JP2003051573A5 - - Google Patents
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- Publication number
- JP2003051573A5 JP2003051573A5 JP2002153027A JP2002153027A JP2003051573A5 JP 2003051573 A5 JP2003051573 A5 JP 2003051573A5 JP 2002153027 A JP2002153027 A JP 2002153027A JP 2002153027 A JP2002153027 A JP 2002153027A JP 2003051573 A5 JP2003051573 A5 JP 2003051573A5
- Authority
- JP
- Japan
- Prior art keywords
- power module
- heat
- mass
- parts
- module according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 description 27
- 229920005989 resin Polymers 0.000 description 26
- 239000011347 resin Substances 0.000 description 26
- 229920001187 thermosetting polymer Polymers 0.000 description 23
- 229920005992 thermoplastic resin Polymers 0.000 description 19
- 238000001723 curing Methods 0.000 description 18
- 239000000758 substrate Substances 0.000 description 18
- 239000003795 chemical substances by application Substances 0.000 description 14
- 239000011256 inorganic filler Substances 0.000 description 12
- 229910003475 inorganic filler Inorganic materials 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 12
- 239000000203 mixture Substances 0.000 description 11
- 239000007788 liquid Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 230000000295 complement effect Effects 0.000 description 3
- 238000010292 electrical insulation Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910003465 moissanite Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002153027A JP3830860B2 (ja) | 2001-05-31 | 2002-05-27 | パワーモジュールとその製造方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001165048 | 2001-05-31 | ||
| JP2001-165048 | 2001-05-31 | ||
| JP2002153027A JP3830860B2 (ja) | 2001-05-31 | 2002-05-27 | パワーモジュールとその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003051573A JP2003051573A (ja) | 2003-02-21 |
| JP2003051573A5 true JP2003051573A5 (https=) | 2006-07-13 |
| JP3830860B2 JP3830860B2 (ja) | 2006-10-11 |
Family
ID=26616120
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002153027A Expired - Fee Related JP3830860B2 (ja) | 2001-05-31 | 2002-05-27 | パワーモジュールとその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3830860B2 (https=) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10335155B4 (de) | 2003-07-31 | 2006-11-30 | Infineon Technologies Ag | Verfahren zum Herstellen einer Anordnung eines elektrischen Bauelements auf einem Substrat |
| JP4100332B2 (ja) * | 2003-11-12 | 2008-06-11 | 株式会社デンソー | 電子装置およびその製造方法 |
| JP4086822B2 (ja) | 2004-08-19 | 2008-05-14 | 富士通株式会社 | 熱伝導構造体及び熱伝導構造体の製造方法 |
| JP4821537B2 (ja) * | 2006-09-26 | 2011-11-24 | 株式会社デンソー | 電子制御装置 |
| JP2009059760A (ja) * | 2007-08-30 | 2009-03-19 | Toshiba Corp | 電子回路基板の放熱構造体 |
| JP5125530B2 (ja) * | 2008-01-16 | 2013-01-23 | 日産自動車株式会社 | 電力変換装置 |
| JP4930406B2 (ja) * | 2008-02-18 | 2012-05-16 | 株式会社安川電機 | パワー半導体装置及びこれを用いたインバータ装置 |
| JP4943373B2 (ja) * | 2008-05-09 | 2012-05-30 | 新日本製鐵株式会社 | デバイス実装方法 |
| JP5733893B2 (ja) | 2009-12-22 | 2015-06-10 | 新光電気工業株式会社 | 電子部品装置 |
| JP2011166024A (ja) | 2010-02-12 | 2011-08-25 | Toshiba Corp | 電子機器 |
| JP2010245563A (ja) * | 2010-07-16 | 2010-10-28 | Panasonic Corp | 部品ユニット |
| DE102015208348B3 (de) | 2015-05-06 | 2016-09-01 | Siemens Aktiengesellschaft | Leistungsmodul sowie Verfahren zum Herstellen eines Leistungsmoduls |
| JP2017207711A (ja) * | 2016-05-20 | 2017-11-24 | 富士ゼロックス株式会社 | 吸音構造体 |
| JP6528730B2 (ja) * | 2016-06-16 | 2019-06-12 | トヨタ自動車株式会社 | 半導体装置 |
| WO2022220000A1 (ja) * | 2021-04-16 | 2022-10-20 | 株式会社村田製作所 | 高周波モジュール及び通信装置 |
| WO2023244781A1 (en) * | 2022-06-17 | 2023-12-21 | Murata Manufacturing Co., Ltd. | Cooling structure of a power supply module |
-
2002
- 2002-05-27 JP JP2002153027A patent/JP3830860B2/ja not_active Expired - Fee Related
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