JP3776252B2 - 半導体装置の製造に用いる化学機械研磨用水系分散体 - Google Patents

半導体装置の製造に用いる化学機械研磨用水系分散体 Download PDF

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JP3776252B2
JP3776252B2 JP07456299A JP7456299A JP3776252B2 JP 3776252 B2 JP3776252 B2 JP 3776252B2 JP 07456299 A JP07456299 A JP 07456299A JP 7456299 A JP7456299 A JP 7456299A JP 3776252 B2 JP3776252 B2 JP 3776252B2
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JP
Japan
Prior art keywords
particles
aqueous dispersion
polymer particles
cmp
zeta potential
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Expired - Lifetime
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JP07456299A
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English (en)
Japanese (ja)
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JP2000269170A (ja
JP2000269170A5 (zh
Inventor
博之 矢野
学 南幅
之輝 松井
勝弥 奥村
章 飯尾
雅幸 服部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
JSR Corp
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Toshiba Corp
JSR Corp
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Priority to JP07456299A priority Critical patent/JP3776252B2/ja
Application filed by Toshiba Corp, JSR Corp filed Critical Toshiba Corp
Priority to EP00105650A priority patent/EP1036836B1/en
Priority to US09/531,163 priority patent/US6740590B1/en
Priority to DE60015411T priority patent/DE60015411T2/de
Priority to TW089105020A priority patent/TWI267549B/zh
Priority to KR10-2000-0013562A priority patent/KR100447552B1/ko
Publication of JP2000269170A publication Critical patent/JP2000269170A/ja
Publication of JP2000269170A5 publication Critical patent/JP2000269170A5/ja
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Publication of JP3776252B2 publication Critical patent/JP3776252B2/ja
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  • Mechanical Treatment Of Semiconductor (AREA)
JP07456299A 1999-03-18 1999-03-18 半導体装置の製造に用いる化学機械研磨用水系分散体 Expired - Lifetime JP3776252B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP07456299A JP3776252B2 (ja) 1999-03-18 1999-03-18 半導体装置の製造に用いる化学機械研磨用水系分散体
US09/531,163 US6740590B1 (en) 1999-03-18 2000-03-17 Aqueous dispersion, aqueous dispersion for chemical mechanical polishing used for manufacture of semiconductor devices, method for manufacture of semiconductor devices, and method for formation of embedded writing
DE60015411T DE60015411T2 (de) 1999-03-18 2000-03-17 Wässerige Dispersionsaufschlämmung für chemisch-mechanisches Polierverfahren
TW089105020A TWI267549B (en) 1999-03-18 2000-03-17 Aqueous dispersion, aqueous dispersion for chemical mechanical polishing used for manufacture of semiconductor devices, method for manufacture of semiconductor devices, and method for formation of embedded wiring
EP00105650A EP1036836B1 (en) 1999-03-18 2000-03-17 Aqueous dispersion for chemical mechanical polishing
KR10-2000-0013562A KR100447552B1 (ko) 1999-03-18 2000-03-17 수계 분산체 및 반도체 장치의 제조에 사용하는 화학 기계연마용 수계 분산체 및 반도체 장치의 제조 방법 및 매립배선의 형성 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP07456299A JP3776252B2 (ja) 1999-03-18 1999-03-18 半導体装置の製造に用いる化学機械研磨用水系分散体

Publications (3)

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JP2000269170A JP2000269170A (ja) 2000-09-29
JP2000269170A5 JP2000269170A5 (zh) 2004-12-24
JP3776252B2 true JP3776252B2 (ja) 2006-05-17

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JP07456299A Expired - Lifetime JP3776252B2 (ja) 1999-03-18 1999-03-18 半導体装置の製造に用いる化学機械研磨用水系分散体

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2052048A1 (en) * 2006-07-12 2009-04-29 Cabot Microelectronics Corporation Cmp method for metal-containing substrates

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI296006B (zh) * 2000-02-09 2008-04-21 Jsr Corp
US6821897B2 (en) * 2001-12-05 2004-11-23 Cabot Microelectronics Corporation Method for copper CMP using polymeric complexing agents
JP4688397B2 (ja) * 2002-03-27 2011-05-25 泰弘 谷 キャリア粒子の取扱い方法および研磨剤
JP2004193495A (ja) 2002-12-13 2004-07-08 Toshiba Corp 化学的機械的研磨用スラリーおよびこれを用いた半導体装置の製造方法
JP2007273910A (ja) * 2006-03-31 2007-10-18 Fujifilm Corp 研磨用組成液
JP4784614B2 (ja) * 2008-02-25 2011-10-05 Ｊｓｒ株式会社 化学機械研磨用水系分散体
WO2018179064A1 (ja) * 2017-03-27 2018-10-04 日立化成株式会社 スラリ及び研磨方法
JP7502736B2 (ja) * 2021-02-26 2024-06-19 熊本県 複合粒子およびその製造方法、研磨材および研磨液

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2052048A1 (en) * 2006-07-12 2009-04-29 Cabot Microelectronics Corporation Cmp method for metal-containing substrates
EP2052048A4 (en) * 2006-07-12 2012-01-18 Cabot Microelectronics Corp CMP METHOD FOR METAL CONTAINING SUBSTRATES

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Publication number Publication date
JP2000269170A (ja) 2000-09-29

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