JP3727622B2 - ワイヤボンディング装置用放電電極 - Google Patents

ワイヤボンディング装置用放電電極 Download PDF

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Publication number
JP3727622B2
JP3727622B2 JP2002282935A JP2002282935A JP3727622B2 JP 3727622 B2 JP3727622 B2 JP 3727622B2 JP 2002282935 A JP2002282935 A JP 2002282935A JP 2002282935 A JP2002282935 A JP 2002282935A JP 3727622 B2 JP3727622 B2 JP 3727622B2
Authority
JP
Japan
Prior art keywords
discharge
discharge electrode
wire bonding
electrode
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2002282935A
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English (en)
Japanese (ja)
Other versions
JP2004119799A5 (https=
JP2004119799A (ja
Inventor
前田　　徹
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP2002282935A priority Critical patent/JP3727622B2/ja
Priority to TW092121464A priority patent/TWI267928B/zh
Priority to KR1020030058816A priority patent/KR100559943B1/ko
Priority to US10/671,089 priority patent/US6818861B2/en
Publication of JP2004119799A publication Critical patent/JP2004119799A/ja
Publication of JP2004119799A5 publication Critical patent/JP2004119799A5/ja
Application granted granted Critical
Publication of JP3727622B2 publication Critical patent/JP3727622B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
JP2002282935A 2002-09-27 2002-09-27 ワイヤボンディング装置用放電電極 Expired - Fee Related JP3727622B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2002282935A JP3727622B2 (ja) 2002-09-27 2002-09-27 ワイヤボンディング装置用放電電極
TW092121464A TWI267928B (en) 2002-09-27 2003-08-06 Discharge electrode for wire bonding apparatus
KR1020030058816A KR100559943B1 (ko) 2002-09-27 2003-08-25 와이어본딩 장치용 방전전극
US10/671,089 US6818861B2 (en) 2002-09-27 2003-09-25 Discharge electrode for a wire bonding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002282935A JP3727622B2 (ja) 2002-09-27 2002-09-27 ワイヤボンディング装置用放電電極

Publications (3)

Publication Number Publication Date
JP2004119799A JP2004119799A (ja) 2004-04-15
JP2004119799A5 JP2004119799A5 (https=) 2005-07-07
JP3727622B2 true JP3727622B2 (ja) 2005-12-14

Family

ID=32025252

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002282935A Expired - Fee Related JP3727622B2 (ja) 2002-09-27 2002-09-27 ワイヤボンディング装置用放電電極

Country Status (4)

Country Link
US (1) US6818861B2 (https=)
JP (1) JP3727622B2 (https=)
KR (1) KR100559943B1 (https=)
TW (1) TWI267928B (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050067382A1 (en) * 2003-09-26 2005-03-31 Gary Gillotti Fine pitch electronic flame-off wand electrode
JP4974986B2 (ja) * 2007-09-28 2012-07-11 富士フイルム株式会社 太陽電池用基板および太陽電池
EP2435677A4 (en) 2009-05-26 2014-12-03 Inentec Inc REGENERATOR FOR SYNGAS CLEANING AND ENERGY RECOVERY IN CARBURETING SYSTEMS
US20150196977A1 (en) * 2014-01-13 2015-07-16 Camarc Llc Electrode and method changing an electrode to a welding torch
CN107672319B (zh) 2014-01-27 2019-12-31 株式会社日立产机系统 盒式喷墨记录装置
WO2025178200A1 (ko) * 2024-02-22 2025-08-28 국립부경대학교 산학협력단 헬스 케어를 위한 생화학적 센서용 와이어 전극 제조 방법 및 이를 통하여 제조된 와이어 전극을 구비하는 헬스 케어용 생화학적 센서

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61279140A (ja) 1985-06-04 1986-12-09 Sumitomo Electric Ind Ltd Ｉｃボンダ−用放電電極
JP2798515B2 (ja) 1991-02-18 1998-09-17 ローム株式会社 電子部品におけるワイヤーボンディング装置
JPH07263480A (ja) * 1994-03-18 1995-10-13 Shinkawa Ltd ワイヤボンデイング方法及び装置
US5527441A (en) * 1994-05-04 1996-06-18 General Electric Company Welding electrode with flat blade

Also Published As

Publication number Publication date
KR100559943B1 (ko) 2006-03-13
US6818861B2 (en) 2004-11-16
US20040060915A1 (en) 2004-04-01
JP2004119799A (ja) 2004-04-15
TW200405494A (en) 2004-04-01
TWI267928B (en) 2006-12-01
KR20040027312A (ko) 2004-04-01

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