JP3789097B2 - 被検査物の外周検査方法および外周検査装置 - Google Patents

被検査物の外周検査方法および外周検査装置 Download PDF

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Publication number
JP3789097B2
JP3789097B2 JP2002044187A JP2002044187A JP3789097B2 JP 3789097 B2 JP3789097 B2 JP 3789097B2 JP 2002044187 A JP2002044187 A JP 2002044187A JP 2002044187 A JP2002044187 A JP 2002044187A JP 3789097 B2 JP3789097 B2 JP 3789097B2
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Prior art keywords
light
inspection object
half mirror
inspection
outer peripheral
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Expired - Fee Related
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Japanese (ja)
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JP2003240728A (ja
JP2003240728A5 (enrdf_load_stackoverflow
Inventor
仁司 森川
晴彦 寺内
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JTEKT Machine Systems Corp
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Koyo Machine Industries Co Ltd
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Publication of JP2003240728A5 publication Critical patent/JP2003240728A5/ja
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JP2002044187A 2002-02-21 2002-02-21 被検査物の外周検査方法および外周検査装置 Expired - Fee Related JP3789097B2 (ja)

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JP2002044187A JP3789097B2 (ja) 2002-02-21 2002-02-21 被検査物の外周検査方法および外周検査装置

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JP2002044187A JP3789097B2 (ja) 2002-02-21 2002-02-21 被検査物の外周検査方法および外周検査装置

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JP2003240728A JP2003240728A (ja) 2003-08-27
JP2003240728A5 JP2003240728A5 (enrdf_load_stackoverflow) 2004-12-09
JP3789097B2 true JP3789097B2 (ja) 2006-06-21

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Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG157977A1 (en) * 2008-06-23 2010-01-29 Semiconductor Tech & Instr Inc System and method for inspection of semiconductor packages
JP6489540B2 (ja) * 2014-02-27 2019-03-27 株式会社NejiLaw 撮像システム、照明手段
US9759670B2 (en) * 2014-12-23 2017-09-12 Mitutoyo Corporation Bore imaging system
JP2017009542A (ja) * 2015-06-25 2017-01-12 株式会社NejiLaw 撮像システム
JP6834174B2 (ja) * 2016-05-13 2021-02-24 株式会社ジェイテクト 外観検査方法および外観検査装置
JP2019117139A (ja) * 2017-12-27 2019-07-18 株式会社ケージェーケー ベアリングの検査方法と検査装置
CN114061481A (zh) * 2020-08-04 2022-02-18 广东博智林机器人有限公司 一种光源组件及检测装置

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