミネッセンス装置の製造方法、及び有機エレクトロルミネッセンス装置
US20070000603A1 (en) * 2005-07-01 2007-01-04 Nordson Corporation Method of forming at least one continuous line of viscous material between two components of an electronic assembly
KR100793360B1 (ko) * 2006-01-16 2008-01-11 삼성에스디아이 주식회사 레이저 조사 장치용 마스크
US7696683B2 (en) 2006-01-19 2010-04-13 Toppan Printing Co., Ltd. Organic electroluminescent element and the manufacturing method
KR100801623B1 (ko) 2006-06-23 2008-02-11 삼성전자주식회사 표시장치의 제조방법과 이에 사용되는 표시장치의 제조장치및 이에 의하여 제조된 표시장치
JP5164422B2 (ja) * 2007-04-26 2013-03-21 本田技研工業株式会社 燃料電池用膜電極構造体及びセパレータの積層方法及びその積層装置
US20100148160A1 (en) * 2007-05-18 2010-06-17 Jie Cao Organic electronic devices protected by elastomeric laminating adhesive
JP5197089B2 (ja) * 2008-03-27 2013-05-15 株式会社ジャパンディスプレイセントラル 平面表示装置の製造方法及び製造装置
JP5195385B2 (ja) * 2008-12-15 2013-05-08 カシオ計算機株式会社 保護板一体型表示パネルの製造装置
JP2009187962A (ja) * 2009-05-26 2009-08-20 Seiko Epson Corp 電気光学装置及び電子機器
US8246867B2 (en) * 2009-10-16 2012-08-21 Corning Incorporated Method for assembling an optoelectronic device
SG179299A1 (en) * 2010-09-13 2012-04-27 Trimech Technology Pte Ltd A display panel substrate assembly, an apparatus and a method for forming a display panel substrate assembly
US9269869B2 (en) * 2011-12-12 2016-02-23 Hitachi, Ltd. Semiconductor optical element
TWI457070B (zh) * 2011-12-23 2014-10-11 Au Optronics Corp 顯示裝置及其組裝方法
JP5857765B2 (ja) * 2012-02-01 2016-02-10 コニカミノルタ株式会社 有機エレクトロルミネッセンス素子
US20140071392A1 (en) * 2012-09-07 2014-03-13 Apple Inc. Initial contact control for lamination
JP6332032B2 (ja) 2012-11-16 2018-05-30 コニカミノルタ株式会社 透光性電極、及び、電子デバイス
CN103848575B (zh) * 2012-12-07 2016-09-14 普罗科技有限公司 薄膜晶体管液晶显示面板制造方法
CN104626720B (zh) * 2013-11-07 2017-02-15 宸鸿科技(厦门)有限公司 面板贴合结构以及贴合方法
CN103647007B (zh) * 2013-12-30 2016-06-08 广州市鸿利光电股份有限公司 一种cob封装方法
US20150372251A1 (en) * 2014-06-19 2015-12-24 Toshishige Fujii Electric element package
CN104022234B (zh) * 2014-06-24 2016-10-26 深圳市华星光电技术有限公司 Oled封装设备及oled面板的封装方法
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Also Published As

Publication number Publication date
WO2002059861A1 (en) 2002-08-01
EP1361556A4 (en) 2009-08-05
US8797484B2 (en) 2014-08-05
CN1578973A (zh) 2005-02-09
TWI308030B (enExample) 2009-03-21
JP2002216950A (ja) 2002-08-02
EP1361556A1 (en) 2003-11-12
US20040100601A1 (en) 2004-05-27
KR20030076623A (ko) 2003-09-26

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