JP3812800B2 - 封止材料、はんだ付け用フラックス、はんだぺ一スト、電子部品装置、電子回路モジュール及び電子回路装置 - Google Patents

封止材料、はんだ付け用フラックス、はんだぺ一スト、電子部品装置、電子回路モジュール及び電子回路装置 Download PDF

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Publication number
JP3812800B2
JP3812800B2 JP2000094738A JP2000094738A JP3812800B2 JP 3812800 B2 JP3812800 B2 JP 3812800B2 JP 2000094738 A JP2000094738 A JP 2000094738A JP 2000094738 A JP2000094738 A JP 2000094738A JP 3812800 B2 JP3812800 B2 JP 3812800B2
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Japan
Prior art keywords
flux
electronic circuit
solder
circuit module
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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JP2000094738A
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English (en)
Japanese (ja)
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JP2001279118A (ja
JP2001279118A5 (https=
Inventor
稔 高谷
寿之 阿部
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TDK Corp
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TDK Corp
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Priority to JP2000094738A priority Critical patent/JP3812800B2/ja
Publication of JP2001279118A publication Critical patent/JP2001279118A/ja
Publication of JP2001279118A5 publication Critical patent/JP2001279118A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills

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  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2000094738A 2000-03-30 2000-03-30 封止材料、はんだ付け用フラックス、はんだぺ一スト、電子部品装置、電子回路モジュール及び電子回路装置 Expired - Lifetime JP3812800B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000094738A JP3812800B2 (ja) 2000-03-30 2000-03-30 封止材料、はんだ付け用フラックス、はんだぺ一スト、電子部品装置、電子回路モジュール及び電子回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000094738A JP3812800B2 (ja) 2000-03-30 2000-03-30 封止材料、はんだ付け用フラックス、はんだぺ一スト、電子部品装置、電子回路モジュール及び電子回路装置

Related Child Applications (1)

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JP2006043184A Division JP2006152312A (ja) 2006-02-20 2006-02-20 封止材料、はんだ付け用フラックス、はんだぺースト、電子部品装置、電子回路モジュール及び電子回路装置

Publications (3)

Publication Number Publication Date
JP2001279118A JP2001279118A (ja) 2001-10-10
JP2001279118A5 JP2001279118A5 (https=) 2005-12-15
JP3812800B2 true JP3812800B2 (ja) 2006-08-23

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Family Applications (1)

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JP2000094738A Expired - Lifetime JP3812800B2 (ja) 2000-03-30 2000-03-30 封止材料、はんだ付け用フラックス、はんだぺ一スト、電子部品装置、電子回路モジュール及び電子回路装置

Country Status (1)

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JP (1) JP3812800B2 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2007116979A1 (ja) * 2006-04-12 2009-08-20 日立化成工業株式会社 封止充填剤用樹脂組成物、それを用いたフリップチップ実装法及びフリップチップ実装品
CN106132086A (zh) * 2016-07-08 2016-11-16 广东小天才科技有限公司 一种电路板结构及电子元件焊接方法

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Publication number Publication date
JP2001279118A (ja) 2001-10-10

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