JP3710457B2 - ダイシングシート機能付きダイアタッチフィルム、それを用いた半導体装置の製造方法及び半導体装置 - Google Patents
ダイシングシート機能付きダイアタッチフィルム、それを用いた半導体装置の製造方法及び半導体装置 Download PDFInfo
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- JP3710457B2 JP3710457B2 JP2003145454A JP2003145454A JP3710457B2 JP 3710457 B2 JP3710457 B2 JP 3710457B2 JP 2003145454 A JP2003145454 A JP 2003145454A JP 2003145454 A JP2003145454 A JP 2003145454A JP 3710457 B2 JP3710457 B2 JP 3710457B2
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- film
- adhesive layer
- die attach
- dicing sheet
- attach film
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Images
Classifications
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30105—Capacitance
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003145454A JP3710457B2 (ja) | 2003-05-22 | 2003-05-22 | ダイシングシート機能付きダイアタッチフィルム、それを用いた半導体装置の製造方法及び半導体装置 |
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| JP2003145454A JP3710457B2 (ja) | 2003-05-22 | 2003-05-22 | ダイシングシート機能付きダイアタッチフィルム、それを用いた半導体装置の製造方法及び半導体装置 |
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| Application Number | Title | Priority Date | Filing Date |
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| JP2005199582A Division JP2006054437A (ja) | 2005-07-08 | 2005-07-08 | ダイシングシート機能付きダイアタッチフィルム、それを用いた半導体装置の製造方法及び半導体装置 |
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| Publication Number | Publication Date |
|---|---|
| JP2004349510A JP2004349510A (ja) | 2004-12-09 |
| JP2004349510A5 JP2004349510A5 (OSRAM) | 2005-07-07 |
| JP3710457B2 true JP3710457B2 (ja) | 2005-10-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| JP2003145454A Expired - Fee Related JP3710457B2 (ja) | 2003-05-22 | 2003-05-22 | ダイシングシート機能付きダイアタッチフィルム、それを用いた半導体装置の製造方法及び半導体装置 |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4107417B2 (ja) | 2002-10-15 | 2008-06-25 | 日東電工株式会社 | チップ状ワークの固定方法 |
| JP4283596B2 (ja) | 2003-05-29 | 2009-06-24 | 日東電工株式会社 | チップ状ワークの固定方法 |
| JP4275522B2 (ja) | 2003-12-26 | 2009-06-10 | 日東電工株式会社 | ダイシング・ダイボンドフィルム |
| JP4443962B2 (ja) | 2004-03-17 | 2010-03-31 | 日東電工株式会社 | ダイシング・ダイボンドフィルム |
| JP4650024B2 (ja) * | 2005-02-28 | 2011-03-16 | 住友ベークライト株式会社 | ダイシングシート機能付きダイアタッチフィルム及びそれを用いた半導体装置の製造方法及び半導体装置。 |
| JP2007073647A (ja) * | 2005-09-06 | 2007-03-22 | Sumitomo Bakelite Co Ltd | ダイシングシート機能付きダイアタッチフィルム及びそれを用いた半導体装置の製造方法及び半導体装置。 |
| JP2013004813A (ja) * | 2011-06-17 | 2013-01-07 | Hitachi Chem Co Ltd | 半導体用積層シート、接着剤層付き半導体チップの製造方法及び半導体装置の製造方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2521459B2 (ja) * | 1987-02-23 | 1996-08-07 | 日東電工株式会社 | 半導体チツプの製造方法 |
| JP3280876B2 (ja) * | 1996-01-22 | 2002-05-13 | 日本テキサス・インスツルメンツ株式会社 | ウェハダイシング・接着用シートおよび半導体装置の製造方法 |
| JP2002294177A (ja) * | 2001-03-30 | 2002-10-09 | Sumitomo Bakelite Co Ltd | ダイアタッチフィルム並びにそれを用いた半導体装置の製造方法及び半導体装置 |
| JP4869517B2 (ja) * | 2001-08-21 | 2012-02-08 | リンテック株式会社 | 粘接着テープ |
| JP3912076B2 (ja) * | 2001-11-09 | 2007-05-09 | 日立化成工業株式会社 | 接着シートならびに半導体装置およびその製造方法 |
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| JP2004349510A (ja) | 2004-12-09 |
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