JP3902017B2 - 半田高さ計測装置およびその方法 - Google Patents

半田高さ計測装置およびその方法 Download PDF

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Publication number
JP3902017B2
JP3902017B2 JP2002017367A JP2002017367A JP3902017B2 JP 3902017 B2 JP3902017 B2 JP 3902017B2 JP 2002017367 A JP2002017367 A JP 2002017367A JP 2002017367 A JP2002017367 A JP 2002017367A JP 3902017 B2 JP3902017 B2 JP 3902017B2
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Japan
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solder
height
image
transmitted
measured
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JP2002017367A
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Japanese (ja)
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JP2003214830A5 (enExample
JP2003214830A (ja
Inventor
晴子 窪田
信治 吉野
博之 井上
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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Priority to JP2002017367A priority Critical patent/JP3902017B2/ja
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  • Image Processing (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Image Analysis (AREA)
  • Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
JP2002017367A 2002-01-25 2002-01-25 半田高さ計測装置およびその方法 Expired - Fee Related JP3902017B2 (ja)

Priority Applications (1)

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JP2002017367A JP3902017B2 (ja) 2002-01-25 2002-01-25 半田高さ計測装置およびその方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002017367A JP3902017B2 (ja) 2002-01-25 2002-01-25 半田高さ計測装置およびその方法

Publications (3)

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JP2003214830A JP2003214830A (ja) 2003-07-30
JP2003214830A5 JP2003214830A5 (enExample) 2005-07-28
JP3902017B2 true JP3902017B2 (ja) 2007-04-04

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JP2002017367A Expired - Fee Related JP3902017B2 (ja) 2002-01-25 2002-01-25 半田高さ計測装置およびその方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0905006D0 (en) * 2009-03-24 2009-05-06 Rawlinson Paul Testing and mounting IC's on PCB's

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JP2003214830A (ja) 2003-07-30

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