JP3807748B2 - 耐熱性帯電防止感圧接着テープ - Google Patents

耐熱性帯電防止感圧接着テープ Download PDF

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Publication number
JP3807748B2
JP3807748B2 JP51260798A JP51260798A JP3807748B2 JP 3807748 B2 JP3807748 B2 JP 3807748B2 JP 51260798 A JP51260798 A JP 51260798A JP 51260798 A JP51260798 A JP 51260798A JP 3807748 B2 JP3807748 B2 JP 3807748B2
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JP
Japan
Prior art keywords
acrylate
vinyl
group
tape
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP51260798A
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English (en)
Japanese (ja)
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JP2001500904A (ja
JP2001500904A5 (https=
Inventor
ヤウ，スティーブン・ディ
ガトマン，ガスタブ
Original Assignee
ミネソタ・マイニング・アンド・マニュファクチャリング・カンパニー
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Publication of JP2001500904A publication Critical patent/JP2001500904A/ja
Publication of JP2001500904A5 publication Critical patent/JP2001500904A5/ja
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Anticipated expiration legal-status Critical
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/18—Polybenzimidazoles
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/125—Inorganic compounds, e.g. silver salt
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/254—Polymeric or resinous material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2843—Web or sheet containing structurally defined element or component and having an adhesive outermost layer including a primer layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2857—Adhesive compositions including metal or compound thereof or natural rubber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated
    • Y10T428/2998—Coated including synthetic resin or polymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31855—Of addition polymer from unsaturated monomers
    • Y10T428/31859—Next to an aldehyde or ketone condensation product
    • Y10T428/31877—Phenol-aldehyde
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31855—Of addition polymer from unsaturated monomers
    • Y10T428/31909—Next to second addition polymer from unsaturated monomers
    • Y10T428/31928—Ester, halide or nitrile of addition polymer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP51260798A 1996-09-06 1997-01-17 耐熱性帯電防止感圧接着テープ Expired - Fee Related JP3807748B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/709,067 1996-09-06
US08/709,067 US5914186A (en) 1994-05-06 1996-09-06 High temperature resistant antistatic pressure-sensitive adhesive tape
PCT/US1997/000708 WO1998010029A1 (en) 1996-09-06 1997-01-17 High temperature resistant antistatic pressure-sensitive adhesive tape

Publications (3)

Publication Number Publication Date
JP2001500904A JP2001500904A (ja) 2001-01-23
JP2001500904A5 JP2001500904A5 (https=) 2004-11-18
JP3807748B2 true JP3807748B2 (ja) 2006-08-09

Family

ID=24848357

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51260798A Expired - Fee Related JP3807748B2 (ja) 1996-09-06 1997-01-17 耐熱性帯電防止感圧接着テープ

Country Status (4)

Country Link
US (1) US5914186A (https=)
EP (1) EP0923627A1 (https=)
JP (1) JP3807748B2 (https=)
WO (1) WO1998010029A1 (https=)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6501170B1 (en) 2000-06-09 2002-12-31 Micron Technology, Inc. Substrates and assemblies including pre-applied adhesion promoter
JP3723546B2 (ja) * 2000-12-01 2005-12-07 スリーエム イノベイティブ プロパティズ カンパニー 架橋型感圧接着剤組成物、および高温での用途に有用な架橋型感圧接着剤組成物ベースの接着製品
US8775196B2 (en) 2002-01-29 2014-07-08 Baxter International Inc. System and method for notification and escalation of medical data
KR20050090073A (ko) * 2003-01-07 2005-09-12 애버리 데니슨 코포레이션 고온 내성 필름 및 그로 제조된 접착제 물품
JP4562070B2 (ja) * 2004-05-14 2010-10-13 日東電工株式会社 粘着剤組成物、粘着シート類、および表面保護フィルム
US20080166523A1 (en) * 2007-01-04 2008-07-10 Asahi Kasei Chemicals Corporation Tab leader tape made of polyphenylene ether-based resin
TW200946632A (en) * 2008-05-14 2009-11-16 Daxon Technology Inc Pressure sensitive adhesive and method of preparing the same
JP5455362B2 (ja) * 2008-12-25 2014-03-26 チェイル インダストリーズ インコーポレイテッド 粘着剤組成物およびこれを用いた光学部材
JP5623020B2 (ja) 2009-02-27 2014-11-12 日東電工株式会社 粘着剤組成物、粘着剤層、及び、粘着シート
CN105407998B (zh) * 2012-12-28 2018-02-02 3M创新有限公司 包含电荷加强添加剂的驻极体料片
BR112015026517A2 (pt) 2013-04-19 2017-07-25 3M Innovative Properties Co mantas de eletreto com aditivos acentuadores de carga
WO2015199972A1 (en) 2014-06-23 2015-12-30 3M Innovative Properties Company Electret webs with charge-enhancing additives
MX2018000117A (es) 2015-07-07 2018-03-22 3M Innovative Properties Co Tramas de electreto con aditivos mejoradores de la carga.
WO2017007672A1 (en) 2015-07-07 2017-01-12 3M Innovative Properties Company Substituted benzotriazole phenols
EP3320038A1 (en) 2015-07-07 2018-05-16 3M Innovative Properties Company Polymeric matrices with ionic additives
WO2017007677A1 (en) 2015-07-07 2017-01-12 3M Innovative Properties Company Substituted benzotriazole phenolate salts and antioxidant compositions formed therefrom
EP3565653B1 (en) 2017-01-05 2020-10-28 3M Innovative Properties Company Electret webs with charge-enhancing additives
EP4045167A1 (en) 2019-10-16 2022-08-24 3M Innovative Properties Company Dual-function melt additives
US12467174B2 (en) 2019-10-16 2025-11-11 3M Innovative Properties Company Substituted benzimidazole melt additives
WO2021111246A1 (en) 2019-12-03 2021-06-10 3M Innovative Properties Company Thiolate salt melt additives
WO2021111290A1 (en) 2019-12-03 2021-06-10 3M Innovative Properties Company Aromatic-heterocyclic ring melt additives
US11982031B2 (en) 2020-01-27 2024-05-14 3M Innovative Properties Company Substituted thiol melt additives
EP4097284B1 (en) 2020-01-27 2024-05-29 3M Innovative Properties Company Substituted thiolate salt melt additives

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US3104985A (en) * 1959-01-06 1963-09-24 Cabot Corp Conducting polymer compositions
US3691140A (en) * 1970-03-09 1972-09-12 Spencer Ferguson Silver Acrylate copolymer microspheres
US3832598A (en) * 1972-10-02 1974-08-27 Minnesota Mining & Mfg Electrically conductive tape device
US4166152B1 (en) * 1977-08-17 1999-05-18 Minnesota Mining & Mfg Tacky polymeric microspheres
JPS55131075A (en) * 1979-03-31 1980-10-11 Nitto Electric Ind Co Ltd Adhesive tape
DE3126402A1 (de) * 1981-07-04 1983-01-13 Bayer Ag, 5090 Leverkusen Verwendung von zinksalzen des mercaptobenzimidazols und dithiophosphorsaeureesters bei der herstellung von nitrilkautschuk-polyvinylchlorid-abmischungen
DE3442695A1 (de) * 1984-11-23 1986-06-05 Beiersdorf Ag, 2000 Hamburg Klebeband
GB2170427B (en) * 1985-02-01 1989-06-07 Sanyo Kokusaku Pulp Co Pressure-sensitive adhesive tapes or sheets
US4656218A (en) * 1985-02-08 1987-04-07 Sanyo Kokusaku Pulp Co., Ltd. Adhesive copolymer microspheres-containing aqueous suspension and method for producing the same
JPS6312681A (ja) * 1986-07-02 1988-01-20 Sekisui Chem Co Ltd 帯電防止粘着テ−プもしくはシ−ト
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IE67319B1 (en) * 1989-10-11 1996-03-20 Waterford Res & Dev Ltd Antistatic adhesive tape
US5196462A (en) * 1991-05-16 1993-03-23 Himont Incorporated Zinc-salts of certain mercapto compounds as antioxidants for high temperature aging of thermoplastic elastomers
US5378405A (en) * 1993-07-28 1995-01-03 Minnesota Mining And Manufacturing Company Conductive microparticles and pressure-sensitive adhesive tapes made therefrom
DE69507609T2 (de) * 1994-05-06 1999-09-30 Minnesota Mining And Mfg. Co., Saint Paul Hochtemperaturbeständiges, antistatisches, druckempfindliches klebebeand
JP3478647B2 (ja) * 1994-12-09 2003-12-15 キヤノン株式会社 感圧転写性保護被覆材料及びこれを用いた画像の保護被覆方法

Also Published As

Publication number Publication date
US5914186A (en) 1999-06-22
WO1998010029A1 (en) 1998-03-12
JP2001500904A (ja) 2001-01-23
EP0923627A1 (en) 1999-06-23

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