JP3753011B2 - 反射型発光ダイオード - Google Patents

反射型発光ダイオード Download PDF

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Publication number
JP3753011B2
JP3753011B2 JP2001112456A JP2001112456A JP3753011B2 JP 3753011 B2 JP3753011 B2 JP 3753011B2 JP 2001112456 A JP2001112456 A JP 2001112456A JP 2001112456 A JP2001112456 A JP 2001112456A JP 3753011 B2 JP3753011 B2 JP 3753011B2
Authority
JP
Japan
Prior art keywords
light
light emitting
reflecting mirror
light source
emitting element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2001112456A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002314137A (ja
Inventor
好伸 末広
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyoda Gosei Co Ltd
Original Assignee
Toyoda Gosei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyoda Gosei Co Ltd filed Critical Toyoda Gosei Co Ltd
Priority to JP2001112456A priority Critical patent/JP3753011B2/ja
Priority to US10/118,141 priority patent/US6641287B2/en
Priority to EP02008311A priority patent/EP1249877B1/fr
Priority to DE60234661T priority patent/DE60234661D1/de
Publication of JP2002314137A publication Critical patent/JP2002314137A/ja
Application granted granted Critical
Publication of JP3753011B2 publication Critical patent/JP3753011B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0004—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
    • G02B19/0019—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed having reflective surfaces only (e.g. louvre systems, systems with multiple planar reflectors)
    • G02B19/0023—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed having reflective surfaces only (e.g. louvre systems, systems with multiple planar reflectors) at least one surface having optical power
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0004—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
    • G02B19/0028—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed refractive and reflective surfaces, e.g. non-imaging catadioptric systems
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
    • G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
    • G02B19/0061—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
JP2001112456A 2001-04-11 2001-04-11 反射型発光ダイオード Expired - Lifetime JP3753011B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2001112456A JP3753011B2 (ja) 2001-04-11 2001-04-11 反射型発光ダイオード
US10/118,141 US6641287B2 (en) 2001-04-11 2002-04-09 Reflective type light-emitting diode
EP02008311A EP1249877B1 (fr) 2001-04-11 2002-04-11 Diode émettrice de lumière du type réflectif
DE60234661T DE60234661D1 (de) 2001-04-11 2002-04-11 Reflektive lichtemittierende Diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001112456A JP3753011B2 (ja) 2001-04-11 2001-04-11 反射型発光ダイオード

Publications (2)

Publication Number Publication Date
JP2002314137A JP2002314137A (ja) 2002-10-25
JP3753011B2 true JP3753011B2 (ja) 2006-03-08

Family

ID=18963867

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001112456A Expired - Lifetime JP3753011B2 (ja) 2001-04-11 2001-04-11 反射型発光ダイオード

Country Status (4)

Country Link
US (1) US6641287B2 (fr)
EP (1) EP1249877B1 (fr)
JP (1) JP3753011B2 (fr)
DE (1) DE60234661D1 (fr)

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US20040155565A1 (en) * 2003-02-06 2004-08-12 Holder Ronald G. Method and apparatus for the efficient collection and distribution of light for illumination
US7329029B2 (en) 2003-05-13 2008-02-12 Light Prescriptions Innovators, Llc Optical device for LED-based lamp
US8075147B2 (en) 2003-05-13 2011-12-13 Light Prescriptions Innovators, Llc Optical device for LED-based lamp
EP1664851B1 (fr) 2003-07-28 2014-11-12 Light Prescriptions Innovators, LLC. Procede de generation simultanee de surfaces tridimensionnelles multiples et optiques d'eclairage de forme libre connues a partir dudit procede
US7083304B2 (en) * 2003-08-01 2006-08-01 Illumination Management Solutions, Inc. Apparatus and method of using light sources of differing wavelengths in an unitized beam
US7246917B2 (en) * 2003-08-12 2007-07-24 Illumination Management Solutions, Inc. Apparatus and method for using emitting diodes (LED) in a side-emitting device
US7449724B2 (en) * 2003-09-12 2008-11-11 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device
US7502392B2 (en) * 2003-09-12 2009-03-10 Semiconductor Energy Laboratory Co., Ltd. Laser oscillator
US20050077534A1 (en) * 2003-10-09 2005-04-14 Yang Bing Lin Light-emitting diode and method of manufacturing the light-emitting diode
JP3976063B2 (ja) 2003-10-31 2007-09-12 豊田合成株式会社 発光装置
WO2005050262A2 (fr) * 2003-11-14 2005-06-02 Light Prescriptions Innovators, Llc Combineur de faisceau dichroique utilisant une del bleue a phosphore vert
JP4581407B2 (ja) * 2004-01-16 2010-11-17 株式会社日立製作所 光源ユニットおよびそれを用いた投射型映像表示装置
FR2866412B1 (fr) * 2004-02-13 2007-01-19 Valeo Vision Module de projecteur lumineux pour vehicule automobile, reflecteur pour un tel module, et projecteur equipe de de module
EP1753996B1 (fr) * 2004-03-30 2011-06-29 Illumination Management Solutions, Inc. Appareil et procede d'eclairage ameliore d'une zone
US7230280B2 (en) * 2004-05-27 2007-06-12 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Collimating light from an LED device
US20060013004A1 (en) 2004-07-16 2006-01-19 Charles Coushaine LED sideward emitting lamp
US20060039129A1 (en) * 2004-08-20 2006-02-23 World Properties, Inc. Backlight using reversely mounted LEDs
KR100665005B1 (ko) * 2004-12-30 2007-01-09 삼성전기주식회사 발광다이오드를 이용한 백라이트 장치
CN1851940A (zh) * 2005-04-22 2006-10-25 鸿富锦精密工业（深圳）有限公司 发光二极管
DE102005033005A1 (de) * 2005-07-14 2007-01-18 Osram Opto Semiconductors Gmbh Optoelektronischer Chip
WO2007016363A2 (fr) 2005-07-28 2007-02-08 Light Prescriptions Innovators, Llc Éléments optiques lenticulaires à forme libre et leur application à des condensateurs et projecteurs
KR20080036213A (ko) 2005-07-28 2008-04-25 라이트 프리스크립션즈 이노베이터즈, 엘엘씨 에턴듀가 보존되는 백라이트 및 프론트라이트용 조명광학계
US7657147B2 (en) * 2006-03-02 2010-02-02 Solar Light Company, Inc. Sunlight simulator apparatus
US7703945B2 (en) * 2006-06-27 2010-04-27 Cree, Inc. Efficient emitting LED package and method for efficiently emitting light
WO2008008994A2 (fr) 2006-07-14 2008-01-17 Light Prescriptions Innovators, Llc Film améliorant la luminosité
WO2008022065A2 (fr) 2006-08-11 2008-02-21 Light Prescriptions Innovators, Llc Amélioration de luminance de led et mélange de couleurs par combinaison de faisceau multiplexée de manière rotative
JP5186875B2 (ja) * 2007-10-12 2013-04-24 日亜化学工業株式会社 照明ユニット
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CN101603662A (zh) * 2008-06-13 2009-12-16 富准精密工业(深圳)有限公司 发光二极管灯具及其灯罩
US8256931B2 (en) * 2008-07-24 2012-09-04 Seward George H Achromatic homogenizer and collimator for LEDs
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WO2012024591A1 (fr) 2010-08-20 2012-02-23 Research Triangle Institute, International Composites photoluminescents à base de nanofibres, procédés de fabrication et appareils d'éclairage associés
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Also Published As

Publication number Publication date
EP1249877B1 (fr) 2009-12-09
US6641287B2 (en) 2003-11-04
EP1249877A2 (fr) 2002-10-16
DE60234661D1 (de) 2010-01-21
JP2002314137A (ja) 2002-10-25
US20020149942A1 (en) 2002-10-17
EP1249877A3 (fr) 2004-06-02

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