JP3842657B2 - ウエットエッチングシステム - Google Patents

ウエットエッチングシステム Download PDF

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Publication number
JP3842657B2
JP3842657B2 JP2002020577A JP2002020577A JP3842657B2 JP 3842657 B2 JP3842657 B2 JP 3842657B2 JP 2002020577 A JP2002020577 A JP 2002020577A JP 2002020577 A JP2002020577 A JP 2002020577A JP 3842657 B2 JP3842657 B2 JP 3842657B2
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JP
Japan
Prior art keywords
etching
tank
etching solution
circulation path
air vent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2002020577A
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English (en)
Japanese (ja)
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JP2003224106A (ja
JP2003224106A5 (enrdf_load_stackoverflow
Inventor
博 渡部
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CHEMICAL ART Tech Inc
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CHEMICAL ART Tech Inc
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Priority to JP2002020577A priority Critical patent/JP3842657B2/ja
Publication of JP2003224106A publication Critical patent/JP2003224106A/ja
Publication of JP2003224106A5 publication Critical patent/JP2003224106A5/ja
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Publication of JP3842657B2 publication Critical patent/JP3842657B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Weting (AREA)
JP2002020577A 2002-01-29 2002-01-29 ウエットエッチングシステム Expired - Fee Related JP3842657B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002020577A JP3842657B2 (ja) 2002-01-29 2002-01-29 ウエットエッチングシステム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002020577A JP3842657B2 (ja) 2002-01-29 2002-01-29 ウエットエッチングシステム

Publications (3)

Publication Number Publication Date
JP2003224106A JP2003224106A (ja) 2003-08-08
JP2003224106A5 JP2003224106A5 (enrdf_load_stackoverflow) 2005-08-11
JP3842657B2 true JP3842657B2 (ja) 2006-11-08

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ID=27744038

Family Applications (1)

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JP2002020577A Expired - Fee Related JP3842657B2 (ja) 2002-01-29 2002-01-29 ウエットエッチングシステム

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JP (1) JP3842657B2 (enrdf_load_stackoverflow)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100655429B1 (ko) 2005-11-10 2006-12-08 삼성전자주식회사 인산 용액을 재생하는 방법 및 장치, 그리고 인산 용액을사용하여 기판을 처리하는 장치
JP2008103678A (ja) 2006-09-20 2008-05-01 Dainippon Screen Mfg Co Ltd 基板処理装置
JP4879126B2 (ja) * 2007-09-12 2012-02-22 大日本スクリーン製造株式会社 基板処理装置
TWI452620B (zh) * 2007-08-20 2014-09-11 Chemical Art Technology Inc Etching apparatus and etching apparatus
US8211810B2 (en) 2007-09-21 2012-07-03 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus and substrate processing method for performing etching process with phosphoric acid solution
JP4966223B2 (ja) * 2008-02-29 2012-07-04 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
TWI458006B (zh) * 2012-05-02 2014-10-21 Winbond Electronics Corp 磷酸製程控制氧化物蝕刻率的方法
JP6302708B2 (ja) * 2013-03-29 2018-03-28 芝浦メカトロニクス株式会社 ウェットエッチング装置
US10147619B2 (en) 2015-08-27 2018-12-04 Toshiba Memory Corporation Substrate treatment apparatus, substrate treatment method, and etchant
JP6645900B2 (ja) 2016-04-22 2020-02-14 キオクシア株式会社 基板処理装置および基板処理方法
JP6292694B2 (ja) * 2017-01-23 2018-03-14 芝浦メカトロニクス株式会社 基板処理方法及び基板処理システム
KR102757685B1 (ko) * 2019-02-20 2025-01-21 상하이 인스티튜트 오브 아이씨 매터리얼스 습식 화학에 의한 Si3N4 선택성 제거의 필요성
KR102417059B1 (ko) * 2021-12-22 2022-07-06 램테크놀러지 주식회사 식각액 검증을 위한 배치형 식각 장치

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Publication number Publication date
JP2003224106A (ja) 2003-08-08

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