JP3806644B2 - 電力用半導体装置 - Google Patents

電力用半導体装置 Download PDF

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Publication number
JP3806644B2
JP3806644B2 JP2001380074A JP2001380074A JP3806644B2 JP 3806644 B2 JP3806644 B2 JP 3806644B2 JP 2001380074 A JP2001380074 A JP 2001380074A JP 2001380074 A JP2001380074 A JP 2001380074A JP 3806644 B2 JP3806644 B2 JP 3806644B2
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JP
Japan
Prior art keywords
circuit
power
semiconductor device
level shift
power semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2001380074A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003189632A5 (enExample
JP2003189632A (ja
Inventor
浩介 吉村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2001380074A priority Critical patent/JP3806644B2/ja
Priority to US10/163,577 priority patent/US6593781B2/en
Publication of JP2003189632A publication Critical patent/JP2003189632A/ja
Publication of JP2003189632A5 publication Critical patent/JP2003189632A5/ja
Application granted granted Critical
Publication of JP3806644B2 publication Critical patent/JP3806644B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02P—CONTROL OR REGULATION OF ELECTRIC MOTORS, ELECTRIC GENERATORS OR DYNAMO-ELECTRIC CONVERTERS; CONTROLLING TRANSFORMERS, REACTORS OR CHOKE COILS
    • H02P27/00—Arrangements or methods for the control of AC motors characterised by the kind of supply voltage
    • H02P27/04—Arrangements or methods for the control of AC motors characterised by the kind of supply voltage using variable-frequency supply voltage, e.g. inverter or converter supply voltage
    • H02P27/06—Arrangements or methods for the control of AC motors characterised by the kind of supply voltage using variable-frequency supply voltage, e.g. inverter or converter supply voltage using DC to AC converters or inverters
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/42—Conversion of DC power input into AC power output without possibility of reversal
    • H02M7/44—Conversion of DC power input into AC power output without possibility of reversal by static converters
    • H02M7/48—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M7/53—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
    • H02M7/537—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters
    • H02M7/538—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters in a push-pull configuration
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/06—Modifications for ensuring a fully conducting state
    • H03K17/063—Modifications for ensuring a fully conducting state in field-effect transistor switches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Inverter Devices (AREA)
  • Power Conversion In General (AREA)
JP2001380074A 2001-12-13 2001-12-13 電力用半導体装置 Expired - Lifetime JP3806644B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2001380074A JP3806644B2 (ja) 2001-12-13 2001-12-13 電力用半導体装置
US10/163,577 US6593781B2 (en) 2001-12-13 2002-06-07 Power semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001380074A JP3806644B2 (ja) 2001-12-13 2001-12-13 電力用半導体装置

Publications (3)

Publication Number Publication Date
JP2003189632A JP2003189632A (ja) 2003-07-04
JP2003189632A5 JP2003189632A5 (enExample) 2005-03-17
JP3806644B2 true JP3806644B2 (ja) 2006-08-09

Family

ID=19187074

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001380074A Expired - Lifetime JP3806644B2 (ja) 2001-12-13 2001-12-13 電力用半導体装置

Country Status (2)

Country Link
US (1) US6593781B2 (enExample)
JP (1) JP3806644B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101477377B1 (ko) * 2013-03-20 2014-12-29 삼성전기주식회사 게이트 구동 장치 및 이를 갖는 인버터

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040227476A1 (en) * 2002-12-19 2004-11-18 International Rectifier Corp. Flexible inverter power module for motor drives
US6737894B1 (en) * 2003-05-01 2004-05-18 International Business Machines Corporation Method and apparatus for generating impedance matched output signals for an integrated circuit device
JP4647266B2 (ja) * 2004-09-08 2011-03-09 富士電機システムズ株式会社 インバータ装置、集積回路チップ及び車両駆動装置
DE102004049817A1 (de) * 2004-10-13 2006-04-27 Semikron Elektronik Gmbh & Co. Kg Integrierte Schaltungsanordnung zur Ansteuerung von Leistungshalbleiterschaltern
JP4682007B2 (ja) * 2004-11-10 2011-05-11 三菱電機株式会社 電力用半導体装置
DE102005023652B3 (de) * 2005-05-23 2006-08-03 Semikron Elektronik Gmbh & Co. Kg Schaltungsanordnung mit Fehlererkennung zur Ansteuerung von Leistungshalbleiterschaltern und zugehöriges Verfahren
JP4481879B2 (ja) 2005-06-03 2010-06-16 パナソニック株式会社 スイッチング電源装置
JP2008017595A (ja) * 2006-07-05 2008-01-24 Matsushita Electric Ind Co Ltd 車両用インバータ装置
US7595669B2 (en) * 2007-07-26 2009-09-29 The Von Corporation Method and apparatus for producing clean, undistorted variable voltage 50-60 Hz sine wave
JP5342153B2 (ja) * 2008-02-20 2013-11-13 矢崎総業株式会社 モータ負荷制御装置
UA97211C2 (ru) * 2008-08-27 2012-01-10 Машиненфабрик Райнхаузен Гмбх Ступенчатый переключатель с полупроводниковыми переключающими элементами
JP4941686B2 (ja) * 2010-03-10 2012-05-30 株式会社デンソー 電力変換装置
TWI454036B (zh) * 2012-01-09 2014-09-21 Richtek Technology Corp 應用在ｐｆｃ電源轉換器的橋式整流器
CN102623950B (zh) * 2012-03-21 2014-04-30 美的集团股份有限公司 用于高压集成电路的保护电路
GB2500937B (en) * 2012-04-05 2015-04-08 Control Tech Ltd Fail-safe interface
WO2013183168A1 (ja) * 2012-06-08 2013-12-12 三菱電機株式会社 電力変換装置内蔵モータ、このモータを内蔵した空気調和機、給湯器、および換気送風機器
US8947129B2 (en) * 2013-02-28 2015-02-03 Jeng-Jye Shau High voltage switching circuits
DE102013112262A1 (de) * 2013-11-07 2015-05-07 Semikron Elektronik Gmbh & Co. Kg Ansteuerschaltung für Drei-Level-Inverter
DE102013112264A1 (de) * 2013-11-07 2015-05-07 Semikron Elektronik Gmbh & Co. Kg Ansteuersystem zur Ansteuerung von Brückenschaltungen mit symmetrisch geerdetem Zwischenkreis
JP5939235B2 (ja) 2013-11-26 2016-06-22 株式会社デンソー 回転電機駆動装置、および、これを用いた電動パワーステアリング装置
JP6261309B2 (ja) 2013-12-02 2018-01-17 三菱電機株式会社 パワーモジュール
US9454171B2 (en) * 2015-01-07 2016-09-27 Delphi Technologies, Inc. Validation circuit for reference voltage shifted data

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6522178B2 (en) * 1999-04-22 2003-02-18 International Rectifier Corporation Controlling high side devices without using level shift switches

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101477377B1 (ko) * 2013-03-20 2014-12-29 삼성전기주식회사 게이트 구동 장치 및 이를 갖는 인버터
US9130452B2 (en) 2013-03-20 2015-09-08 Samsung Electro-Mechanics Co., Ltd. Gate driving device including plurality of gate drivers supplied with equally divided voltage and inverter having the same

Also Published As

Publication number Publication date
US20030112040A1 (en) 2003-06-19
US6593781B2 (en) 2003-07-15
JP2003189632A (ja) 2003-07-04

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