JP3830860B2 - パワーモジュールとその製造方法 - Google Patents

パワーモジュールとその製造方法 Download PDF

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Publication number
JP3830860B2
JP3830860B2 JP2002153027A JP2002153027A JP3830860B2 JP 3830860 B2 JP3830860 B2 JP 3830860B2 JP 2002153027 A JP2002153027 A JP 2002153027A JP 2002153027 A JP2002153027 A JP 2002153027A JP 3830860 B2 JP3830860 B2 JP 3830860B2
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JP
Japan
Prior art keywords
heat
power module
module according
wiring board
insulating member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2002153027A
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English (en)
Japanese (ja)
Other versions
JP2003051573A5 (https=
JP2003051573A (ja
Inventor
嘉久 山下
浩一 平野
誠一 中谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2002153027A priority Critical patent/JP3830860B2/ja
Publication of JP2003051573A publication Critical patent/JP2003051573A/ja
Publication of JP2003051573A5 publication Critical patent/JP2003051573A5/ja
Application granted granted Critical
Publication of JP3830860B2 publication Critical patent/JP3830860B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2002153027A 2001-05-31 2002-05-27 パワーモジュールとその製造方法 Expired - Fee Related JP3830860B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002153027A JP3830860B2 (ja) 2001-05-31 2002-05-27 パワーモジュールとその製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001165048 2001-05-31
JP2001-165048 2001-05-31
JP2002153027A JP3830860B2 (ja) 2001-05-31 2002-05-27 パワーモジュールとその製造方法

Publications (3)

Publication Number Publication Date
JP2003051573A JP2003051573A (ja) 2003-02-21
JP2003051573A5 JP2003051573A5 (https=) 2006-07-13
JP3830860B2 true JP3830860B2 (ja) 2006-10-11

Family

ID=26616120

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002153027A Expired - Fee Related JP3830860B2 (ja) 2001-05-31 2002-05-27 パワーモジュールとその製造方法

Country Status (1)

Country Link
JP (1) JP3830860B2 (https=)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10335155B4 (de) 2003-07-31 2006-11-30 Infineon Technologies Ag Verfahren zum Herstellen einer Anordnung eines elektrischen Bauelements auf einem Substrat
JP4100332B2 (ja) * 2003-11-12 2008-06-11 株式会社デンソー 電子装置およびその製造方法
JP4086822B2 (ja) 2004-08-19 2008-05-14 富士通株式会社 熱伝導構造体及び熱伝導構造体の製造方法
JP4821537B2 (ja) * 2006-09-26 2011-11-24 株式会社デンソー 電子制御装置
JP2009059760A (ja) * 2007-08-30 2009-03-19 Toshiba Corp 電子回路基板の放熱構造体
JP5125530B2 (ja) * 2008-01-16 2013-01-23 日産自動車株式会社 電力変換装置
JP4930406B2 (ja) * 2008-02-18 2012-05-16 株式会社安川電機 パワー半導体装置及びこれを用いたインバータ装置
JP4943373B2 (ja) * 2008-05-09 2012-05-30 新日本製鐵株式会社 デバイス実装方法
JP5733893B2 (ja) 2009-12-22 2015-06-10 新光電気工業株式会社 電子部品装置
JP2011166024A (ja) 2010-02-12 2011-08-25 Toshiba Corp 電子機器
JP2010245563A (ja) * 2010-07-16 2010-10-28 Panasonic Corp 部品ユニット
DE102015208348B3 (de) 2015-05-06 2016-09-01 Siemens Aktiengesellschaft Leistungsmodul sowie Verfahren zum Herstellen eines Leistungsmoduls
JP2017207711A (ja) * 2016-05-20 2017-11-24 富士ゼロックス株式会社 吸音構造体
JP6528730B2 (ja) * 2016-06-16 2019-06-12 トヨタ自動車株式会社 半導体装置
WO2022220000A1 (ja) * 2021-04-16 2022-10-20 株式会社村田製作所 高周波モジュール及び通信装置
WO2023244781A1 (en) * 2022-06-17 2023-12-21 Murata Manufacturing Co., Ltd. Cooling structure of a power supply module

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Publication number Publication date
JP2003051573A (ja) 2003-02-21

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