JP3874667B2 - プローブ装置 - Google Patents

プローブ装置 Download PDF

Info

Publication number
JP3874667B2
JP3874667B2 JP2002016060A JP2002016060A JP3874667B2 JP 3874667 B2 JP3874667 B2 JP 3874667B2 JP 2002016060 A JP2002016060 A JP 2002016060A JP 2002016060 A JP2002016060 A JP 2002016060A JP 3874667 B2 JP3874667 B2 JP 3874667B2
Authority
JP
Japan
Prior art keywords
probe
card
wireless communication
information
probe card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2002016060A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003218176A (ja
JP2003218176A5 (enExample
Inventor
将人 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2002016060A priority Critical patent/JP3874667B2/ja
Publication of JP2003218176A publication Critical patent/JP2003218176A/ja
Publication of JP2003218176A5 publication Critical patent/JP2003218176A5/ja
Application granted granted Critical
Publication of JP3874667B2 publication Critical patent/JP3874667B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2002016060A 2002-01-24 2002-01-24 プローブ装置 Expired - Fee Related JP3874667B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002016060A JP3874667B2 (ja) 2002-01-24 2002-01-24 プローブ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002016060A JP3874667B2 (ja) 2002-01-24 2002-01-24 プローブ装置

Publications (3)

Publication Number Publication Date
JP2003218176A JP2003218176A (ja) 2003-07-31
JP2003218176A5 JP2003218176A5 (enExample) 2005-08-11
JP3874667B2 true JP3874667B2 (ja) 2007-01-31

Family

ID=27652244

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002016060A Expired - Fee Related JP3874667B2 (ja) 2002-01-24 2002-01-24 プローブ装置

Country Status (1)

Country Link
JP (1) JP3874667B2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007183193A (ja) * 2006-01-10 2007-07-19 Micronics Japan Co Ltd プロービング装置
JP4911355B2 (ja) * 2007-05-25 2012-04-04 横河電機株式会社 テストシステム
KR101388674B1 (ko) 2007-09-07 2014-04-25 삼성전자주식회사 고속 원 샷 웨이퍼 테스트를 위한 무선 인터페이스 프로브카드 및 이를 구비한 반도체 테스트 장치
JP5086983B2 (ja) * 2008-12-15 2012-11-28 株式会社東芝 プローブ装置、処理装置及びウェハプローブテストの処理方法
JP5299089B2 (ja) * 2009-05-28 2013-09-25 富士電機株式会社 半導体チップの試験装置および試験方法
WO2010140643A1 (en) * 2009-06-02 2010-12-09 Tokyo Electron Limited Test unit and test system
CN113267326B (zh) * 2021-05-26 2025-03-14 苏州雷霆光电科技有限公司 Led测试治具
KR102784827B1 (ko) * 2024-07-11 2025-03-21 주식회사 퓨어스마트 Rf 간섭 방지하는 rf 모듈 검사 시스템

Also Published As

Publication number Publication date
JP2003218176A (ja) 2003-07-31

Similar Documents

Publication Publication Date Title
JPH10199777A (ja) 半導体製造プロセス期間中の情報を格納するシステム、方法及び装置
JP6220596B2 (ja) プローバ
WO1996009644A1 (en) Container for ic trays, and base plate for mounting the container
JP5535492B2 (ja) 半導体集積回路の検査装置及び半導体集積回路の検査方法
JPH06273445A (ja) プローブ装置
JP3874667B2 (ja) プローブ装置
EP0552036A1 (en) A probing apparatus having an automatic probe card installation mechanism and a semiconductor wafer testing system including the same
US6198273B1 (en) IC tester simultaneously testing plural ICS
JP4458077B2 (ja) 検査用チップソケット
US6404212B1 (en) Testing of BGA and other CSP packages using probing techniques
JPWO2006006220A1 (ja) 押圧部材および電子部品ハンドリング装置
JP4346980B2 (ja) 表面実装機
US12336111B2 (en) Holder management device and display method
JP2547406B2 (ja) 多品種測定装置
JPS63299243A (ja) プロ−ブカ−ドアダプタ
JPH0685409B2 (ja) ウェハ搬送装置
JPS63217636A (ja) ウエハプロ−バ
JPH01206270A (ja) プローブカード自動交換機能付プローブ装置
JP4912080B2 (ja) 電子部品ハンドリング装置およびその運用方法、ならびに試験用トレイおよびプッシャ
JP2006100594A (ja) 部品実装方法及び部品実装装置
JP2529559B2 (ja) 基板処理装置
JP2626772B2 (ja) プローブ装置
JPS63244637A (ja) プロ−ブ装置
JP2715266B2 (ja) プローブ装置
JPH02119235A (ja) プローブ装置

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20050121

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20050121

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20060712

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20060718

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060919

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20061024

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20061024

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20121102

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20151102

Year of fee payment: 9

LAPS Cancellation because of no payment of annual fees