JP3842657B2 - ウエットエッチングシステム - Google Patents
ウエットエッチングシステム Download PDFInfo
- Publication number
- JP3842657B2 JP3842657B2 JP2002020577A JP2002020577A JP3842657B2 JP 3842657 B2 JP3842657 B2 JP 3842657B2 JP 2002020577 A JP2002020577 A JP 2002020577A JP 2002020577 A JP2002020577 A JP 2002020577A JP 3842657 B2 JP3842657 B2 JP 3842657B2
- Authority
- JP
- Japan
- Prior art keywords
- etching
- tank
- etching solution
- circulation path
- air vent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Weting (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002020577A JP3842657B2 (ja) | 2002-01-29 | 2002-01-29 | ウエットエッチングシステム |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002020577A JP3842657B2 (ja) | 2002-01-29 | 2002-01-29 | ウエットエッチングシステム |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2003224106A JP2003224106A (ja) | 2003-08-08 |
JP2003224106A5 JP2003224106A5 (enrdf_load_stackoverflow) | 2005-08-11 |
JP3842657B2 true JP3842657B2 (ja) | 2006-11-08 |
Family
ID=27744038
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002020577A Expired - Fee Related JP3842657B2 (ja) | 2002-01-29 | 2002-01-29 | ウエットエッチングシステム |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3842657B2 (enrdf_load_stackoverflow) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100655429B1 (ko) | 2005-11-10 | 2006-12-08 | 삼성전자주식회사 | 인산 용액을 재생하는 방법 및 장치, 그리고 인산 용액을사용하여 기판을 처리하는 장치 |
JP2008103678A (ja) | 2006-09-20 | 2008-05-01 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP4879126B2 (ja) * | 2007-09-12 | 2012-02-22 | 大日本スクリーン製造株式会社 | 基板処理装置 |
TWI452620B (zh) * | 2007-08-20 | 2014-09-11 | Chemical Art Technology Inc | Etching apparatus and etching apparatus |
US8211810B2 (en) | 2007-09-21 | 2012-07-03 | Dainippon Screen Mfg. Co., Ltd. | Substrate processing apparatus and substrate processing method for performing etching process with phosphoric acid solution |
JP4966223B2 (ja) * | 2008-02-29 | 2012-07-04 | 大日本スクリーン製造株式会社 | 基板処理装置および基板処理方法 |
TWI458006B (zh) * | 2012-05-02 | 2014-10-21 | Winbond Electronics Corp | 磷酸製程控制氧化物蝕刻率的方法 |
JP6302708B2 (ja) * | 2013-03-29 | 2018-03-28 | 芝浦メカトロニクス株式会社 | ウェットエッチング装置 |
US10147619B2 (en) | 2015-08-27 | 2018-12-04 | Toshiba Memory Corporation | Substrate treatment apparatus, substrate treatment method, and etchant |
JP6645900B2 (ja) | 2016-04-22 | 2020-02-14 | キオクシア株式会社 | 基板処理装置および基板処理方法 |
JP6292694B2 (ja) * | 2017-01-23 | 2018-03-14 | 芝浦メカトロニクス株式会社 | 基板処理方法及び基板処理システム |
KR102757685B1 (ko) * | 2019-02-20 | 2025-01-21 | 상하이 인스티튜트 오브 아이씨 매터리얼스 | 습식 화학에 의한 Si3N4 선택성 제거의 필요성 |
KR102417059B1 (ko) * | 2021-12-22 | 2022-07-06 | 램테크놀러지 주식회사 | 식각액 검증을 위한 배치형 식각 장치 |
-
2002
- 2002-01-29 JP JP2002020577A patent/JP3842657B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
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JP2003224106A (ja) | 2003-08-08 |
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